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PC Board Design Checklist

2023-02-09 17:51:22

 

For Through Hole Components

This document should be used as a supplement to existing machine General Specifications and IM Design Guidelines.  This document is designed as a checklist rather than a reference for use when examining an existing or new product.  For detailed specifications refer to the appropriate General Specification.

 

PC board considerations

For Axial or Radial auto insertion:

 

Possible challenges:

Radial can accept boards from 0.032” to 0.093” thick with no set up change, axial machines require mechanical adjustment to handle thickness variations.

Possible challenges:

Non-contiguous edges, may work but requires testing.  Example, instrument cluster.

Possible challenges:

Warpage can cause issues with insertion as well as clinch angle/length, especially on radial machine.

Possible challenges:

If product was previously hand assembled it may not have locating holes.

Possible challenges:

Sometimes components are arranged at odd angles because of space constraints or because designer wanted to keep component body straight.  (example: ECCO board.)

Possible challenges:

Boards currently hand assembled are most likely to have undersize holes.

Note: Universal does not specify required clearance to prevent solder bridging, this should be determined by the customer.  However, obvious cases of conflict should be noted.

 

Component and tooling considerations

 

Axial

Possible challenges:

Customer may have “sample” components in bulk, are these components readily available in a taped format?

Possible challenges:

Universal does not offer a machine that can accept 26mm input.  Virtually all components are available in 52mm format, however, a subcontractor may have to deal with “kits” from an OEM that contain 26mm components.

Possible challenges:

Does the product include both very wide and very narrow span components?  Use tooling selection matrix to evaluate best tooling fit.

Possible challenges:

Be especially careful when moving product from hand assembly to automatic assembly.

Possible challenges:

Watch out for very thick boards and/or large diameter components.

Possible challenges:

May have to sacrifice (to hand assembly) some insertions at either the large end or the small end of the spectrum.

Possible challenges:

“Stand-off” type resistors are more common where high power handling is required, power supplies, monitors, etc.

 

Radial

Possible challenges:

Customer may have “sample” components in bulk, are these components readily available in a taped format?

Possible challenges:

Radial taping specifications are quite involved, use “quick check” list as a sanity check, forward component samples to applications group for detailed evaluation.

Possible challenges:

1)    May have to “sacrifice” some components to hand assembly because of tooling footprint issues or span requirements.

2)    Some PCB’s contain components are non-standard span’s, i.e. 2.0mm, 4.0mm.

Possible challenges:

Board designer may “require” a certain type of standoff without checking to see if the package is readily available, common with LED applications.

 

Notes:

1)  The simplified guidelines were created to draw attention to the most common areas where components fall outside the limits for auto insertion.  These simplified guidelines should only be used as a general guide.  Component input must meet all criteria called out in the Radial General Specification.

2)         Tooling selection will depend upon insertion span requirements as well as board density considerations.     Muniak98-052B  Revised 01-00

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