SO-300B Offline Single-Head Selective Soldering Machine
The SO-300B Offline Single-Head Selective Soldering Machine is a compact selective wave soldering system developed for PCB rework, prototype manufacturing, low-volume production and flexible THT assembly.
Selective fluxing and selective soldering are integrated into one offline station. The PCB moves on a programmable XYZ table while the fluxing nozzle and solder pot remain fixed, enabling localized flux application and controlled soldering paths.
Key Features
Integrated Selective Process: Selective fluxing and soldering are completed on one compact offline platform.
±0.1 mm Positioning Accuracy: The XYZ motion system supports accurate and repeatable PCB positioning.
PC Recipe Control: Motion paths, speeds, dwell times, Z height and wave height can be programmed and saved for repeat production.
N2-Assisted Soldering: Inline nitrogen heating supports solder wetting and can help reduce solder dross.
Configurable Solder Nozzles: Five standard nozzles are included, while customized nozzle shapes are available according to solder joint requirements.
Compact Offline Design: Suitable for PCB repair areas, engineering departments, prototype production and installation beside SMT or THT lines.
Manual PCB Handling: Manual loading and unloading support flexible, low-volume and high-mix production.
Working Process
Manually load the PCB into the fixture or motion table.
The PCB moves above the fixed flux nozzle along the programmed path.
The PCB moves above the solder nozzle according to the soldering program.
Manually unload the completed PCB after soldering.
Software Functions
Windows 7-based software in the reference configuration
Scanned PCB image can be used as the programming background
Programmable movement speed and empty movement speed
Programmable dwell time, Z height and solder wave height
Recipe saving for repeatable production
Monitoring of temperature, speed and pressure parameters
Technical Specifications
| Machine Model | SO-300B |
|---|---|
| Machine Type | Offline single-head selective soldering machine |
| Maximum Soldering Area | 300 × 250 mm; customizable |
| PCB Thickness | 0.2–6 mm |
| PCB Edge Requirement | ≥3 mm |
| PCB Loading and Unloading | Manual |
| Operating Height | 700 ±30 mm |
| PCB Upper Clearance | Unrestricted in the reference configuration |
| PCB Bottom Clearance | 30 mm |
| Motion Axes | X, Y and Z |
| Motion Control | Servo motor and stepping motor |
| Positioning Accuracy | ±0.1 mm |
| Flux Nozzle | Selective jet valve |
| Flux Tank Capacity | 1 L |
| Standard Solder Pot | 1 pot |
| Solder Pot Capacity | 15 kg |
| Solder Temperature Control | PID |
| Solder Melting Time | 30–40 minutes |
| Maximum Solder Temperature | 350°C |
| Solder Heater Power | 1.2 kW |
| Standard Solder Nozzles | 5 pcs: ID 4 mm × 3 pcs, 5 mm and 6 mm |
| Nozzle Material | Alloy steel |
| N2 Heater | Standard |
| N2 Temperature Range | 0–350°C |
| N2 Consumption | 1–2 m³/h per nozzle |
| Power Supply | Single-phase 220 V, 50 Hz |
| General Power | 3 kW |
| Operating Power | Approximately 1 kW |
| Machine Dimensions | 1100 × 790 × 1500 mm, including base |
| Net Weight | Approximately 280 kg |
| Required Air Pressure | 3–5 bar |
| Required Air Flow | 8–12 L/min |
| Required N2 Pressure | 3–4 bar |
| Required N2 Flow | >2 m³/h |
| Required N2 Purity | >99.998% |
Typical Applications
Selective soldering of through-hole PCB components
PCB rework and repair
Prototype and engineering sample production
Low-volume and high-mix THT production
Offline soldering beside SMT and THT production lines
Project Confirmation
PCB dimensions, board thickness, component clearance, fixture requirements, soldering point distribution, nozzle shape, flux type, solder alloy, nitrogen conditions and soldering parameters must be confirmed before final machine configuration.
