How to make SMT stencil by Laser cutting machine for EMS factory

SMT stencil production process (reference)

General technical requirements:
1. Screen frame: The frame size is determined according to the requirements of the printing machine. Taking DEK265 and MPM UP 3000 as an example, the frame size is 29ˊ
29ˊ, using aluminum alloy, frame profile specification is 1.5ˊ 1.5ˊ.

  1. Stretching the net: Adopt the red glue + aluminum tape method, at the junction of the aluminum frame and the glue, a layer of protective paint must be evenly scraped. At the same time, in order to ensure that the screen has sufficient tension and good flatness, it is recommended that the stainless steel plate be kept 25mm-50mm away from the inside of the screen frame.
  2. Reference point: According to the size and shape provided by the PCB information, the opening is 1: 1, and the translucent is engraved on the reverse side of the printing. At the corresponding coordinates, the entire PCB opens at least two reference points.

  3. Opening requirements: 1.41. The position and size ensure a high opening accuracy, and the opening is strictly in accordance with the prescribed opening method. 1.42. The size of the independent opening cannot be too large, the width cannot be greater than 2mm, and a 0.4mm bridge is required in the middle of the pad size greater than 2mm, so as not to affect the strength of the stencil.
    1.43. The opening area must be centered.

  4. Characters: In order to facilitate production, it is recommended to engrave the following characters in the lower left or lower right corner of the screen: Model; T; Date; the name of the company that made the screen.

  5. Stencil thickness: In order to ensure the amount of solder paste printing and welding quality, the surface of the stencil is smooth and even, and the thickness is uniform. The stencil thickness refers to the above table. The stencil thickness should meet the premise of the finest pitch QFP BGA. If there are 0.5mmQFP and CHIP 0402 components on the PCB, the stencil thickness is 0.12mm; if there are 0.5mmQFP and CHIP 0603 or more components on the PCB, the stencil thickness is 0.15mm;

The opening shape and size requirements of printed tin screen:

  1. General principle: According to the requirements of the IPC-7525 steel mesh design guide, in order to ensure that the solder paste can be smoothly released from the opening of the stencil to the PCB pad, in the opening of the stencil  to view polyester 1. The area ratio / width-to-thickness ratio area ratio is greater than 0.66 2. The mesh hole wall is smooth. Especially for QFP and CSP with a pitch of less than 0.5mm, suppliers are required to perform electro-polishing during the manufacturing process. 3.) With the printing surface as the upper side, the lower opening of the mesh opening should be 0.01mm or 0.02mm wider than the upper opening, that is, the opening is inverted tapered, which facilitates the ineffective release of solder paste and reduces the number of times of cleaning the stencil. Normally, the size and shape of the opening of the SMT element is the same as the pad, and the opening is 1: 1. Under special circumstances, for some special SMT components, the size and shape of the screen openings are specified.
    No. 2 Special SMT component screen opening:

2.1CHIP components: CHIP components above 0603, in order to effectively prevent the generation of tin beads.

2.2SOT89 components: Due to the large pad and small pad spacing between components, soldering quality problems such as tin beads are prone to occur.

2.3 SOT252 component: Because SOT252 has a large pad, it is easy to produce tin beads, and the reflow soldering tension causes displacement.
Look 2.4IC: A. For the standard pad design, PITCH》 = 0.65mm IC, the opening width is 90% of the pad width, and the length is unchanged.
B. For the standard pad design, IC with PITCH <= 005mm, because of its small PITCH, it is easy to produce bridging, the length direction of the steel mesh opening is unchanged, the opening width is 0.5PITCH, and the opening width is 0.25mm.
2.5 Other situations: One pad is too large, usually one side is greater than 4mm, and the other side is not less than 2.5mm, in order to prevent the generation of tin beads and displacement caused by the effect of tension, the mesh opening is recommended to be divided by grid lines In this way, the grid line width is 0.5mm and the grid size is 2mm, which can be evenly divided according to the pad size.

The shape and size requirements of the opening of the printed rubber screen: glue is used for simple PCB assembly. Dispensing is preferred. CHIP, MELF, SOT components are printed through the screen, and IC is used to avoid glue scraping. Here, only the recommended opening size and opening shape of CHIP, MELF and SOT offset printing plates are given.
1. Two diagonal positioning holes must be opened at the diagonal of the stencil. Select FIDUCIAL MARK to open the hole.

  1. The openings are all elongated. Inspection method 1) Visually check that the opening is centered and the net is flat. 2) Check the correctness of the stencil opening through the PCB entity. 3) Examine the length and width of the screen opening and the smoothness of the hole wall and the surface of the steel sheet with a scaled high power microscope. 4) The thickness of the steel sheet is verified by detecting the thickness of the solder paste after printing tin, that is, the result verification. Conclusion The technical requirements for screen design have been tested for a period of time, and the print quality has been well controlled. The PPM of SMT welding quality has dropped from about 1300ppm to about 130ppm. Due to the development of the packaging direction of modern electronic components, higher requirements have also been placed on the design of steel mesh. Is a subject that we need to focus on in the future

 

UIC, EPC-16 or -1316 Boot Sector and BIOS Corruption Procedure for Re-flash

Procedure

 

Symptoms of corrupted BIOS and/or Boot Block:

