[embeddoc url=”https://www.smthelp.com/wp-content/uploads/2020/11/A-difference-between-SME-800-Electric-Stencil-Cleaner-and-SME-750-Pneumatic-Stencil-Cleaner-1.doc” download=”all” viewer=”microsoft”]
[embeddoc url=”https://www.smthelp.com/wp-content/uploads/2020/05/SMT-stencil-laser-making-machine.pdf” download=”all”]SMT stencil production process (reference)
General technical requirements:
1. Screen frame: The frame size is determined according to the requirements of the printing machine. Taking DEK265 and MPM UP 3000 as an example, the frame size is 29ˊ
29ˊ, using aluminum alloy, frame profile specification is 1.5ˊ 1.5ˊ.
Reference point: According to the size and shape provided by the PCB information, the opening is 1: 1, and the translucent is engraved on the reverse side of the printing. At the corresponding coordinates, the entire PCB opens at least two reference points.
Opening requirements: 1.41. The position and size ensure a high opening accuracy, and the opening is strictly in accordance with the prescribed opening method. 1.42. The size of the independent opening cannot be too large, the width cannot be greater than 2mm, and a 0.4mm bridge is required in the middle of the pad size greater than 2mm, so as not to affect the strength of the stencil.
1.43. The opening area must be centered.
Characters: In order to facilitate production, it is recommended to engrave the following characters in the lower left or lower right corner of the screen: Model; T; Date; the name of the company that made the screen.
Stencil thickness: In order to ensure the amount of solder paste printing and welding quality, the surface of the stencil is smooth and even, and the thickness is uniform. The stencil thickness refers to the above table. The stencil thickness should meet the premise of the finest pitch QFP BGA. If there are 0.5mmQFP and CHIP 0402 components on the PCB, the stencil thickness is 0.12mm; if there are 0.5mmQFP and CHIP 0603 or more components on the PCB, the stencil thickness is 0.15mm;
The opening shape and size requirements of printed tin screen:
2.1CHIP components: CHIP components above 0603, in order to effectively prevent the generation of tin beads.
2.2SOT89 components: Due to the large pad and small pad spacing between components, soldering quality problems such as tin beads are prone to occur.
2.3 SOT252 component: Because SOT252 has a large pad, it is easy to produce tin beads, and the reflow soldering tension causes displacement.
Look 2.4IC: A. For the standard pad design, PITCH》 = 0.65mm IC, the opening width is 90% of the pad width, and the length is unchanged.
B. For the standard pad design, IC with PITCH <= 005mm, because of its small PITCH, it is easy to produce bridging, the length direction of the steel mesh opening is unchanged, the opening width is 0.5PITCH, and the opening width is 0.25mm.
2.5 Other situations: One pad is too large, usually one side is greater than 4mm, and the other side is not less than 2.5mm, in order to prevent the generation of tin beads and displacement caused by the effect of tension, the mesh opening is recommended to be divided by grid lines In this way, the grid line width is 0.5mm and the grid size is 2mm, which can be evenly divided according to the pad size.
The shape and size requirements of the opening of the printed rubber screen: glue is used for simple PCB assembly. Dispensing is preferred. CHIP, MELF, SOT components are printed through the screen, and IC is used to avoid glue scraping. Here, only the recommended opening size and opening shape of CHIP, MELF and SOT offset printing plates are given.
1. Two diagonal positioning holes must be opened at the diagonal of the stencil. Select FIDUCIAL MARK to open the hole.
SMT (Surface Mount Technology), or surface mount technology, is one of the most popular technologies and processes in the electronics assembly industry. In the Pearl River Delta represented by Shenzhen, the electronics and information industry is developed and the industry chain is complete. It is a veritable factory in the world.
As the market environment changes and technology changes, in order to meet the increasingly personalized needs of end customers, manufacturers are constantly improving their products, constantly innovating according to market needs, and developing trendy styles and functions to adapt to the current market demand. In order to be able to quickly respond to market diversified and uncertain needs and quickly provide products that meet customer needs, “short, flat, and fast” has become an important feature of production sites during this period, on time, quality, quantity and at a minimum cost Manufacturing products that meet customer needs has become the goal of production management, but progress is seemingly more and more difficult due to resource constraints such as limited skilled personnel and tight equipment. In this case, SMT production is now in a state of small batches and multiple varieties. Because of the inherent production characteristics of the SMT production line, it uses the best production efficiency in large batches. Therefore, for small batches and multiple varieties, there are multiple line changes to complete the production conversion of the product. The SMT line is in an intermittent production state. The increase has caused problems in the production efficiency of the SMT line.
