| Item | HAD 812 plus | HAD8613-A | GTS T100BH-PA |
|---|---|---|---|
| Use for | semiconductor products | mini chip | LED products |
| Accurancy | ±20μm | ±10μm | ±25μm |
| Angle Available | 0° | 0° and 90° | 16 angles can be set |
| Angle accurancy | ±1° | ±1° | ±3° |
| Crystal expander | Auto | Auto | No (need to buy an independent crystal expander) |
| Crystal absorbing swing arm system(die bonder head) | Linear | Linear (first head) Voice coil motor(second head) | swing robot arm(high speed,low accuracy) |
| Die bond pressure | 30-300g | 30-250g | 30-250g |
| qty of die bonder system | 1 head | 1.one head for crystal absorbing 2.place in angle calibration platform 3.the other head absoring the chip with 0° or 90°, and finish the die | 2 independent die bonder system( two models can be died in the same time) |
| Cycle time | 211ms | 1200ms | 42ms |
| chip size | 15*15-200*200mil | 3*5-120*120mil | 3*3-80*80mil |
| Max wafer ring size | 12" (iron ring) | 8" (iron ring) | 6" (plastic ring) |
| Max chips area | 9.12" | 7.6" | 4.7" |
| Die workbench XY Resolution | 0.04mil(1μm) | (Screw rod with servo motor, without reading head) | 0.04mil(1μm) |
Grey Scale Image Resolution Image Recognition Accuracy | 256 Level Hrey 720×540 Pixels ±3μm @50mil | 256 Level Hrey 720×540 Pixels ±3μm @50mil | 256 Level Hrey 720×540 Pixels ±3μm @50mil |
| Thimble Z axis stroke | 3mm | 2mm | 2mm |
| Item | HAD 812 plus | HAD8613-A | GTS T100BH-PA |
|---|---|---|---|
| PCB holder size | Length:100-300mm Width:25-110mm | Length:100-260mm Width:60-150mm | Length:120-17-mm Width:40-75mm |
| Overrall size(L*W*H) | 2290*1400*1460mm | 1600*1420*1840mm | 1700*1000*1800mm |
| Loading Workbench | XY Resolution:0.04mil(1μm) | XY Resolution:0.02mil(0.5μm) | XY Resolution:0.02mil(0.5μm) |
