THT AOI (DIP AVI) – Before or after Wave soldering , use high speed in-line AOI solution – Applicable for • Before or after Wave solder THT/DIP component insertion check (DIP through hole component) • Optional: Press-fit inspection ability of pressing parts • Optional: SMD component placement test ability
Typical Defect Types
–Missing / Wrong Components
*Optical shape recognition
*Color and Band Inspection
–Polarity Check
*Electrolytic Capacitors, Resistors & Diodes
*All components w/ text including IC’s (character verification)
*Connectors and other components w/ polarity requirements
–Solder Bridge and Solder Joint
◆Optional inspection functions
–Press-fit Inspection (down to 0.5×0.5mm2)
*Lifted components & Pin shifting (top side)
*Pin invisible & Pin unseated (bottom side)
–SMD Inspection (down to 0603 package)
*Drop / Wrong parts / Polarity check
*Solder bridge
*Missing components (down to 0402 package)
–Label Inspection by OCR
*Missing component
*Polarity check
◆Optional inspection functions
–Surface Inspection (down to 0.5×0.5mm2)
*Board surface inspection (scratch, particle)
*Drop solder / component –Laser Height Detection (down to 0.5×0.5mm2)
*Lifted components & Pin shifting (top side)
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