Tag Archives: SMT consumbles

How to use SMT filter to ensure the quality of SMT products?

SMT Filter

SMT filter cotton is usually replaced in three months, otherwise it will be blocked, affecting the use effect.

Filter has the following characteristics.

1.Is a high performance and high efficiency filter cotton non-woven processing using organic hot-melt synthetic fiber and;

2, increasing structure, using gradually encrypted multi-layer technology, that is, the fiber density in the direction of pure air will increase gradually, and the higher filtration efficiency can be blocked at different levels of density according to the size of dust, which will more effectively accommodate more dust.

3, efficient filter cotton sticky treatment, filter material after full dipping, because the adhesive penetrated the media completely, so that the dust particles can not pass through, so that the overall filtered air flow evenly diffused, forming laminar flow state, to achieve the best spraying effect.





Does anyone need SMT filter cotton? Factory price.

Please feel free to contact us if necessary.




JUKI nozzle :Which is the most used?

JUKI nozzle

Use black material Seiko forming – wear long life

German technology to create high precision – beyond the original quality

  1. Applicable models: JUKI placement machine

KE2000 series KE2010 KE2020 KE2030 KE2040 KE2050 KE2060 KE2070 KE2080 KE-3010A KE3010ACL KE3020VA JX series JX-100 JX-200 JX-300LED JX-100LED JX-350 , FX series FX-1, FX-2, FX-3, FX-3R, FX-3RA.

  1. Using nano-aviation materials, through ultra-precision machining and grinding, the nozzle will not wear out and become white. It can be durable.



JUKI nozzle JUKI nozzle JUKI nozzle JUKI nozzle

JUKI nozzle

JUKI nozzle


JUKI nozzle


● our advantages:

Production advantages: the use of close CNC / milling machine, lathe, grinder, line cutting 35 world first-line brand processing equipment, to make Seiko quality. Non-standard nozzles and the workpiece can be quickly customized, 2-3 working days can be delivered, ultra-rush orders can be shipped the same day.

Long-term inventory, a large number of conventional suction nozzle stock, immediately after the order can be shipped, order to reach 1,000 US dollars can be shipped for free
Price advantage: Suction nozzle and SMT placement machines are a variety of peripheral equipment accessories are sold at preferential prices. Truly Seiko quality, the Chinese price, used to repay customers. We only do Seiko quality, low-end high-margin products do not do!
Team advantage: We have a group of 20 years of experience with automatic insertion machine, SMT machine service engineer team
Payment advantages: As long as you are a factory customer, we can do monthly payment

JUKI nozzle

Buy now for just $ 25, please click on the link for more details


We also sell all kinds of brand accessories, such as JUKI,universal, panasonic, yamaha, samsung, Fuji, Siemens, TDK

If you have any needs, please feel free to contact us:



JUKI nozzle

FUJI XP142/143 2.5/3.7# Nozzle

 SAMSUNG nozzle  CP45FV/SM420 CN065 CN040 CN220 CN400 TN220 TN065

Panasonic nozzle Panasert- smt nozzle for pick and place machine


SMT Nozzle Cleaning MachineOperation Manual

Nozzle Cleaning Machine

Operation Manual

Please read the instructions carefully before user operation


First of all, we sincerely thank you for choosing the SMT peripheral automation machine produced by our company. This company specialized production: conveyor, automatic feeding detection machine, vacuum suction machine, stacked on the machine, parallel transfer, angle conveyor, turning machine,machine, double buffer for the same reflow furnace system, a series of automated production machine. According to the customer’s requirements, we can develop and design a series of automation machine, in order to meet the customer’s high efficiency, energy saving, downsizing and other production needs. This manual describes the use of methods and machine maintenance and precautions, in front of the machine, please carefully read this manual, and it will be properly preserved, wrong operation may cause the device does not operate normally or damaged parts. Due to man-made machine failure or parts damage, will not apply to the company’s exemption free warranty service range. Without permission of the company, please do not disassemble or replace the machine parts, nor applicable to the company’s free warranty warranty service range. As to the improvement and partial renewal of the product, we will not make further instructions. If you have any doubts, please contact our company for consultation.

