One
Benefits of small batches and multiple varieties
1.Improve adaptability to changes in demand
Small batch, single piece delivery
Reduce job preparation time
Multi-skilled employees
In-process quality assurance system
Generalization of equipment and tooling
Eliminate waste caused by improper production management and reduce production management costs
Material waiting due to improper production management
Unnecessary model changes due to improper production management
Increase in indirect operations due to improper production management
4.Improve the adaptability of manufacturing to short delivery time
Eliminate stagnation (things / information)
Reduce the number of intermediate work in process
Synchronization
two
Characteristics of small batches and multiple varieties
Multi-variety parallel
Because many enterprises’ products are configured for customers, different products have different needs, and the resources of enterprises are among multiple varieties.
Resource sharing
Every task in the production process requires resources, but the resources that can be used in the actual process are very limited. For example, the problem of equipment conflicts often encountered in the production process is caused by the sharing of project resources. Therefore, limited resources must be properly allocated to meet project needs.
Material requirements change, resulting in serious procurement delays
Due to the insertion or change of orders, it is difficult for external processing and procurement to reflect the order delivery time. Supply risks are extremely high due to small quantities and a single source of supply.
three
Difficulties in small batch and multi-variety production
Many varieties and small batch production models will also encounter many problems in enterprise practice, such as:
Multi-variety and low-batch production, mixed scheduling is difficult
Unable to deliver on time, too much “fire fighting” overtime
Order requires too much follow-up
Frequent changes in production priorities, the original plan could not be implemented
Increasing inventory but often lacking critical materials
The production cycle is too long, the lead time is infinitely expanded
▎How to implement automatic upgrade has become a trouble for OEM companies
The electronic information industry is still a pillar industry in Shenzhen, with an industrial scale of more than 1.200 billion yuan, accounting for about 1/7 of the national electronic information manufacturing revenue. In Shenzhen, there are a large number of leading electronic information companies such as Huawei, ZTE, and TCL, as well as a large number of small-scale lean manufacturing and processing enterprises that were born in response to the needs of the times.
Due to the production characteristics of traditional foundry companies, “different bills of materials for each order, different production processes, different cleaning standards, different packaging requirements, and different labeling specifications”, unlike large factories that do standard products, they can be automated on a large scale upgrade.
How to use industrial robots, advanced automation management platforms, and information technology to help these enterprises achieve flexible production and agile manufacturing are the topics they care about in common.
Under the pressure, many traditional OEM companies have begun to transform to ODM (Original Design Manufacturer), and gradually pay attention to independent intellectual property rights, start to make innovative products, and start to develop independent brands.
▎ Machine substitution may be a “beautiful trap”, how to realize flexible production is the key
China’s Industry 4.0, like an aircraft carrier, propels China forward. For these small and small batch OEM companies, after experiencing the “prosperity era” brought by the demographic dividend, they are also thinking about how to take the road of independent innovation.
Perhaps many OEM companies rely on the channel advantages accumulated over many years of operation and the natural industrial chain advantages of the Pearl River Delta. But the demographic dividend is no longer, the cost advantage is no longer, and the rise and penetration of the Internet has also led to major changes in production methods, management concepts, production equipment, and even raw materials. These factors have begun to cause some entrepreneurs to worry about the future.
“Without the independent innovation of Chinese companies, we can only be a world factory. Without trial and error and iteration of research and development, we will never have our own core technology.”
How to innovate? Is machine substitution really the general trend?
For these manufacturers, there may be pitfalls in purely pursuing “machine substitution” oriented by automated equipment, mass production, and reduced manufacturing costs. Because for them, the key to “machine substitution” is how to implement software flexibility, agile programming, or automatic programming, just like “quick mode change” in TPS (transaction processing system).
The Scrap Tape Cutter is designed to cut off scrap of reel tape (8mm~44mm )and
collect them in a dump box for ease of disposal.
Do not put objects other than reel tape in the cutter unit.
Use caution with long hair and when wearing loose clothing
near the cutter unit.
Unplug the unit when performing maintenance of the
machine.
Do not operate the machine near flammable gas.
Do not open/disassemble the cutter unit while the machine
is operating
.
Follow all safety labels on the cutter unit.
How to distinguish between PCBA board cleaning and non-washing in automotive electronics?
