SMT filter cotton is usually replaced in three months, otherwise it will be blocked, affecting the use effect.
Filter has the following characteristics.
1.Is a high performance and high efficiency filter cotton non-woven processing using organic hot-melt synthetic fiber and;
2, increasing structure, using gradually encrypted multi-layer technology, that is, the fiber density in the direction of pure air will increase gradually, and the higher filtration efficiency can be blocked at different levels of density according to the size of dust, which will more effectively accommodate more dust.
3, efficient filter cotton sticky treatment, filter material after full dipping, because the adhesive penetrated the media completely, so that the dust particles can not pass through, so that the overall filtered air flow evenly diffused, forming laminar flow state, to achieve the best spraying effect.
Does anyone need SMT filter cotton? Factory price.
KE2000 series KE2010 KE2020 KE2030 KE2040 KE2050 KE2060 KE2070 KE2080 KE-3010A KE3010ACL KE3020VA JX series JX-100 JX-200 JX-300LED JX-100LED JX-350 , FX series FX-1, FX-2, FX-3, FX-3R, FX-3RA.
Using nano-aviation materials, through ultra-precision machining and grinding, the nozzle will not wear out and become white. It can be durable.
● our advantages:
Production advantages: the use of close CNC / milling machine, lathe, grinder, line cutting 35 world first-line brand processing equipment, to make Seiko quality. Non-standard nozzles and the workpiece can be quickly customized, 2-3 working days can be delivered, ultra-rush orders can be shipped the same day.
Long-term inventory, a large number of conventional suction nozzle stock, immediately after the order can be shipped, order to reach 1,000 US dollars can be shipped for free
Price advantage: Suction nozzle and SMT placement machines are a variety of peripheral equipment accessories are sold at preferential prices. Truly Seiko quality, the Chinese price, used to repay customers. We only do Seiko quality, low-end high-margin products do not do!
Team advantage: We have a group of 20 years of experience with automatic insertionmachine, SMT machineservice engineer team
Payment advantages: As long as you are a factory customer, we can do monthly payment
Please read the instructions carefully before user operation
First of all, we sincerely thank you for choosing the SMT peripheral automation machine produced by our company. This company specialized production: conveyor, automatic feeding detection machine, vacuum suction machine, stacked on the machine, parallel transfer, angle conveyor, turning machine,machine, double buffer for the same reflow furnace system, a series of automated production machine. According to the customer’s requirements, we can develop and design a series of automation machine, in order to meet the customer’s high efficiency, energy saving, downsizing and other production needs. This manual describes the use of methods and machine maintenance and precautions, in front of the machine, please carefully read this manual, and it will be properly preserved, wrong operation may cause the device does not operate normally or damaged parts. Due to man-made machine failure or parts damage, will not apply to the company’s exemption free warranty service range. Without permission of the company, please do not disassemble or replace the machineparts, nor applicable to the company’s free warranty warranty service range. As to the improvement and partial renewal of the product, we will not make further instructions. If you have any doubts, please contact our company for consultation.
一、Important matters and safety instructions
When using this Cleaning Machine, you must abide by these safety devices.
All attention should be taken to avoid accidents and damage to the instrument.
1. please read and understand the user’s manual carefully before using or operating this machine.
2. non – instrument maintenance personnel and untrained personnel should not use this machine at will.
3. please avoid the use of this machine in the vicinity of the strong electromagnetic interference source.
4. please avoid the use of this machine in the environment with high humidity.
5. maintenance, please turn off the power, to prevent damage to components.
6. instruments are used, they should be kept stable to prevent falling.
1、Liquid storage tank：
When the cleaning liquid is completely unused, the liquid can be added, and the addition method is referred to the addition of the solution step.
After pressing the emergency switch, PLC is out of power and the equipment stops working
Store the cleaned liquid and put out of the liquid in time.
Step: the tank is pulled out, carefully put out the liquid.
1. connect the power supply (220V, 50HZ) and gas supply (0.6MPa), turn on the power switch.
2.Check whether there is a liquid on the left level (the grooves pipe), if it‘s no,then add liquid (detailed please refer the step of adding the liquid).
3. Switch is normal opening , and the touch screen appears as the Figure 3.1 interface
4. Click Figure 3.1 [into system], and appear on the interface, such as Figure 3.2. If you need to set parameters, enter the manual tool interface for parameter settings (detailed please refer the parameter settings).When you set it up, Hit [save parameter].
Note: first use the parameters set first ( refer parameter settings) and then do the next step.
5. When nozzle is placed well,closed the door tightly ,and set the parameters(can skip). Confirm that the suitable angle is adjusted well, that is, the nozzle is aligned with the suction nozzle center, otherwise it can’t be cleaned.
6. Click Figure 3.2 [reversion], then click Figure 3.2 [auto start] (after click finish is displayed as automatic stop) or press the boot button of the device
1. click the [manual tool] as shown in Figure 4.1, as shown in Figure 4.2
Input signal monitor(click the interface of Figure 4.2 [ input and monitor].)
