Acceptability for Electronic Assemblies : connector pins
.Pins are straight,not twisted and properly seated.
.No discernible damage
1.No discernible damage
3.No discernible twist
.Pins are slightly bent off center by 50% pin thickness or less.
.Pin height varies within tolerance.
Nominal height tolerance is per pin connector or master drawing specification.The connector pins and mating connector must havea good electrical contact.
1.Pin height tolerance
2.Less than 50% pin thickness
.Less than or equal to 75% of the width(W) of the annular ring is lifted.
.Damaged nonfunctional lands for single and double-sided boards are acceptable if firmly attached to board in unlifted areas.
1.Land lifted 75% of annular ring or less
2.Land with conductor
3.Land not fractured
4.Land lifted,fractured but firmly attached land with out conductor (nonfunctional)
Any functional annular ring which is lifted more than 75% of the width(W).
Any lifted or fractured annular rings with press fit pins.
2.Functional land lifted greater than 75% of annular ring
Pin is bent out of alignment.(Pin is bent off center greater than 50% pin thickness.
Pin visibly twisted.
Pin height is out of tolerance as to specification.
Damaged pin as a result of handling or insertion.
Damaged pin (exposed basis metal).
Press Fit Pins-Soldering
The term “press fit pins” is generic in nature and many types of pressure inserted pins,e.g. connector,staked,etc.,are not intended to be soldered,if soldering is required the following criteria is applicable
.A 360 solder fillet is evident on the secondary side of the assembly.
.Note:Solder fillet or fill on primary side is not required.
Solder fillet or cover age (secondaryside) is present on two adjacent sides of the pin.
Solder wicking is permitted above 2.5mm[0.0984in] on sides of pins provided there is no solder build up which interferes with subsequent attachments to the pin.
Solder wicking on sides of pins is less than 2.5mm[0.0984in], provided the solder does not interfere with subsequent attachments to the pin.
Solder fillet or coverage is evident on less than two adjacent
sides of the pin on the secondary side.
Solder fillet is evident on less than four sides of the pin on
the secondary side.
Solder build up interferes with subsequent attachments to the pin.
Solder wicking exceeds 2.5mm[0.0984in].
.Chip on nonmating surface of separable connector pin
.Burnish on mating surface of separable connector pin,providing that plating has not been removed.
.Chip that encroaches the mating surface of separable connector pin which will not be in the mating connector contact
A.Sheared/nonmating surface of connector pin
B.Coined/mating surface of connector pin
Chipped pin on mating surface of separable connector
Scratched pin that exposes nonprecious plating or base metal.
Missing plated on required areas.
Burr on pin
Cracked PCB substrate.
Pushed out barrel as indicated by copper protruding from bottom side of PCB.