Edited by Ming: ming@smthelp.com
Customers often do not understand why automotive electronics PCBA boards need to be cleaned reliably. Which electronic PCBAs need cleaning before use? Which ones don’t have to be cleaned? It is also difficult to distinguish and judge. The purpose of this article is to analyze the necessary reliability cleaning of automotive electronics PCBA, hoping to help customers and readers.
In order to realize the control of driving and clock functions in the car, various types of electronic circuit boards are used to realize various control functions: engine driving management system or engine driving computer ECU, and new energy vehicles have more circuit boards, each of which is on average. The car has a circuit area of 1.5 square meters and more than 100 electronic circuit boards. These types are in electronic circuit boards that implement various functions. What needs cleaning? Which do not have to be cleaned?
The function control panel of the car electronics is cleaned and not cleaned, and is often distinguished from the driver’s personal safety, the safety of the driving scene and the safety of the property. The function control related to the safety of the car and the personal safety of the third party is required. Do the cleaning to achieve high reliability technical requirements: for example, the engine management system ECU circuit board, the new energy vehicle power management system BMS circuit board and so on.
The car also has other management systems, lighting control systems, navigation, music playback entertainment systems, door and window control and glass lift, seat functions and other auxiliary functions, because the density of these systems and human life safety is not too great, Often such electronic circuit boards can be made from no-clean, thereby reducing cost and meeting performance requirements.
Driving circuit ECU, new energy vehicle BMS power management system process circuit board process cleaning, cleaning circuit board surface residue, removing flux, solder paste residue and residual effects of other pollutants in the process, truly reach the circuit The surface of the board assembly is clean, and the degree of ionic contamination is used as an indicator to measure the cleanliness of the board surface. This is the technical indicator that can truly achieve reliability guarantee. It can greatly improve the safety and reliability of the circuit board assembly products, and avoid unnecessary risks caused by the electrochemical corrosion of the circuit board and the defects caused by electromigration caused by poor working conditions, humidity and high temperature.
In summary, all component processes that are closely related to life safety and driving safety must be reliably cleaned. It is currently recommended to use an environmentally safe water-based cleaning process.
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The product is suitable for use in automotive electronics, smart home products, communications electronics, consumer electronic product manufacturing process, to improve product reliability and to remove foreign bodies and electrostatic PCB surface
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Circuit board, PCBA cleaning, is it really important for EMS (Electronic Manufacturing Service)?
Edited by Ming: ming@smthelp.com
“Cleaning” is often overlooked during board (PCB) PCBA manufacturing and is considered to be not a critical step. However, with the long-term use of the product on the client side, the problems caused by the ineffective cleaning in the early stage caused many failures, and the rework or recall of the product caused a sharp increase in operating costs. Below, SMTHELP briefly explains the role of PCBA cleaning of circuit boards (circuit boards).
PC BA (Printed Circuit Assembly) has a number of process stages in the production process, each stage is contaminated to varying degrees, so the surface of the PCBA of the circuit board (circuit board) is left with various deposits or impurities, which will lower the product. Performance, and even cause product failure. For example, in the process of soldering electronic components, solder paste, flux, etc. are used for auxiliary soldering, and residues are generated after soldering, and the residue contains organic acids and ions, etc., in which organic acids corrode the circuit board (circuit board) PCBA, and The presence of electrical ions can cause short circuits and cause product failure.
There are many kinds of contaminants on PCB (PCB) PCBA, which can be classified into two types: ionic and non-ionic. The ionic pollutants are exposed to moisture in the environment, and electrochemical migration occurs after energization, forming a dendritic structure, resulting in a low resistance path and destroying the PCBA function of the circuit board (circuit board). Non-ionic contaminants can penetrate the insulating layer of PC B and grow dendrites under the surface of the PCB. In addition to ionic and non-ionic contaminants, there are also particulate contaminants such as solder balls, floating spots in solder baths, dust, dust, etc. These contaminants can lead to reduced solder joint quality, sharp solder joints during soldering, and Porosity, short circuit and many other undesirable phenomena.
With so many pollutants, which ones are the most concerned? Fluxes or solder pastes are commonly used in reflow and wave soldering processes. They are mainly composed of solvents, wetting agents, resins, corrosion inhibitors and activators. Thermally modified products must be present after soldering. In all the pollutants, the post-weld residue is the most important factor affecting the quality of the product. The ionic residue tends to cause electromigration to reduce the insulation resistance, and the rosin resin residue is easy to adsorb. Dust or impurities cause an increase in contact resistance, and in severe cases, open circuit failure, so strict cleaning must be performed after welding to ensure the quality of PCBA of the circuit board (circuit board).