Manual control interface(click the interface of Figure 4.2 [ control debug].)
2. click on Figure 4.2 [parameter settings], appear as shown in Figure 4.5, according to actual needs, set up relevant parameters, click figure 4.5 [bottom parameter], the password is 4 “8888”, and then appear as shown in Figure 4.6.
1) nozzle: set the number of nozzle (according to the jig can install the number of nozzle to set)
2) clean time: setting up a single nozzle cleaning time (according to the actual situation)
3) air-dry time: setting the time to complete the air-dry of a single nozzle (according to the actual situation)
4) save parameter: after setting the complete parameter, you need to click the [save parameter].
1) Original correction: to confirm the suitable angle, that is, the angle of the nozzle and the nozzle center to be rearranged, and the setting is set up.
2) Power on air storage time: set according to the actual situation
3) Air storage time before clean: it refers to the setting of the gas storage time before each cleaning, according to the actual situation.
4) Interval air storage time: express the later that later chose not to select the display as “yes”, For example, the clean time is 3 S, and interval air storage time is set to 1S, after cleaning 1S, gas storage for 1 S, and then clean for 1 S.
5) Impulse quantity: it express the impulse quantity for the turn of the turntable to 1o. If the device is not at its origin, it will increase the impulse quantity if it arrives at the origin. If it is found that the device is not at its origin, if it exceeds the origin, it will increase or decrease.
6) Continuous jet: express choose whether to continue the actual situation as yes” no choice later, shown as “no” is that he has chosen to continue.
五、Adding liquid steps
1. after the start of the machine，enter the standby state and enter the interface shown in Figure 5.1.
2. click [pressure relief] has been holding down the nozzle, until no gas ejected and then release the hand off power.
3. open the tank cover, a funnel into the washing solution until close to the reservoir until canful.
4. closed storage tank cover, power off, re-work.
Note: the cleaning solution will never be allowed to splash into the equipment, otherwise the controller will burn out.
六、Daily maintenance project
the water must be emptied after each use.
the water must be cleaned up on the platform after each use.
check whether there is water leakage in the pneumatic cabinet and electrical cabinet.
check the looseness of the screws in each movement mechanism.
check whether the external electrical connector is loose.
cleaning the dust and debris in the electric cabinet and the pneumatic cabinet.
check the air leakage of the pneumatic components and the joint of the trachea.
check the oil mist special oil in the oil mist is too small, less is added.
check whether the internal joint of the electric cabinet is loose.
check the entrainment wheel, whether the belt wear out.
lubricating grease for all bearings of each device.
3. 2. Installation accessories, required energy and precautions
1) The source pressure is : 0.4Mpa~0.6Mpa
2)Taken the air over diameter for ?: 12mm, a quick joint is needed
3) The top of the equipment is designed ?: The 125mm exhaust port shall be connected to the outside by independent air duct
4) matters need attention: In order to ensure safe production, customers must ensure that the following security measures are installed in place. Otherwise, the company does not assume any responsibility for security
?It is at least 3 meters away from the electric equipment, away from fire source and heat source
?The ground wire must be connected, and the earth shall not be connected to any other electrified equipment
?The exhaust duct of this equipment shall not be connected to any equipment that can produce heat source. (such as reflow soldering wave soldering of SMT, etc.)
3.3 installation space
To facilitate the maintenance and replacement of spare parts for equipment operation, please leave more than one meter space around the equipment
4.0 Operations Guide
A Preparation before operation
4.1.1 connect the air source to the machine, the gas source is connected well, the display lamp is highlighted and the subsequent work can be continued
4.1.2 check if air pressure in the standard rating (04-0.6 MPa) range. Lower than 0.4mpa will affect the cleaning effect and reduce production efficiency (too low will not activate the machine).
Higher than 0.6mpa can result in damage to the mechanical gas system and all parts of the system.
Adjust the pressure method: pull upward gently to adjust the knob and rotate to the right————- Increase pressure
Go to the right ————– reduce stress
After reaching the required pressure, press the adjusting knob, air pressure lock and pressure to complete the gas connection, and the lamp is highlighted
4.1.3 check whether the top exhaust duct is unblocked or unblocked, which will result in damage to the environment and other consequences of the cleaning effect
4.1.4 check the glass viewport of the door panel through the liquid road to check the solvent reserves. The normal state is above the M position, and the machine can meet the various cleaning effects. The amount of liquid stored in this model is the maximum amount (40L).
4.1.5 if the solvent is not enough, please add adding method in time: see adding solvent method
4.1.6 the pump access panel is opened with a randomly attached triangle key to check whether the ball valves are in normal condition
Ball (the ball valve of pump outlet filter) A ball valve D (pump inlet connection of the reservoir fluid Xiang ball valve) opens, B ((the ball) of white PE tube pump discharge ball valve C (white PE tube pump inlet ball valve) closed
4.2 time setting
4.2.1The setting of the cleaning time (see figure below), gently rotate the timer protection cap to the left and pull up the cover.
