How to print soldering flux on the bottom pad of BGA

How to print soldering flux on the bottom pad of BGA

In general, Use flux soldering of high viscosity, to splice and process, should ensure that the printing pattern is clear, the overflow flux.

Sometimes,solder paste can be replaced by solder paste, and the metal component of solder paste should be matched with the metal component of solder ball.

When printing, BGA special small template is used. The thickness and opening size of the template should be determined according to the ball diameter and the ball distance.

After printing, the printing quality must be checked. If it is unqualified, it must be printed again after cleaning.