How to layout EMS smart SMT production line for Industrial 4.0

Main content of lean factory design
The traditional way of plant layout begins with equipment and tooling, and finally considers the flow of processes. Unlike traditional factory layouts, lean factory design layout begins with the customer and then designs the process flow around the workforce.
Lean factory design should comprehensively apply the knowledge of lean production ideas, system engineering, enterprise management, etc., and use parallel technology, information technology and other means to determine the factory design plan that meets the requirements of lean production concept. The main design contents are as follows:

(1) Production line layout based on lean thinking
The design of the best production line must be independent of the current legacy workflow and should reduce or eliminate large amounts of moving time for products and materials. According to the assembly requirements, placing the part loading process on the assembly point where the material of the production line is consumed will reduce the movement and waiting time.

(2) Lean logistics system design
According to the lean production point of view, logistics is not a value-added link. Therefore, the goal of lean logistics system design is to minimize the logistics and strive to minimize the waste in the logistics process while meeting the production requirements. To break the limitations of the profession, try to set up and no intermediate inventory area, and completely follow the process flow layout. All ideas that minimize the amount of movement and optimize the flow of the product should be tested. Ultimately, a practical and appropriate approach should be taken to finalize the production line in order to maximize the benefits of the production process. .

(3) Lean selection and arrangement of equipment
It is necessary to fully consider the relationship between the various production links, and on the basis of realizing the capacity requirements, try to achieve a balanced production capacity and reflect the idea of ​​lean flow. At the same time, the choice of equipment is not based on the most advanced standards, but the small size, low investment, flexibility and other indicators are put in the first place, in order to meet the needs of flexible production in the future.

(4) Lean staffing
Traditional factories use the “scheduled system” staffing, but this method increases the cost of the enterprise and reduces the response speed of the enterprise under the multi-variety and small-batch production methods. Lean factory design, it is recommended to use the least staff to achieve the same production needs, through the training of employees, so that it has a variety of skills, so that with the change in production, flexible arrangements for operators.

(5) Lean selection of auxiliary equipment
Although the fixtures and tools required for production assistance are not resource equipment, they must be considered for lean production. It must be designed to accommodate the movement of the required materials, such as the passage of the automatic loading and unloading trucks and large material containers. It is necessary to design the station to be more compact, but at the same time, the operator should be considered to be as ergonomic as possible.

In addition, the design of the lean factory should also include the planning of the public facilities of the factory, the design of the information system, etc., and should be carried out according to the specific needs of the factory and the actual situation of the enterprise.
The goal of lean plant design is to minimize waste and overload in the work process while enhancing visual communication on site.




An Analysis of SMT Solder Paste Printing Defects

An Analysis of SMT Solder Paste Printing Defects

In SMT PCB production, solder paste printing is a critical step. Since the solder paste is used to directly form the soldering joint, the quality of solder paste printing affects the performance and reliability of the surface mount assembly. Quality solder paste printing guarantees a quality solder joint and final product. Statistics demonstrate that 60% to 90% of soldering defects are related to solder paste printing defects. So it is very important to understand what causes defects in solder paste printing.
ItemFactorsAnalysis1Solder PastePowder formationThe irregular shape of solder powder will easily clog stencil apertures. This will cause a big slump after printing. It can also cause solder ball and short bridge defects after reflow.

A spherical shape is best, especially for fine-pitch QFP printing.Particle SizeIf the particle size is too small, the results will be poor paste adhesion. It will have a high oxygen content and cause a solder ball after reflow.

The particle size should be controlled to about 25 ~ 45 μm in order to meet the requirements for fine-pitch QFP soldering, If the partical size desired is 25 to 30 μm, it should applied with less than 20 μm solder paste for an ultra fine-pitch IC.FluxFlux contains a thixotropic agent, which allows the solder paste to have pseudoplastic flow characteristics. Since the viscosity decreases when the paste passes through the stencil apertures, the paste can be applied to the PCB pads rapidly. When the external force stops, the viscosity will recover to ensure no deformation occurs.

The flux in the solder paste should be controlled to between 8 and 15 percent. A lower flux content will result in excess amount of solder paste applied. Conversely, a high flux content will result in an insufficient amount of solder applied.2StencilThicknessA stencil that is too thick will cause a solder bridge short.

A stencil that is too thin will cause an insufficient solder to be applied.Aperture sizeWhen the stencil aperature size is too big, a solder bridge short can occur.

When the stencil aperature size is too small, and insufficient solder paste will be applied.Aperture shapeIt is best to use a circular-shaped stencil aperture design. Its size should be slightly smaller than the PCB pad size, preventing a bridging defect during reflow.3Printing parametersBlade Angle Speed & PressureThe blade angle affects the vertical force applied on the solder paste. If the angle is too small, the solder paste will not be squeezed into the stencil apertures. The best blade angle should be set around 45 to 60 degrees.

A higher the printing speed means that less time will be spent in applying the solder paste through the stencil aperture surface. A higher printing speed will cause insufficient solder to be applied.

The speed should be controlled to around 20 ~ 40 mm/s.

When the blade pressure is too small, it will prevent the solder paste from being cleanly applied to the stencil.

When the blade pressure is too high, it will result in more paste leakage. The blade pressure is typically set at about 5N ~ 15N / 25mm.4Printing process controlPCB moistureIf the PCB moisture is too high, the water under the solder paste will quickly evaporate, causing the solder to splash and creating solder balls.