General cleaning time is
Minutes, depending on the actual situation, will be different.
This timer is measured in seconds (S) with a range of 10-999 seconds (S).
It can be set to 0, otherwise the machine will not start and may damage the timer and other components.
4.2.2 setting of drying time
Operation method and cleaning time setting.
The general drying time is 4-6 minutes depending on the actual situation.There will be an elongation of the aqueous solvents.
4.2.3The cleaning and drying time are automatic reset.
That is, one set, multiple times (N times).
When the pressure is less than the required number, the timer can be reset and the device cannot be started.
At this point, the black reset button on the upper row of the timer can be reset manually.
4.2.4The counter’s use of this counter is the increment counter, each cleaning a steel net, automatically into the system,
One of them is going up.
The count range is 0-999999.
Mainly used for cleaning work statistics, timely replacement of consumables (filter element), etc.
The filter cartridge should be changed when cleaning up to 1500.
Specific visual cleaning products are different and different.
When the counter displays the number to reach the target number, press the 4.2.3 method to open the cover, then press the black reset button on the left of the timer and the counter is reset.
4.3 placement of steel mesh
4.3.1 press the inner door safety button to open the cleaning room
4.3.2 lift the steel net with http://topmednorx.com both hands, gently place the front in the cleaning room chute roller and push it gently forward to the sliding channel steel
Fixed fixture on the net.
The steel net is in the middle of the fixture and chute. The top of the steel net is at the top of the cleaning room
Steel mesh fixture middle.(see below.)
4.3.3 when placing the steel mesh, the steel mesh shall not be in contact with the door to avoid damaging the steel net and sealant
4.3.4After the steel net is placed, close the cleaning door.
The inner door should be kept in good condition, otherwise, the solvent will be expelled outside, causing machine damage or environmental damage, more likely to cause personal injury
4.3.5 after the inside door is closed, continue to close the outer security door.
The security door is closed and the light is on, so that the following operation can be continued.
If the security door is not closed, the lamp will be retracted and the machine will not be able to start.
After closing the door again, the machine can be started
For the last 20 years any odd-form components that did not come pre-packaged have been assembled BY HAND. Any PCB Assembly in today’s market can gain quick advantages by automating their assembly line. Huge costs are spent unnecessarily on labor and import fees.
If you are considering automation of odd-form components in your PCBA, consider these questions:
Does your desired component come available in a package?
Is your lead to hole ratio appropriate for automating?
Is the quality and repeatability of the component suitable for automation?
Does your component require lead preparation prior to insertion?
Does your process require that the component is clinched?
Need help with these questions? Let us know and we will help design your Odd-Form Assembly tailored to your needs!
In 80s the use of far infrared reflow has the characteristics of fast heating, energy saving, stable operation, but because the printed circuit board and various components for different material, color and thermal radiation absorption rate to have very big difference, caused by a variety of different components and different parts of the circuit temperature is not uniform, the local temperature difference. For example, the black plastic package of integrated circuit will be overheated due to the high radiant absorption rate, and the welding part of it will lead to false welding on the silver lead instead of low temperature. In addition, the heat radiation blocked on printed boards, such as welding pins or small components in the shadow parts of big (high) components, will cause poor welding due to insufficient heating.
Full hot air reflow oven is a welding method by which the flow of airflow is forced through a convective nozzle or a heat-resistant fan, so that the welded parts are heated. This kind of equipment began to rise in 90s. Due to the adoption of this heating mode, the temperature of PCB and components is close to the temperature of the given heating area, which completely overcomes the temperature difference and shadowing effect of infrared reflow soldering, so it is widely applied now. In all hot air reflow oven equipment, the convection velocity of the circulating gas is very important. In order to ensure that the circulating gas acts on any area of the printed board, the air flow must have a fast enough speed. To a certain extent, it is easy to cause the jitter of the printed board and the displacement of the components. In addition, in terms of heat exchange, the efficiency is poor and the power consumption is more.
This kind of reflow oven is a more ideal heating method, which is based on the IR oven with hot air to make the temperature even more uniform insaide the oven. The characteristics of this kind of equipment to make full use of the infrared penetration, high thermal efficiency, energy saving, and effectively overcome the temperature difference of infrared reflow soldering and shadowing effect, and make up the influence of hot air reflow on gas flow caused by excessive demand, therefore at international this kind of IR+Hot reflow is used most commonly at present .
With the increase of assembly density and the appearance of fine spacing assembly technology, a reflow oven furnace with nitrogen protection has appeared. Welding under nitrogen protection conditions can prevent oxidation, improve welding wetting power and speed up wetting speed. It is more suitable for uncleaning process to reduce the welding force and reduce welding beads.