Important matters and safety instructions

When using this Cleaning Machine, you must abide by these safety devices.

All attention should be taken to avoid accidents and damage to the instrument.

1. please read and understand the user’s manual carefully before using or operating this machine.

2. non – instrument maintenance personnel and untrained personnel should not use this machine at will.

3. please avoid the use of this machine in the vicinity of the strong electromagnetic interference source.

4. please avoid the use of this machine in the environment with high humidity.

5. maintenance, please turn off the power, to prevent damage to components.

6. instruments are used, they should be kept stable to prevent falling.

二、Appearance introduction



1Liquid storage tank

When the cleaning liquid is completely unused, the liquid can be added, and the addition method is referred to the addition of the solution step.

2Emergency switch

After pressing the emergency switch, PLC is out of power and the equipment stops working

6Storage tank

Store the cleaned liquid and put out of the liquid in time.

Step: the tank is pulled out, carefully put out the liquid.

三、Operation steps

1. connect the power supply (220V, 50HZ) and gas supply (0.6MPa), turn on the power switch.

2.Check whether there is a liquid on the left level (the grooves pipe), if its no,then add liquid (detailed please refer the step of adding the liquid).

3. Switch is normal opening , and the touch screen appears as the Figure 3.1 interface

Figure 3.1

4. Click Figure 3.1 [into system], and appear on the interface, such as Figure 3.2. If you need to set parameters, enter the manual tool interface for parameter settings (detailed please refer the parameter settings).When you set it up, Hit [save parameter].

Figure 3.2

Note: first use the parameters set first ( refer parameter settings) and then do the next step.

5. When nozzle is placed well,closed the door tightly ,and set the parameters(can skip). Confirm that the suitable angle is adjusted well, that is, the nozzle is aligned with the suction nozzle center, otherwise it can’t be cleaned.

6. Click Figure 3.2 [reversion], then click Figure 3.2 [auto start] (after click finish is displayed as automatic stop) or press the boot button of the device


四、Parameter setting

1. click the [manual tool] as shown in Figure 4.1, as shown in Figure 4.2

Figure 4.3

Input signal monitor(click the interface of Figure 4.2 [ input and monitor].)

Figure 4.4

Manual control interface(click the interface of Figure 4.2 [ control debug].)

Use in manual debugging

Figure 4.1

Figure 4.2


Figure 4.3

Figure 4.4

2. click on Figure 4.2 [parameter settings], appear as shown in Figure 4.5, according to actual needs, set up relevant parameters, click figure 4.5 [bottom parameter], the password is 4 “8888”, and then appear as shown in Figure 4.6.

Figure 4.5

1) nozzle: set the number of nozzle (according to the jig can install the number of nozzle to set)

2) clean time: setting up a single nozzle cleaning time (according to the actual situation)

3) air-dry time: setting the time to complete the air-dry of a single nozzle (according to the actual situation)

4) save parameter: after setting the complete parameter, you need to click the [save parameter].

Figure 4.6

1) Original correction: to confirm the suitable angle, that is, the angle of the nozzle and the nozzle center to be rearranged, and the setting is set up.

2) Power on air storage time: set according to the actual situation

3) Air storage time before clean: it refers to the setting of the gas storage time before each cleaning, according to the actual situation.

4) Interval air storage time: express the later that later chose not to select the display as “yes”, For example, the clean time is 3 S, and interval air storage time is set to 1S, after cleaning 1S, gas storage for 1 S, and then clean for 1 S.

5) Impulse quantity: it express the impulse quantity for the turn of the turntable to 1o. If the device is not at its origin, it will increase the impulse quantity if it arrives at the origin. If it is found that the device is not at its origin, if it exceeds the origin, it will increase or decrease.

