SDL1000– Smart EMS factory partner

SDL-1000 PCB Strain Measurement Device

SDL series is a compact PCB strain measurement device designed to monitor strain and mechanical stress in printed circuit boards (PCBs). It uses a network of miniaturized strain gauges and sensors embedded directly into the PCB to provide real-time strain mapping across the board. SDL series's low-profile sensors integrate seamlessly into PCB designs without affecting board functionality. The strain data collected by SDL series is wirelessly transmitted to a connected device for analysis. With its integrated sensors, SDL series enables closed-loop analysis of PCB strain during prototyping, qualifications testing, and field use. Its strain mapping capabilities can help engineers optimize PCB designs, prevent failures, and gain insights into PCB structural integrity during operation. The compact size and non-intrusive nature of SDL series make it suitable for integration into space-constrained PCBs across consumer electronics, automotive, aerospace, and industrial applications.

The PCB Strain Measurement Device SDL Series is an innovative tool used to measure strain and stress on printed circuit boards (PCBs). It utilizes strain gauges and Wheatstone bridge circuits printed directly onto the PCB to provide precise quantitative data about the board's mechanical forces.This compact device enables engineers to easily test physical stresses like bending, torsion, and tension that may occur during PCB assembly, transportation, or operation. The strain gauges transform mechanical deformation into change of resistance, allowing stresses to be monitored in real-time.Key benefits of the PCB Strain Measurement Device include:
Directly integrated onto PCB for accurate localized measurements

Small footprint suitable for tight spaces

Cost-effective compared to off-board strain gauge setups
Simple interfacing for data acquisition and analysis
Wide measuring range capable of capturing extreme stress eventsThe PCB Strain Measurement Device delivers an efficient new method to understand and optimize the structural design of PCBs undergoing physical forces. It brings quantitative precision to an area that previously relied on estimated safety margins and over-design.

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