2 The establishment of temperature curve
The temperature curve is the curve of the temperature of a point on the SMA will change over time when SMA through the reflow oven. The temperature curve provides an intuitive method to analyze the temperature change of a component during the whole reflowprocess. This is very useful for obtaining the best weldability, avoiding damage to the components due to overheating, and ensuring the quality of the welding.
The following is a brief analysis of the preheating section.
2.1 preheating section
The purpose of this section is to put PCB at room temperature as soon as possible heating, to achieve second specific targets, but the heating rate should be controlled in the appropriate range, if excessive, will produce thermal shock, circuit boards and components may be damaged; if too slow, will not fully solvent, affecting the welding quality. Due to the rapid heating rate, the temperature difference in the rear section of the temperature zone is larger than that in the SMA. In order to prevent the damage of thermal shock to the component, the maximum speed is 4℃/s. However, the normal rise rate is set to 1-3℃/s. The typical heating rate is 2℃/s.
2.2 heat preservation section
The heat preservation section is the area where the temperature rises from 120℃-150℃ to the melting point of the solder paste. Its main purpose is to make the temperature of each element in the SMA stable and minimize the temperature difference.In this area, the temperature of the larger components can have enough time to catch up with the smaller components and ensure that the flux in the solder paste is fully volatile. The oxide of the soldering plate, the solder ball and the pin of the element is removed, and the temperature of the entire circuit board is balanced until the end of heat preservation section. It should be noted that all elements on the SMA should have the same temperature at the end of heat preservation section, otherwise, entering the reflux section will cause various bad welding phenomena due to the uneven temperature of each part.
In this area, the temperature of the heater is set to the highest, which makes the temperature of the component up to the peak temperature. In reflow sectionthe，the different of peak temperature is according to the solder paste to change, the general recommendation for solder melting point temperature plus 20-40℃. For 63Sn/37Pb solder paste with melting point of 183℃ and Sn62/Pb36/Ag2 solder paste with melting point of 179℃, the peak temperature is generally 210-230℃. Reflow time should not be too long to prevent adverse effects on SMA. The ideal temperature curve is the smallest area covered by the “tip zone” of the solder melting point.
As we know,reflow oven is the most important welding technology in surface mount technology. It has been widely used in many industries including mobile phones, computers, automotive electronics, control circuits, communications, LED lighting and many other industries. More and more electronic devices are converted from through hole to surface mount, and reflow oven replaces wave soldering is a obvious trend in welding industry.
So what is the role of reflow oven equipment in the increasingly mature lead-free SMT process? Let’s take a look at the whole SMT surface mount line:
The whole SMT surface mounting line consists of three parts, such as steel mesh solder paste printing machine, SMT machine and reflow oven furnace. For the machine, and compared with lead free, and no new demands on the equipment itself; for screen printing machine, and a lead-free solder paste in the physical properties there are some differences, so put forward some improvement on the device itself, but there is no qualitative change. the key of lead-free is in the reflow oven.
The lead paste (Sn63Pb37) melting point of 183 degrees, if you want to form a good weld must have the thickness of 0.5-3.5um intermetallic compounds in welding, intermetallic compound formation temperature is above the melting point of 10-15, the lead welding is 195-200. The maximum withstand temperature of the electronic device on the circuit board is generally 240 degrees. Therefore, for lead welding, the ideal welding process window is 195-240 degrees.
Because of the change of melting point of lead-free solder paste, lead-free welding has brought great changes for welding process. At present, the lead-free solder paste is Sn96Ag0.5Cu3.5 and the melting point is 217-221 degrees. Good lead-free solder must also be formed 0.5-3.5um thickness intermetallic compounds, intermetallic compound formation temperature is also above the melting point of 10-15 degrees, for lead-free welding, that is, 230-235 degrees. Since the highest temperature of lead-free solder electronic device will not change, therefore, for lead-free soldering, ideal welding process window is 230-245 degrees.
The substantial reduction of process window brings great challenge to ensure welding quality, and also brings higher requirements to stability and reliability of lead-free wave soldering equipment. Because the equipment itself is coupled with the electronic device transverse temperature difference, due to differences in size of heat capacity will produce temperature difference in the heating process, so in the process control of lead-free reflow oven can be adjusted in the process of welding temperature window becomes very small, this is the real lead-free reflow to the difficulty.
The latest introduction of PCB loader/unloader 2017
Characteristics of the equipment.
1.Special aluminum alloy mechanism to better understand the operation status of magazines.
Stable casting platform structure design, improve the stability of equipment 0.3. Panasonic PLC control, multi-function circuit and program design, performance stability, ensure the smooth and smooth production line.
Humanized programming, 4 kinds of PITCH selection, can set the step distance of receiving/transmitting PCB.
Standard SMEMA communication interface, which can communicate with other automation equipment.
The material box shall be transported by the engineering plate.
Adjustable push plate speed control.
Three-point positioning type upper and lower pneumatic clamping, ensure the location of the material box is accurate.