In summary, the cleaning of the circuit board (PCB) PCBA is very important, and “cleaning” is an important process that is directly related to the quality of the PCB (circuit board) PCBA, which is indispensable.
Circuit board, PCBA cleaning is really important, for EMS (Electronic Manufacturing Service)?
SMTHELP :SMT Professional Manufacturer PCB Cleaning Machine
The product is suitable for use in automotive electronics, smart home products, communications electronics, consumer electronic product manufacturing process, to improve product reliability and to remove foreign bodies and electrostatic PCB surface
PCB cleaner,nozzle cleaning machine,PCB Stencil cleaning machine, PCBA cleaning machine，Fixture cleaning machine,Printer Cleaning Machine,pneumatic Stencil cleaning machine,fully pneumatic washing machine Manufacturer
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After the circuit board is cleaned, the board surface turns white, what should we do?
Edited by Ming: ming@smthelp.com
First, the board surface is whitish after cleaning:
In the electronic component manufacturing process, the PCBA circuit board is often over-wave soldered, and after the manual cleaning agent is used for cleaning, the board surface appears white (Figure 1).
Second, the reason for the whitish surface of the board after cleaning:
White residue is a common contaminant on PCBA and is generally a by-product of flux. Common white residues are polymerized rosin, unreacted activator, and lead metal chloride or bromide, which react with flux and solder. These substances expand in volume after moisture absorption, and some substances also hydrate with water. White residue is becoming more and more obvious. It is extremely difficult to remove these residues on the PCB. If the temperature is too hot or high, the problem is more serious. The infrared spectroscopy analysis of the rosin and residue on the PCB surface before and after the soldering process confirms the process. .
Regardless of whether the board has white residue after cleaning, or if the white material appears after the no-clean circuit board is stored, or the white substance on the solder joint found during the repair, there are four cases:
When the PCB is stored under high humidity conditions, when the absorbed moisture reaches a certain level, the rosin gradually changes from a colorless and transparent glass state to a crystalline state, and a white powder is formed from a viewing angle.
The essence is still rosin, but the shape is different, still has good insulation, and will not affect the performance of the board. The abietic acid and halide (if used) in the rosin are used together as an active agent. Synthetic resins generally do not react with metal oxides below 100 ° C, but react rapidly when the temperature is higher than 100 ° C. They volatilize and decompose faster, and have low solubility in water.
If the welding surface and parts are highly oxidized, the concentration of the product after welding will be high. When the degree of oxidation of the rosin is too high, it may remain on the board together with the undissolved rosin oxide. At this time, the reliability of the board will be reduced.
In the assembly process, it is highly probable that the halogen-containing flux is used for the electronic auxiliary materials (although the supplier provides environmentally friendly flux, but the halogen-free flux is still relatively small), and the surface of the board remains after welding. Halogen-based ions (F, Cl, Br, l). These ionic halogen residues, which are not themselves white, are not sufficient to cause whitening of the surface. These substances form strong acids when exposed to water or moisture. These strong acids begin to react with the oxide layer on the surface of the solder joints to form acid salts, which are white substances that are seen.
Third, after the circuit board is cleaned, the board surface is whitened:
1, the general solution:
3, and then start from the washing water formula, you can ask the supplier to improve the formula, improve the cleaning degree and dissolution volatility.
For the whitening problem of PCBA circuit board cleaning, water-based cleaning agent can be used to meet the corresponding cleaning equipment to deal with it. It is safe and environmentally friendly, meets the requirements of current ROHS, CE, and other environmental protection regulations. It has high cleaning efficiency and completely solves the problem of whitening.
SMTHELP :SMT Professional Manufacturer PCB Cleaning Machine
The product is suitable for use in automotive electronics, smart home products, communications electronics, consumer electronic product manufacturing process, to improve product reliability and to remove foreign bodies and electrostatic PCB surface
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Our high performance cleaning machines are designed to remove all unwanted contamination present in electronic manufacturing and micro-mechanic
WATER BASED ELECTRONIC PCB CLEANING MACHINES – For printed circuit boards, flux no-clean, solder paste misprints, small parts.