  • No video signal from the EPC-16 or EPC-1316
  • No activity on
  1. The keyboard, no status lights at power-on
  2. The floppy drive with a disk in or out
  3. The hard disk drive evident by the light off after a certain amount of time
  • The EPC-16 or -1316 is trying to access the CD-ROM drive with failed attempts every second or so.
  • The EPC-16 or -1316 is in this cycle indefinitely

 

Steps to take:

  1. Power down the EPC-16 or -1316 board/machine.
  2. Make sure that this instructions file is opened on a different computer.
  3. At the last step of these instructions is an embedded object of the .zip folder; it contains all of the files needed for this procedure.
  4. Right click on the .zip folder, select ‘Package Object’ and click on ‘Activate Contents’. If a message regarding a trustworthy source is displayed, confirm that this source can be trusted. USE “EPC-16FBD1.00.9” FOR EPC-16 AND “EPC-16FBD1.00.10” FOR EPC-1316.
  5. Create a new folder on the Desktop and rename it to “EPC-16FBD1.00.10”
  6. Click ‘File’, then select and click on ‘Extract All…’
  7. Extract the .zip folder into the folder on the Desktop, created in Step 3.
  8. Obtain a 3.5in Floppy Disk and insert it into the drive.
  9. Open the “EPC-16FBD1.00.10” folder from the Desktop
  10. To run an MS-DOS program, double click on the CRISDISK.BAT file.
  11. To run a Windows Application, double click on the WINCRIS.EXE file.
  12. Go through prompts of the program attentively; and a crisis disk will be created.
  13. Remove the EPC-16 board from the VME chassis/rack.
  14. At the bottom of the board there are 2 x 5 jumper pins: MFG/Flash. (Figure 1)

Figure 1 EPC-1316 Board jumper pin location

EPC1316 BIOS setup 3

  1. See Figure 2 for PIN-out of the Jumper pins.

Figure 2 EPC-1316 Board jumper pin numbering

EPC1316 BIOS setup 1

  1. Using 2 jumpers (Figure 3): place one to jumper pins 4-6. (jumper setting ‘Write Boot Block’)
  2. Place the second to jumper pins 3-5. (jumper setting ‘Force flash recovery’)

Figure 3 EPC-1316 Board flash jumpers configuration

EPC1316 BIOS setup 2

  1. Replace the EPC-1316 board to the VME chassis/rack.
  2. Insert the 3.5in Floppy Disk that was created from the steps above into the floppy drive.
  3. Power-up the machine/chassis/EPC-1316.
  4. If the status light on the floppy drive comes on and stays on, then the floppy disk is being accessed.
  5. When the floppy drive stops accessing the Floppy Disk, wait about 15 seconds, and then remove the disk. ***PROCEDURE ONLY SEEMS TO WORK CONSISTENTLY IF YOU FLASH TWICE. SEE NOTES AT END***
  6. Power down the EPC-1316, and remove it from the VME interface.
  7. Remove jumpers from the board and replace the board to the VME interface.
  8. Power-up the machine/chassis/EPC-1316 and make sure that it boots the operating system.
  9. Refer to UIC procedures for proper BIOS settings/ configuration

 

ANDY’S NOTES

With 3-5 and 4-6 jumpers installed EPC-16 stays in a forced flash write cycle.  The write cycle takes 1 minute 30 secs and then there is a 50 second wait before it starts writing again.  What has consistently worked for me is to do the following:

  1. Install jumpers.
  2. Install EP-16.  No need to connect cabling (you can’t see anything anyways).
  3. Power on machine.  Set timer for 4 minutes. Verify that the activity light on floppy drive starts.
  4. When timer has expired power off machine.  (See Sequence of events below for details.)
  5. Remove EPC-16 card.
  6. Remove jumpers and install EPC-16. Install cables this time.
  7. Configure EPC-16 as per Advanced Support Information in UIC UPS+ support documentation.

 

Sequence of Events during “4 MINUTE TIMER”

  1. 1ST FLASH SEQUENCE – 1MIN 30SEC
  2. WAIT CYCLE – 50 SECS
  3. 2ND FLASH SEQUENCE – 1MIN 30 SECS
  4. CLOSING OF FLASH PROGRAM – 15 SECS

 

Original UIC Knowledge Base states to wait 5 seconds after activity light goes out.  This is not long enough for flash program to complete.

 

If you miss the 50 second window and activity light starts again, wait for light to go out in another minute and 30 then give it another 15 seconds and p

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Automatic Electronic component Lead Cutter Machine for Smart EMS factory PCB assembly

Component Lead Cut by manually?High Labor cost?Quality issue?S-430AC Auto Lead Cutter Machine

Speed: 7200 CPH
Machine Dimension (LWH):720* 720* 900
Cutter Clinch Direction: X axis 400mm * Y axis 280mm * Z axis 100mm * R axis 360°rotation * U axis (manual) 90 °
PCB Size: Min.20mm* 50mm Max. 200mm* 360mm . (Optional 280mm* 380mm)
PCBA Heigth: Max110mm. Optional for other size.
Direction: L to R (R to L)
Machine Weight :100KG
Power Supply: 220V/1.5KW (Energy saving)
Type of pliers: Special pliers for Pneumatic machine
Cutting capacity: Copper wire Max ∮ 3.0mm
MES system: connect production lines to achieve data management (optional)
Extraction part pin method: negative pressure suction container
Shearing capacity: copper wire ∮ 3.0mm or less
(Change different cutting pliers for different wire diameters)
Shearing efficiency: 120 points / min

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X200A Door Frame Infrared Sensor Temperature Detector 2020
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