Push plate protection system to ensure that PCB board is not crushed, reducing process loss. This equipment adopts SMT circuit board production line operation
PCB size: (mm)： 50 x50~330 x445
Working height (mm)： 900 + 20 (STD)
groove Change time: bout 6 seconds
The machine size ：1650(L)845（W）1250（H）
Step selection: 10.20.30.40 mm
Power supply: AC 110/220v plus or minus 10V, 50/60hz knife bank
Dimensions (L * W * H, MM) : 355 (L) * 320 (W) * 565 (H)
Air pressure and gas flow : 4-6bar / 10 litres/min
Weight (KG)：140 kg
This equipment is used SMT circuit board production line operating upper and lower plates
Working height (mm):900±20(std)
Tank replacement time: about 6 seconds
Step Select: 10.20.30.40 mm
Power Supply: AC 110/220V±10V, 50/60HZ
Magazine size (LWH，MM):355（L)320(W)565(H)
Barometric pressure and gas flow rate: ４－６bar/up to 10 l / min
If you want to get more product introductions, please contact us: www.smthelp.com
India's LED and Surface Mount Technology market is poised for extensive growth. There is much development, strategic planning, and intelligent decisions to make along the way. But the direction and decisions that key electronics manufacturing players make in India today will speak to a future of leadership in LED Manufacturing as a whole, not just for India but worldwide. The LED market is expected to grow 20% per year and the Surface Mount Industry expected to reach a turnover of $5.42 billion by 2022, that is a CAGR of 8.9% 2017-2022.
Between SLNP (Street Lighting National Project), UJALA (Unnat Jeevan by Affordable LEDs and Appliances for All) which aims to supply domestic LEDs to constituents, and (DDUGJY) Deen Dayal Upadhyaya Gram Jyoti Yojana which is a government plan designed to provide continuous power supply to rural India as well as distribute 27.3 million LED bulbs, there is a green surge of job and business creation that has so far saved 34,239 mn kWh/year and INR13,696 Cr/ year. In addition to relieving the planet of 2,77,33,505 tons CO2/year these measures are creating an urgent demand for EMS and ODM to become extremely serious about urgent planning and implementation. But this implementation doesn't come without careful analysis of suppliers. Reliable suppliers will be poised for optimal supply chains that build smart factories for the future with traceability, full automation, minimization of costs, top quality and reliability with 24 hour technical and automated support.
Key players in the India LED market are ramping up their automation and bringing full factory assembly, including SMT circuit board manufacturing, in house. This model will be ideal moving forward into a globalized, longevity-based model. Self-sufficiency in LED and electronic manufacturing will be a driving force toward complete automation process. Key players are aiming, not for just name brand but for high quality, full support systems in this burgeoning market. Key players include:
Key LED Categories
Philips India Limited
Havells India Limited
Bajaj Electricals Limited
Syska LED lights Pvt. Ltd.
Surya Roshni Limited
Key LED Types
Street lights & Flood Lights
Key LED Categories
Roadways & Area lights
Commercial & Industrial lights
Urgency to ramp up EMS production facilities are in full swing. Even companies like Everready, known for their battery production are ramping up their LED manufacturing segment. Now is the essential time for factories to move forward with plans based on current and future forecasting.
Full line manufacturers in India are poised for great advantages as the world not only moves toward solid state lighting and increased EMS demands. Sample Line up:
The current design approach to PCBs does not fully account for quantifying efforts toward understanding the full scope of what a PCB design project can cost in its totality. It is valuable to consider the methods established to solve this problem proposed by Gollapudi Ramya and M.Anil Kumar in their study "μPCBComplexity" featured in the International Journal of Engineering Research and Applications. These methods are continually being evaluated, yet there is room for establishing an official algorithm for calculating the efforts (time & costs) for PCB design for your factory.
Factors that Contribute to the Complexity of Design Include:
# mixed signal
Total area (mm2)
PCB Size (mm2)
# of sides with components
# of routing layers
# of layers
Productivity Factory (level of designer experience)
Equations to Measure μPCBComplexity:
Whereby ρ is a constant measuring design team productivity, per company/team, inversely proportional to S, the aggregate set of statistics that are weighted by (w) a constant associated with it which assigns a weight to the importance of every statistics used in the model.
Sample Measuring μPCBComplexity:
Finally, the factors that contribute to time and costs loss by not pre-calculating PCB design efforts should be allocated and quantified for best practices of design model systems. Only when we can begin to quantify complexity and relate that to design efforts will we be able to mark a designated expected outcome for cost and time.
THT Dual Sided AOI (DIP AVI) - Before or after wave soldering, use high speed in-line AOI solution – Applicable for • Before or after Wave solder THT/DIP component insertion check (DIP through hole component) • Optional: Press-fit inspection ability of pressing parts • Optional: SMD component placement test ability.