Dry the PCB if it was fabricated over 6 months ago. The recommended drying temperature is 125 degrees for 4 hours.Paste storageIf the solder paste is applied without a temperature recovery period, the water vapour in the surrounding environment will condense and penetrate the solder paste; this will cause the solder to splash.

Solder paste should be stored in a refrigerator at 0 to 5 degrees.Two to fours hours before use, place the paste in a normal temperature environment.



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principle of PANASONIC-MV2V(C-F-B) component recognition (1)

An article to let you know the principle of PANASONIC-MV2V(C/F/B) component recognition

An article to let you know the principle of PANASONIC-MV2V(C/F/B) component recognition.

Edited by ming Gan, please contact for more information.

principle of PANASONIC-MV2V(C-F-B) component recognition (1)
principle of PANASONIC-MV2V(C-F-B) component recognition (1)
principle of PANASONIC-MV2V(C-F-B) component recognition (2)
principle of PANASONIC-MV2V(C-F-B) component recognition (2)
principle of PANASONIC-MV2V(C-F-B) component recognition (3)
principle of PANASONIC-MV2V(C-F-B) component recognition (3)
principle of PANASONIC-MV2V(C-F-B) component recognition (4)
principle of PANASONIC-MV2V(C-F-B) component recognition (4)
principle of PANASONIC-MV2V(C-F-B) component recognition (5)
principle of PANASONIC-MV2V(C-F-B) component recognition (5)

1 program composition
1) NC PROGRAM: Z-axis components are placed at X, Y positions at θ angle
2) PCB PROGRAM: substrate length, width, thickness and PIN spacing
3) ARRAY PROGRAM: Z specified components
4) PART LIBRARY: Component Information
5) MARK LIBRARY: tag information
1) File name: P [0-9, A-Z, +, -,.]
2) X, Y coordinates
3) Z No: ZA+ZB, K TYPE and Q TYPE, in single and double FEEDER at 8mm width
The difference between K TYPE and Q TYPE: * PIN, no PIN
* PITCH: K-21.5mm Q-20mm
* ORG: FULL is 1, K-Z1, Q-Z2 when HALF
FEEDER: HALF must be used when mixing single and double
Z No: Single input K TYPE: Product number, Q TYPE: Even
4) θ angle: θ1, θ2 two, θ3 origin return
Θ1:0° 90° 180° 270°
Θ2: [set angle – θ1] + correction angle Reverse time is –
On time is +
6) NO MOUNTING: 0-normal patch, 1-non-patch
7) SKIP BLOCK: 0 – unconditional execution, 1 to 9 – conditional jump, 7 – unconditional jump
8) MARK: 0 – no MARK, 1 – individual MARK, 2-PCB MARK, 3-PATTERN MARK
9) LAND TEACHING: 0-NO, 1-LAND TEACHING [Recommended for the second leg of each side]
11) PROGRAM OFFSET: X=, Y=, move the first point of the patch to the camera center
The machine automatically finds PROGRAM OFFSET
12) Z ORG is normally 1 and Z No can be set
* NC PROGRAM sequence
1) File name: P [0-9, A-Z, +, -,.]
2) Z No: Fixed cannot be changed
3) SHAPE CODE: shape coding [machine]
4) PARTS NAME: component name [person]
6) MASTER Z No.: master, slave Z axis
1) File name: P [0-9, A-Z, +, -,.]
2) X: PCB length
3) Y: PCB width
4) T: PCB thickness [NO USED]
5) Whether the PIN is used: 0-not used, 1-automatic adjustment
6) Hole spacing: X-10
7) Conveyor speed: 1[H]~8[L] speed, X, Y table speed when fully automatic control
1) SHAPE CODE: shape coding,
X, Y: MARK size
PCB material: 0-copper foil, 1-solder
PATTERN: shape
TYPE: 0-shade, 1-binarization
1) Shape coding: SHAPE CODE [, 0-9, A-Z, +, -,.]
2) Component type CLASS: 1 to 99 [1 to 19 transmission recognition, 20 to 99 reflection recognition]
Reflection recognition: blue light is absorbed on the orange reflector, and the surface of the component is reflected [Figure A]
By recognizing: the white light of the halogen lamp shines on the orange reflector, and the reflector reflects the light.
Depending on the component, the edge of the component is reflected to the camera [Figure B]
* High reflection recognition accuracy, high passability through recognition, LED off when used
* For identification θ: CHIP angular deviation > 35° NG, QFP angular deviation > 25° NG
TYPE: For component color, normal condition is 1 [black best]
3) SHUTTER [Shutter]: 0-on, 1-in [Generally open]
Closed left and right to ensure component identification [Figure D]
4) Component dimensions SIZE: up, down, left, right
Hand-drawn tape to see the reverse side of the component is the same as the camera [Figure C]
5) Component thickness THICKNESS: T-component body thickness
6) Thickness tolerance TOL: T<1 is 20% T≥1 is 15%
7) HEAD SPEED: 1[H]~8[L] X, Y TABLE SPEED: 1[H]~8[L]
9) CAMERA: 0-S, 1-L
10) Component feed direction FEED DIRECTION: 0 to 7, 45° interval
11) Packing method: 0-PAPER [including 32mmPEELING] 1-EMBO