6) Continuous jet: express choose whether to continue the actual situation as yes” no choice later, shown as “no” is that he has chosen to continue.


五、Adding liquid steps

1. after the start of the machineenter the standby state and enter the interface shown in Figure 5.1.

Figure 5.1

2. click [pressure relief] has been holding down the nozzle, until no gas ejected and then release the hand off power.

3. open the tank cover, a funnel into the washing solution until close to the reservoir until canful.

4. closed storage tank cover, power off, re-work.

Note: the cleaning solution will never be allowed to splash into the equipment, otherwise the controller will burn out.








六、Daily maintenance project


Maintenance project

Daily the water must be emptied after each use.
the water must be cleaned up on the platform after each use.
Weekly check whether there is water leakage in the pneumatic cabinet and electrical cabinet.
check the looseness of the screws in each movement mechanism.
check whether the external electrical connector is loose.
cleaning the dust and debris in the electric cabinet and the pneumatic cabinet.
check the air leakage of the pneumatic components and the joint of the trachea.
Monthly check the oil mist special oil in the oil mist is too small, less is added.
check whether the internal joint of the electric cabinet is loose.
check the entrainment wheel, whether the belt wear out.
lubricating grease for all bearings of each device.

S -1688 Stencil Cleaner Machine USER MANUAL for PCB Assembly

Meet the Needs of the SMT Age



Please read this user manual carefully before running









S-1688 Stencil Cleaner Machine

















TEL : 0755-83203237

FAX : 0755-23240492

ADD : Room 1806, Block 3, Jinyun COFCO, Qianjin 2nd Road ,Baoan District,
Shenzhen City, China





1.0 safety warning……………………………………………………………………………….3


2.0 product presentation


3.0 installation requirements……………………………………………………………….4


4.0 Operations Guide……………………………………………..…….………………………………..5


5.0 The cleaning of the solvent is added, platoon and storage tank………………………………………………………..………….…………………………………………..13


6.0 Replacement of filter element………………………………………………………15


7.0 Product use precautions……………………………….…………..……………….…………………………………..16


8.0 working principle………………………………………….………………………………………..16


9.0 Maintenance, fault handling ……………………….………………………………………16





















1.0 safety warning

1.1 Please read this manual carefully.


1.2 Please strictly follow the installation requirements in this instruction and the guide to operation. The installation and use of this equipment.


1.3 Please equip a person to operate the equipment


1.4 The operator must wear protective glasses, protective gloves, protective respirators and other protective products.


2.0 product presentation


2.1 Name: full pneumatic steel net cleaning machine


2.2 model: S-1688


2.3 Product features


Use full pneumatic logic control, one-click operation, easy to finish cleaning and drying


2) No power supply, no fire hazard.


3) The cleaning frequency system is automatically counted to facilitate the replacement of consumables in time to ensure the quality of cleaning work.


4) The cleaning pressure can be adjusted according to the need to ensure the stability of steel mesh tension, thus ensuring the longer service life of the steel net.


5) The whole operation process is completely closed, avoiding the direct contact between the workers and the cleaning fluid


6) Various types of cleaning fluid can be used for efficient cleaning


Can effectively remove solder paste, such as red glue residue and more from steel mesh, wire mesh, copper mesh, microporous network, scraper, fixture, PCB, etc.


8) The three – level filtration device ensures the recycling of cleaning fluid, and realizes the minimal loss of cleaning fluid.


Asymmetric rotating spray arm: ensure the cleaning of fine PCB holes.