In the next revolution of manufacturing IoT, or Internet of Manufacturing, many adaptions will need to be made in order to reap the benefits of a truly smart factory that optimizes time, work force, efficiency, materials, supplier and full chain data analytics monitoring. But the key benefits that stand to be achieved are a great boost for the electronics manufacturing floor and business model. What do Electronics Manufacturing factories stand to gain from Industry 4.0? Here are some major improvements that can be expected:
Smarter Supply Networks
Intelligent Manufacturing Systems (remote visualization and engineer integration, remote monitoring, alerts, control, and remote production scheduling)
Cloud Storage – secure processing, data storage and sharing on cloud network
Advanced Decisions based on Data Analytics and real time monitoring
Encrypted Technologies to protect against cyber threats
Intelligent Sensors – integrated into machines that communicate on a wireless network that share data and analytics
Smart Maintenance – predictive maintenance, remote monitoring and maintenance
Mobile workforce - Augmented Reality devices for workers to process real-time alerts and information remotely
Cyber physical system of interconnected social machines that work together to improve efficiency
Robotics – use of flexible automated machines that can interact with humans and other machines
Product intelligence – products that carry information for data analytics and decision making
Suppliers in IoT Manufacturing
Some vendors will be more interested in investing in your efforts to elevate to a 4.0 Industry factory by improving systems, using AR/VR/MR technologies to connect you to your machines, providing solutions and plans for upgrading to full automation. But the bottom line is that the trajectory to Industry 4.0 will require automation on every level that can possibly connect to a smart grid system of machine analytics, communications, control, and decision-making.
Solutions like real-time solder monitoring, data exchange formats like XML, and new standards of machine communication, like transitioning from SMEMA to more interconnected methods of SMT communication are on their way. Be prepared to work more closely with vendors based on their preparedness to serve this new model. Many major EMS factories are beginning to test the waters of integration in Industry 4.0. But the one thing that will be required of all future models of Electronics Manufacturing is automation of machine monitoring, engineering, communicating, delivering, and more. Automation is the key component moving us from sluggish manual system of unpredictable output to measurable systems with multiple streams of highly integrative data aimed at top performance decision-making.
At present, LED lighting products, environmental protection and energy saving, cost-effective features have been accepted by the market, while governments have introduced policies, phasing out incandescent, LED in the promotion of indoor lighting applications, LED light industry will become a solution to energy and the environment The term synonyms, LED lighting market rapid development. This rapid development will inevitably involve the LED placement machine, LED production equipment, the rapid development of the field.
First, SMT and placement machine
Surface mount technology (SMT), can also be called surface assembly technology, surface mount technology and patch welding technology. It is a board-level electronic assembly technology that mounts surface-mounted components (SMDs) onto printed circuit boards (PCBs). At present, advanced electronic products, especially in computer and communications electronics, has been widely used surface mount technology.
1.1 Advantages of SMT
SMT is with the development of the electronics industry was born, with the electronic technology, information technology, computer application technology development and development. The rapid spread of SMT benefits from its advantages.
1) components assembly density, electronic products, small size, light weight.
2) easy to achieve automation, improve production efficiency.
3) high reliability. Automated production technology ensures reliable connection of each solder joint, and because the surface assembly components (SMD) is leadless or short lead, and firmly mounted on the PCB surface, so its high reliability, seismic capacity Strong.
4) High frequency characteristics are good. Surface Assembling Components (SMD) No pin or segment pins, not only reduces the impact of the distribution characteristics, but also on the PCB surface welding solid, greatly reducing the parasitic capacitance and parasitic inductance between the lead, so to a large extent Reduce the electromagnetic interference and radio frequency interference, improve the high-frequency characteristics.
5) reduce costs. SMT PCB wiring density increases, reduce the number of holes, the area becomes smaller, with the function of the PCB layer to reduce the PCB manufacturing costs are reduced. Leadless or short lead SMC / SMD saves lead material, omitting thread cutting, bending process, reducing equipment, manpower costs. Increased frequency characteristics reduce RF commissioning costs. Electronic product volume reduction, weight reduction, reducing the cost of the machine. Welding reliability is good, making the cost of rework reduced.
1.2 SMT basic process
(1) SMT is a system engineering technology
(2) a typical SMT production line
1) to form a SMT production line must have three important equipment: printing press dispenser, placement machine, reflow furnace wave soldering machine, which wave soldering this process, with the development of surface mount technology, especially Bottom Lead IC Package BGA QFN a large number of applications, its role becomes more and more inadequate, so the current mainstream or reflow this process.
2) Whether it is for large machine manufacturers or medium-sized machine manufacturers, the classic can recommend SMT production line generally consists of two placement machine, a high-speed placement machine (chip components placement machine) 1 high-precision placement machine ( IC component placement machine), so that their duties, is conducive to the entire SMT production line to play the highest production efficiency. But now the situation is changing, a lot of placement machine manufacturers introduced a multi-function placement machine, making the SMT production line only by a patch machine composition possible. 1 multi-function placement machine to maintain a high patch speed in the case, you can complete all the components of the placement, reducing investment, by small and medium enterprises, Academy of Sciences of all ages.
