Specification：
Model :S-500G
PCB Size：350X300MM
Tin capacity :80 KG
Speed is adjustable Solder Dwell heigh：0-70mm
Solder Dwell Time：1-10 sec
Temperature control using PID control Temperature range: 0-450 ℃
Preheat time: 0-120 s
Automatic removal cycle: 11 s
Dip soldering cycle: 16 s
Tin furnace, furnace adopts 316 stainless steel titanium (selected), ground temperature by K type thermocouple
Tin stove height：50-60mm
Solder Pot Size: 400 * 340 * 80 mm
Overall Dimensions: 700 * 750 * 620 mm
Weight: 75 kg
Power Requirements：220V, 50/60 Hz,3.6KW
Consumed power: 1-2KW/H