Digital free setting cleaning and drying time



2.5. Main technical parameters:


Application stencil, glue screen , copper screen
Stencil size Standard 29 inch and below
Clean liquid capacity Max 50L , Min 20 L
Cleaning fluid volume 40L
Cleaning method  Rotary double-sided pressure injection and
high-pressure air spraying ( cleaning and drying )
Clean time 2~4 min (stencil and copper net)
Rinse time 2~4 min (stencil and copper net )
Dry time 2~5 min
External air supply 0.4Mpa~0.6Mpa
Air consumption 400~600L/Min*2
Air outlet size Φ125*25mm
Weight  320Kg
Dimension  980mm(L)*700mm(W)*1730mm(H)
Tin filter method Three class filter (10μm,5μm,1μm)


3.0 installation requirements…


3. 1. Installation site


In order to ensure safe production and prevent possible damage to the equipment, the equipment should be installed in a place that meets the following environmental conditions


1) Stay away from sources and heat sources


2The air is dry and well ventilated


3) Clean, clean, flat and unshaken ground


3. 2. Installation accessories, required energy and precautions


1) The source pressure is : 0.4Mpa~0.6Mpa


2)Taken the air over diameter for : 12mm, a quick joint is needed


3) The top of the equipment is designed : The 125mm exhaust port shall be connected to the outside by independent air duct



4) matters need attention: In order to ensure safe production, customers must ensure that the following security measures are installed in place. Otherwise, the company does not assume any responsibility for security

It is at least 3 meters away from the electric equipment, away from fire source and heat source


The ground wire must be connected, and the earth shall not be connected to any other electrified equipment


The exhaust duct of this equipment shall not be connected to any equipment that can produce heat source. (such as reflow soldering wave soldering of SMT, etc.)


3.3 installation space


To facilitate the maintenance and replacement of spare parts for equipment operation, please leave more than one meter space around the equipment


4.0 Operations Guide


A Preparation before operation


4.1.1 connect the air source to the machine, the gas source is connected well, the display lamp is highlighted and the subsequent work can be continued


4.1.2 check if air pressure in the standard rating (04-0.6 MPa) range. Lower than 0.4mpa will affect the cleaning effect and reduce production efficiency (too low will not activate the machine).

Higher than 0.6mpa can result in damage to the mechanical gas system and all parts of the system.

Adjust the pressure method: pull upward gently to adjust the knob and rotate to the right————- Increase pressure

Go to the right ————– reduce stress

After reaching the required pressure, press the adjusting knob, air pressure lock and pressure to complete the gas connection, and the lamp is highlighted



4.1.3 check whether the top exhaust duct is unblocked or unblocked, which will result in damage to the environment and other consequences of the cleaning effect





4.1.4 check the glass viewport of the door panel through the liquid road to check the solvent reserves. The normal state is above the M position, and the machine can meet the various cleaning effects. The amount of liquid stored in this model is the maximum amount (40L).
















4.1.5 if the solvent is not enough, please add adding method in time: see adding solvent method


4.1.6 the pump access panel is opened with a randomly attached triangle key to check whether the ball valves are in normal condition

Ball (the ball valve of pump outlet filter) A ball valve D (pump inlet connection of the reservoir fluid Xiang ball valve) opens, B ((the ball) of white PE tube pump discharge ball valve C (white PE tube pump inlet ball valve) closed















4.2 time setting


4.2.1The setting of the cleaning time (see figure below), gently rotate the timer protection cap to the left and pull up the cover.


General cleaning time is

Minutes, depending on the actual situation, will be different.

This timer is measured in seconds (S) with a range of 10-999 seconds (S).

It can be set to 0, otherwise the machine will not start and may damage the timer and other components.


















4.2.2 setting of drying time

Operation method and cleaning time setting.

The general drying time is 4-6 minutes depending on the actual situation.There will be an elongation of the aqueous solvents.


4.2.3The cleaning and drying time are automatic reset.

That is, one set, multiple times (N times).

When the pressure is less than the required number, the timer can be reset and the device cannot be started.

At this point, the black reset button on the upper row of the timer can be reset manually.






















4.2.4The counter’s use of this counter is the increment counter, each cleaning a steel net, automatically into the system,

One of them is going up.

The count range is 0-999999.

Mainly used for cleaning work statistics, timely replacement of consumables (filter element), etc.

The filter cartridge should be changed when cleaning up to 1500.

Specific visual cleaning products are different and different.