1.3 The simplest placement machine model
The most basic placement machine consists of rack, circuit board clamping mechanism, feeder (not shown in the figure), patch head, nozzle and X, Y, Z axis, which Z axis in addition to Z can move , And can also be rotated in the θ direction (so as to adjust the rotation angle of the component from the pad).
1.4 LED placement machine
On behalf of the LED placement machine is a surface mount technology (SMT) placement machine in a, with the development of LED technology, the traditional SMT placement machine has been unable to meet the LED industry production needs, LED placement machine It came into being.
LED placement machine is designed specifically for the LED industry, custom SMT placement equipment, used to achieve large quantities of LED circuit board assembly. Equipment requires accuracy is not high, but requires fast speed. LED special placement machine to reduce the cost of patch equipment, and improve production efficiency. At present, many types of LED placement machine, but whether it is automatic high-speed placement machine or manual low-speed placement machine, their overall layout is similar.
Automatic LED placement machine is a computer control, collectors electrical as one of the high-precision automation equipment, by the rack, PCB transmission and bearing organization, drive and servo positioning system, placement head, feeder, optical identification System, sensor and computer control system, which through the suction - displacement - positioning - placement and some other functions, completed the SMD quickly and accurately mounted to the PCB board.
1.5 LED placement machine and the difference between the traditional placement machine
LED placement machine mainly to meet the 3014,2835,3528 and 5050,5630,5730 lamp beads placement accuracy requirements. Relative to the traditional placement machine processing accuracy, LED placement machine requirements are relatively low. But the LED placement machine is more focused on the performance, that is, the stability of the machine running, speed, operability, size requirements, so the requirements of the LED placement machine must have the following design ideas and hard requirements.
1) intelligent means more mature to use to the LED special placement machine, all kinds of excellent performance of the sensor can be implemented in the operation of the full collection of data to the computer disposal to protect the stability of the entire placement process and reliability. At the same time and other equipment, according to the scientific methods and technical specifications, regular LED placement machine maintenance, such as the machine and the circuit board surface dirt cleaning and washing, can effectively prevent the dust and dirt caused by poor internal heat dissipation, Causing overheating burnout devices. LED placement machine has a good stability in order to maximize efficiency for enterprises to produce benefits and reduce production costs.
2) LED placement machine speed must be fast, the minimum 18 000 points / h above the placement speed.
3) easy to learn and user-friendly operation method can greatly shorten the training time, and in the production process to reduce misuse, improve production efficiency and product quality.
4) LED placement machine can be mounted at least 1 200 mm length of the PCB, because a large part of the LED is to replace the traditional light pipe lighting, so the length will greatly exceed the traditional PCB size. In addition to these, in order to ensure that a single LED light board without color, requiring the placement of the entire batch of LED lights for the same color temperature BIN (BIN generally represents the LED lamp beads of some parameters range, different range can be used in different Number, said these parameters include voltage, color temperature, brightness, etc., so there will be voltage BIN, color temperature BIN, brightness BIN this argument, you can use BIN on behalf of the product model).
1.6 China LED placement machine technology development
As a fourth generation of light source of the huge market potential, coupled with the strong support of government policy, the domestic LED lighting industry is almost leapfrog development. From the early LED display hot, to the current transition to LED commercial lighting, interior lighting, outdoor lighting, lighting engineering, LED products from a single hot products, the transition to the field of LED applications and popularization.
LED development led to the relevant equipment industry hot, reflow, wave soldering, printing presses, LED placement machine, LED packaging equipment, the momentum of rapid development. At present, most of the domestic LED equipment can be mounted 1.2 m light board of the small placement machine, basically use the platform movement structure, combined with double swing arm movement, to achieve LED placement. Track LED placement machine in the country less. This is the next step, many enterprises in the development of a direction.
At present, the domestic LED placement machine technology is still in a primary stage. Developed products, can only meet the early needs of some small and medium enterprises. China is an electronics manufacturing power, need different grades of domestic LED placement machine. It must be based on the actual situation preferred models, reduce the difficulty of domestic LED placement machine development, rapid access to the electronic equipment industry.
Second, LED placement machine the most critical technology
In the process of LED placement machine, this technology reflects: the placement of the head through the precise mechanical movement of the components from the feeder to pick out and through the calibration body, the accurate and rapid installation of components to the PCB board The
2.2 visual technology
Take non-stop fast shooting positioning technology, to achieve optical image capture positioning, flight alignment.
2.3 magnetic levitation technology
Can solve the high speed and patch precision motion control technology Magnetic levitation linear motor drive applications, improved the original servo rotary motor screw screws exist low speed, noise shortcomings. Linear motor applications are magnetic levitation technology, no friction when moving, no resistance, high speed, long service life.