[embeddoc url=”https://www.smthelp.com/wp-content/uploads/2019/08/PCBA-CLEANING-MACHINE-SCM5600D-English.pptx” download=”all” viewer=”microsoft”]
In SMT PCB production, solder paste printing is a critical step. Since the solder paste is used to directly form the soldering joint, the quality of solder paste printing affects the performance and reliability of the surface mount assembly. Quality solder paste printing guarantees a quality solder joint and final product. Statistics demonstrate that 60% to 90% of soldering defects are related to solder paste printing defects. So it is very important to understand what causes defects in solder paste printing.
ItemFactorsAnalysis1Solder PastePowder formationThe irregular shape of solder powder will easily clog stencil apertures. This will cause a big slump after printing. It can also cause solder ball and short bridge defects after reflow.
A spherical shape is best, especially for fine-pitch QFP printing.Particle SizeIf the particle size is too small, the results will be poor paste adhesion. It will have a high oxygen content and cause a solder ball after reflow.
The particle size should be controlled to about 25 ~ 45 μm in order to meet the requirements for fine-pitch QFP soldering, If the partical size desired is 25 to 30 μm, it should applied with less than 20 μm solder paste for an ultra fine-pitch IC.FluxFlux contains a thixotropic agent, which allows the solder paste to have pseudoplastic flow characteristics. Since the viscosity decreases when the paste passes through the stencil apertures, the paste can be applied to the PCB pads rapidly. When the external force stops, the viscosity will recover to ensure no deformation occurs.
The flux in the solder paste should be controlled to between 8 and 15 percent. A lower flux content will result in excess amount of solder paste applied. Conversely, a high flux content will result in an insufficient amount of solder applied.2StencilThicknessA stencil that is too thick will cause a solder bridge short.
A stencil that is too thin will cause an insufficient solder to be applied.Aperture sizeWhen the stencil aperature size is too big, a solder bridge short can occur.
When the stencil aperature size is too small, and insufficient solder paste will be applied.Aperture shapeIt is best to use a circular-shaped stencil aperture design. Its size should be slightly smaller than the PCB pad size, preventing a bridging defect during reflow.3Printing parametersBlade Angle Speed & PressureThe blade angle affects the vertical force applied on the solder paste. If the angle is too small, the solder paste will not be squeezed into the stencil apertures. The best blade angle should be set around 45 to 60 degrees.
A higher the printing speed means that less time will be spent in applying the solder paste through the stencil aperture surface. A higher printing speed will cause insufficient solder to be applied.
The speed should be controlled to around 20 ~ 40 mm/s.
When the blade pressure is too small, it will prevent the solder paste from being cleanly applied to the stencil.
When the blade pressure is too high, it will result in more paste leakage. The blade pressure is typically set at about 5N ~ 15N / 25mm.4Printing process controlPCB moistureIf the PCB moisture is too high, the water under the solder paste will quickly evaporate, causing the solder to splash and creating solder balls.
Dry the PCB if it was fabricated over 6 months ago. The recommended drying temperature is 125 degrees for 4 hours.Paste storageIf the solder paste is applied without a temperature recovery period, the water vapour in the surrounding environment will condense and penetrate the solder paste; this will cause the solder to splash.
Solder paste should be stored in a refrigerator at 0 to 5 degrees.Two to fours hours before use, place the paste in a normal temperature environment.
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An article to let you know the principle of PANASONIC-MV2V(C/F/B) component recognition.
Edited by ming Gan, please contact ming@smthelp.com for more information.
1 program composition
1) NC PROGRAM: Z-axis components are placed at X, Y positions at θ angle
2) PCB PROGRAM: substrate length, width, thickness and PIN spacing
3) ARRAY PROGRAM: Z specified components
4) PART LIBRARY: Component Information
5) MARK LIBRARY: tag information
2 NC PROGRAM
1) File name: P— [0-9, A-Z, +, -,.]
