SO-300 High-Speed Offline Selective Soldering Machine
The SO-300 High-Speed Offline Selective Soldering Machine is a compact single-head selective wave soldering system designed for PCB rework, offline production stations and flexible THT assembly.
Selective fluxing, bottom infrared preheating and selective soldering are integrated into one machine. The PCB moves above the fixed fluxing, preheating and soldering modules through a servo-controlled XYZ motion table, providing accurate and repeatable soldering paths.
Key Features
All-in-One Offline Processing: Integrates selective fluxing, bottom preheating and selective soldering in one compact station.
High Positioning Accuracy: Servo-controlled XYZ movement provides positioning accuracy of ±0.1 mm.
PC Recipe Control: Motion paths, speed, dwell time, Z height, wave height and process temperatures can be programmed and saved.
Live Camera Monitoring: The soldering process can be observed through the camera display on the machine monitor.
Bottom IR Preheating: Standard 3 kW infrared preheater with adjustable heating ratio and a temperature range of 25–240°C.
Nitrogen Management: Inline N2 heating supports solder wetting and can help reduce solder dross under suitable process conditions.
Flexible Line-Side Use: Suitable for manual loading and unloading beside an SMT or THT production line.
Working Process
Manually load the PCB into the machine.
The XYZ table moves the PCB along the programmed fluxing path.
The PCB moves above the bottom infrared preheating module.
The PCB follows the programmed selective soldering path.
Manually unload the completed PCB.
Software Functions
Windows-based industrial PC control interface
PCB image background for soldering path programming
Programmable movement speed, dwell time and empty movement speed
Programmable Z height, wave height and soldering positions
Recipe saving for repeatable PCB production
Monitoring of temperature, speed and pressure parameters
Live soldering process camera display
Technical Specifications
| Model | SO-300 |
|---|---|
| Machine Type | Offline single-head selective soldering machine |
| Maximum Soldering Area | 300 × 300 mm, customizable |
| PCB Thickness | 0.2–6 mm |
| PCB Edge Requirement | >3 mm |
| Loading and Unloading | Manual |
| Motion Axes | X, Y and Z |
| Motion Control | Servo control |
| Positioning Accuracy | ±0.1 mm |
| Fluxing System | Selective jet valve |
| Flux Tank Capacity | 1 L |
| Preheating Method | Bottom infrared preheating |
| Preheating Power | 3 kW |
| Preheating Temperature | 25–240°C |
| Solder Pot Capacity | 15 kg |
| Maximum Solder Temperature | 350°C |
| Solder Temperature Control | PID |
| Solder Melting Time | 60–90 minutes |
| Standard Nozzles | 5 pcs: ID 4 mm × 3, 5 mm and 6 mm |
| N2 Temperature Range | 0–350°C |
| N2 Consumption | 1–2 m³/h per nozzle |
| Power Supply | Single-phase 220 V, 50 Hz |
| General Power | 5 kW |
| Operating Power | 1–3 kW |
| Machine Dimensions | 1220 × 1000 × 1450 mm, without base |
| Net Weight | Approximately 380 kg |
| Required Air Pressure | 3–5 bar |
| Required N2 Pressure | 3–4 bar |
| Required N2 Purity | >99.998% |
| Required Exhausting | 500–800 m³/h |
Typical Applications
Selective soldering of through-hole components
PCB rework and repair soldering
Low-volume and high-mix THT production
Prototype and engineering production
Offline soldering beside SMT and THT lines
Configuration Notice: PCB dimensions, nozzle shape, soldering paths, process temperatures, nitrogen settings and fixture requirements must be confirmed according to the application before final quotation.