2.4 efficient intelligent software technology
With the composition and structure of the placement machine increasingly complex and diversified, the importance of placement machine software technology is more and more reflected. Efficient real-time multi-task parallel processing operating system, intelligent placement process optimization, automatic diagnostic technology is bound to greatly improve the efficiency of production and product quality.
2.5 modular and system integration technology
The purpose of modular and system integration technology is to propose optimized and improved solutions for the three basic requirements of speed, accuracy and flexibility of LED placement machines. Flexible modular technology emphasizes the portability, interoperability, scalability and configurability of the device, providing a reconfigurable and openability of the device control platform to control requirements, enabling simple and efficient construction and completion of specific requirements Surface mount equipment to improve assembly productivity.
2.6 Motor uses lightweight design concept
Can significantly reduce the weight of the machine part of the movement, which makes the operation of the machine when the power consumption is also significantly reduced to only 1/4 of the ordinary placement machine consumption, power consumption up to 1/4 of the ordinary placement machine; LED placement machine The placement accuracy is not demanding, but requires faster. At present, the domestic professional for the LED placement machine, there are several to do, according to the speed can be divided into four different, six, eight equipment, you can refer to Taimu Rui LED640, LED660 V and LED680 V several LED special stickers The actual understanding of the machine. The middle of that number represents the number of patch head number. The higher the number, the higher the speed. LED placement machine mainstream applications should be able to mount a large area of the PCB board, to meet the requirements of the online, so as to ensure the speed.
Third, LED placement machine development trend
LED placement machine in the manufacturing process plays a very important role in contemporary mainstream electronic assembly technology production equipment in the largest investment, the most technologically advanced, SMT production line production capacity and production efficiency of the largest equipment. In fact, the most failures, the speed bottleneck is largely from the patch of this process, so the development of placement machine equipment is the most compelling. Currently has the number and advanced level of placement machines, has become a business, regional or national electronic manufacturing capacity of the key signs. Here the development trend of the current placement machine described below.
3.1 LED placement machine is moving towards higher precision
Mounter accuracy refers to the placement machine X, Y-axis navigation movement of the mechanical precision and Z-axis rotation accuracy. Mounter using sophisticated mechanical and electrical integration technology to control the mechanical movement of the components from the feeder to capture and through the calibration mechanism after the precision and reliable placement to the circuit board. In order to produce products with higher performance, the first major challenge is to improve the placement accuracy of the placement machine. The following from the LED process began to say with a more accurate LED placement machine may be the future of LED production of the revolutionary impact.
In the ordinary LED packaging technology, the chip electrode with the support of the pin is generally connected through the gold wire to achieve the way, but the golden wire break has been one of the common causes of failure. LED lighting applications in the gold line is the cause of dead lights and light failure of such a common problem of the culprit. Dead lights can be divided into two cases, one is completely not bright, the other is hot state is not cold or bright, or flashing. The main reason for the absence of electrical circuit is open circuit, the reason is because the gold wire Weld or poor contact.
With the introduction of flip-chip welding technology, the two can be connected through a more stable metal bumps to connect, save costs and greatly improve the reliability and cooling capacity. LED has a long life and other advantages, with the flip-chip technology than the traditional use of gold wire interconnect packaging technology to play the advantages of LED, LED flip-chip welding technology to achieve a single chip and multi-chip module without gold Solid crystal plastic packaging, with high brightness, high light efficiency, high reliability, low thermal resistance, good color consistency and many other advantages.
LED non-gold line package that the industry commonly known as "no package" "free package." This process is the use of flip chip and circuit board direct SMT paste, the SMD package process omitted, directly flip the chip with SMT method to fit on the circuit board or carrier, because the chip area is much smaller than the SMD device, so This process requires a very sophisticated design.
The future of LED placement machine to improve the accuracy of the basic conditions, the direct use of flip-chip package without the process, which will be a small revolution LED process, you can save a lot of packaging costs, and greatly improve the production costs and shorten the production cycle, Making LED products really high performance and low price to enter the general lighting market. The LED placement machine directly to the LED process, great potential to become the future trend of technology.
3.2 LED placement machine is developing in the direction of high efficiency
One of the most important features of today's society is competition. It is this competition that inspires people to explore innovation; it is this competition that promotes the ever-changing development of science and technology. Driven by the LED lighting market in full swing, LED placement machine's efficient work must become the core competitiveness of the embodiment. High efficiency is to improve production efficiency, reduce working hours, increase production capacity, and create economic benefits. On the basis of the current efficiency of the main methods are: to strengthen the LED placement machine automation performance and improve the equipment structure and work mode.
3.2.1 to strengthen the LED placement machine automation performance
The development and perfection of information science and technology today has greatly promoted the level of automation, such as automatic control, automatic adjustment, automatic compensation, automatic identification and so on to self-learning, self-organization, self-maintenance, self-repair and other higher level of automation become possible. At the same time for the placement of this automated CNC equipment, the efficiency of software programming to improve the efficiency of equipment is also essential to develop a more powerful software function system
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