2) X, Y coordinates
3) Z No: ZA+ZB, K TYPE and Q TYPE, in single and double FEEDER at 8mm width
The difference between K TYPE and Q TYPE: * PIN, no PIN
* PITCH: K-21.5mm Q-20mm
* ORG: FULL is 1, K-Z1, Q-Z2 when HALF
FEEDER: HALF must be used when mixing single and double
Z No: Single input K TYPE: Product number, Q TYPE: Even
4) θ angle: θ1, θ2 two, θ3 origin return
Θ1:0° 90° 180° 270°
Θ2: [set angle – θ1] + correction angle Reverse time is –
5) S&R: STEP REPEAT, PATTERN REPEAT
On time is +
6) NO MOUNTING: 0-normal patch, 1-non-patch
7) SKIP BLOCK: 0 – unconditional execution, 1 to 9 – conditional jump, 7 – unconditional jump
8) MARK: 0 – no MARK, 1 – individual MARK, 2-PCB MARK, 3-PATTERN MARK
9) LAND TEACHING: 0-NO, 1-LAND TEACHING [Recommended for the second leg of each side]
10) BAD MARK: 0-NO, 1-BAD MARK [SENSOR] 2-BAD MARK [PCB CAMERA]
11) PROGRAM OFFSET: X=, Y=, move the first point of the patch to the camera center
The machine automatically finds PROGRAM OFFSET
12) Z ORG is normally 1 and Z No can be set
* NC PROGRAM sequence
S&R->BAD MARK->MARK/PROGRAM->ROGRAM OFFSET->MARK
3 ARRAY PROGRAM
1) File name: P— [0-9, A-Z, +, -,.]
2) Z No: Fixed cannot be changed
3) SHAPE CODE: shape coding [machine]
4) PARTS NAME: component name [person]
5) VACUUM OFFSET: NOZZLE↑ +, NOZZLE↓ – [-3～3mm]
6) MASTER Z No.: master, slave Z axis
4 PCB PROGRAM
1) File name: P— [0-9, A-Z, +, -,.]
2) X: PCB length
3) Y: PCB width
4) T: PCB thickness [NO USED]
5) Whether the PIN is used: 0-not used, 1-automatic adjustment
6) Hole spacing: X-10
7) Conveyor speed: 1[H]~8[L] speed, X, Y table speed when fully automatic control
5 MARK LIBRARY
1) SHAPE CODE: shape coding, —
X, Y: MARK size
PCB material: 0-copper foil, 1-solder
PATTERN: shape
TYPE: 0-shade, 1-binarization
6 PARTS LIBRARY
1) Shape coding: SHAPE CODE [—, 0-9, A-Z, +, -,.]
2) Component type CLASS: 1 to 99 [1 to 19 transmission recognition, 20 to 99 reflection recognition]
Reflection recognition: blue light is absorbed on the orange reflector, and the surface of the component is reflected [Figure A]
By recognizing: the white light of the halogen lamp shines on the orange reflector, and the reflector reflects the light.
Depending on the component, the edge of the component is reflected to the camera [Figure B]
* High reflection recognition accuracy, high passability through recognition, LED off when used
* For identification θ: CHIP angular deviation > 35° NG, QFP angular deviation > 25° NG
TYPE: For component color, normal condition is 1 [black best]
3) SHUTTER [Shutter]: 0-on, 1-in [Generally open]
Closed left and right to ensure component identification [Figure D]
4) Component dimensions SIZE: up, down, left, right
Hand-drawn tape to see the reverse side of the component is the same as the camera [Figure C]
5) Component thickness THICKNESS: T-component body thickness
6) Thickness tolerance TOL: T<1 is 20% T≥1 is 15%
7) HEAD SPEED: 1[H]~8[L] X, Y TABLE SPEED: 1[H]~8[L]
8) NOZZLE SELECT: 1~5
9) CAMERA: 0-S, 1-L
10) Component feed direction FEED DIRECTION: 0 to 7, 45° interval
11) Packing method: 0-PAPER [including 32mmPEELING] 1-EMBOSS 2-BULK
12) PUSHPIN: 0-NO USE 1-USE only for 8mm bandwidth
13) Number of feeds FEED COUNT: 1~4 spacing 12mm
14) Auxiliary feed: NO USE
15) Component error correction RECOVERY: 0-NO, 1-YES, 2- large parts are sucking
16) CHIP STAND: 0-NO, 1-YES
[Components stand up, thickness sensor is detected, LINE SENSOR application]
17) VACUUM OFFSET: absorbing, for components [-3mm~+3mm]
18) LEAD OUT SIZE: Up/Down Left/Right
19) LEAD PITCH: leg spacing
20) LEAD PITCH TOL: tube leg tolerance
21) LEAD COUNT: Up/Down Left/Right Legs
22) Electrode part ELECTROD: The length direction of the element is the length direction of the electrode [Fig. E]
The width direction of the component is the width direction of the electrode
23) CUT LEAD: cut tube legs SIDE: 1~4, there are cut legs on the side
COUNT: Cut off: POSTION: Position [Figure F]
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