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S-PI7001 Selective 3D SPI Systems for PCB Assembly Inspection – Smart EMS factory partner

S-PI7001 Selective 3D SPI Systems for PCB Assembly Inspection

The S-PI7001 Selective 3D SPI Systems for PCB Assembly Inspection is a cutting-edge product designed to provide high-quality inspection of printed circuit boards (PCBs) during the assembly process. This system is equipped with advanced 3D imaging technology that allows for precise and accurate inspection of PCBs, ensuring that they meet the highest standards of quality and reliability.

The S-PI7001 Selective 3D SPI Systems for PCB Assembly Inspection is designed to be easy to use, with a user-friendly interface that allows for quick and efficient operation. The system is also highly customizable, with a range of settings and options that can be tailored to meet the specific needs of each individual user.

One of the key features of the S-PI7001 Selective 3D SPI Systems for PCB Assembly Inspection is its selective inspection capabilities. This system is able to selectively inspect specific areas of a PCB, allowing for targeted inspection of critical components and areas of concern. This helps to ensure that any potential issues are identified and addressed before they can cause problems down the line.

The S-PI7001 Selective 3D SPI Systems for PCB Assembly Inspection is also highly accurate, with a resolution of up to 10 microns. This level of precision allows for even the smallest defects and imperfections to be detected, ensuring that the final product is of the highest quality.

Overall, the S-PI7001 Selective 3D SPI Systems for PCB Assembly Inspection is an essential tool for any PCB assembly operation. With its advanced technology, user-friendly interface, and selective inspection capabilities, this system is sure to provide reliable and accurate inspection results every time.


Automated optical inspection machine (AOI) is a new type of testing technology. It has developed very rapidly in recent years. The structure of AOI consists of four parts: workbench, CCD camera system, electromechanical control and system software. When testing, firstly, the circuit board to be tested is placed on the workbench of the AOI machine, and the detection procedure of the product to be detected is called out through positioning. The X/Y workbench will send the circuit board under the lens according to the command of the setting program. With the help of the special light source, the lens will capture the image required by the AOI system and analyze it, then the processor will move the lens toward the lens. The next position is collected for the next image and then analyzed, and the image is subjected to continuous analysis and processing to obtain a higher detection speed. The process of AOI image processing essentially digitizes the extracted image, and then compares it with the pre-stored “standard”. After analysis and judgment, it finds the defect to make a position prompt, and at the same time generates image text, and the operator further confirms or sends the repair station. Overhaul.

Why Use AOI ?

AOI plays a full role in the miniaturization, high-density, rapid assembly, and diversified development of SMT. The amount of information detected is large and complex, both in terms of real-time detection and feedback, and in the analysis and diagnosis of correctness. The era of manual visual inspection is gone forever. The intelligent development of AOI technology is bound to become an inevitable development trend.

Automated optical inspection S-AO600C AOI machine for PCB Assembly Inspection.


Detection applicationApplicable processSolder paste before and after SMT reflow, before and after DIP wave soldering
Programming modeManuor ,auto written, CAD data import automatic corresponding component library
Detection typeSolder paste printing: presence, offset, less tin, more tin, open circuit, even tin, pollution, scratches, etc.
Defects in parts: missing parts, multiple pieces, offsets, skews, tombstones, sideways, flips, wrong parts, breakage, reverse, etc.
Solder joint defects: more tin, solder, tin, solder balls, glue, pins not exposed, copper foil contamination.
Calculation methodColor calculation, color extraction, grayscale calculation, image contrast, etc.
Detection modeOptimized inspection technology covering the entire board, jigsaw and multi-mark, including Bad mark function
SPC Statistical functionRecord test data and perform statistics and analysis throughout, and view production status and quality analysis in any area
Component angleSupport 0~359° rotation, minimum 1° angular distance
Mini Component15um/Pixel:01005 chip、0.3 pitch IC
Optical configurationCameraFull color high speed industrial digital camera
Lens resolution10um/15um/18um/20um/25um
Light sourceRing stereo multi-channel color light, depending on application selection RGB/RGBW/RGBR/RWBR
ComputerCPUIntel core
OSWin XP 32bit
Monitor22 inches(Top door),16:1022 inches,16:10

Machine systemTransmission and detection methodsAuto,L-R/R-L,                                                                       Stepper motor to transport PCB and widen track,                                                   XY servo motor drive camera take pictureManual,                                                                      Y servo motor move PCB,                                                      X servo motor drive camera take picture
PCB Size50*50mm(Min)~400*360mm(Max)20*20mm(Min)~460*350mm(Max)
PCB Thickness0.3~5.0mm
PCB WeightMax:3KG
PCB Margin3mm,(can custom made)
PCB Curvature<5mm or 3% of PCB diagonal length
PCB Component HTop:35mm,Bottom:75mm。Adjustable
XY Drive SystemAC servo motor, precision ground ball screw
XY Moving speedMax:830mm/s
XY positioning accuracy≦8um
ParameterDimensionL980 * W960 * H1600 mmL900 * W1100 * H1400 mm
PCB Conveyor Height900±20mm820±20mm
Communication PlugSmema
Air Supply0.5MPa,(Optional power distribution control)No use
CertificationMeet CE safety standards
Ambient temperature and humidity10~35℃,35~80% RH(No condensation)

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