When the counter displays the number to reach the target number, press the 4.2.3 method to open the cover, then press the black reset button on the left of the timer and the counter is reset.


4.3 placement of steel mesh

4.3.1 press the inner door safety button to open the cleaning room








4.3.2 lift the steel net with both hands, gently place the front in the cleaning room chute roller and push it gently forward to the sliding channel steel

Fixed fixture on the net.

The steel net is in the middle of the fixture and chute. The top of the steel net is at the top of the cleaning room

Steel mesh fixture middle.(see below.)



















4.3.3 when placing the steel mesh, the steel mesh shall not be in contact with the door to avoid damaging the steel net and sealant














4.3.4After the steel net is placed, close the cleaning door.

The inner door should be kept in good condition, otherwise, the solvent will be expelled outside, causing machine damage or environmental damage, more likely to cause personal injury













4.3.5 after the inside door is closed, continue to close the outer security door.

The security door is closed and the light is on, so that the following operation can be continued.

If the security door is not closed, the lamp will be retracted and the machine will not be able to start.

After closing the door again, the machine can be started



















4.4 the start of the machine


4.4.1 press the start button lightly and the machine will start to run.

The machine will be automatically restored until the cleaning is completed









4.4.2 use the emergency stop button to press the emergency stop button when the emergency situation is in place. The machine will stop running.

The emergency situation is eliminated and the machine is restarted








4.5 adjustment of cleaning pressure

After the machine starts, pay attention to the pump input air source pressure and output cleaning pressure.

In order to achieve the best cleaning effect and maintain the tension of the steel mesh, the pressure should be adjusted








4.5.1 pump input air source pressure is generally maintained at about 0.4mpa


4.5.2 cleaning pressure is generally maintained at about 0.2-0.3MPa










4.5.3 adjustment of pump pressure: gently pull the adjusting knob of the pressure-reducing valve and turn the pressure on the right to increase the pressure to the left.

After adjusting well, press the adjusting knob to lock and adjust the work.

Note: this valve is the pressure reducing valve, the pressure adjustment will not be higher than the air source









4.6 the setting time is terminated and the machine is automatically stopped.

A cleaning cycle is over


5. Add, drain, and container for the solvent


5.1 addition of solvent

5.1.1 let the machine stop and open the access panel.

5.1.2 close ball valve B, D, open ball valve A, C.

Insert the “IN” pipe IN the ball valve C into the container containing the solvent.

Control the “IN” tube and start the machine until the machine drains the solvent.















5.2 discharge solvent and storage tank cleaning

5.2.1 open the liquid access panel and start the machine according to the normal procedure.

Close the ball valve D, open the ball valve C, and leave the machine idle for 1 minute.

In order to take out the solvent in the filter.

5.2.2 Open 8 screws on the tank and remove the reservoir cover..


5.2.3 press the stop switch to stop the machine.

Close the ball valve A and C, insert the “OUT” pipe of ball valve B into the container and slowly open the ball valve D.

Take care to control the “OUT” pipe at this time so as not to cause an accident.


5.2.4 when the solvent location of the reservoir is lower than the outlet filter of the reservoir, close the ball valve C and open the ball valve D.

Insert the white PE tube into the storage tank to remove the remaining solution


5.2.5When the solvent is removed, loosen the filter to fix the wire, remove the filter bag, remove the filter of the outlet and clean it with water or other means.

When the storage tank is cleaned and reloaded, cover the tank and lock the container



5.2.6 the liquid storage tank shall be cleaned and the solvent shall be drained and the machine shall be turned off.

Use a shovel knife to clean up the thick residues, leaving the small residue with a cloth strip


5.3 precautions for solvents


5.3.1 please wear protective equipment, such as protective gloves, protective glasses, protective masks, etc. to avoid direct contact with the human body and affect health and other safety accidents.

When operating, please pay special attention to the “IN” and “OUT” piping that controls the activity so as not to cause unnecessary security


6. Replacement of filter element

Replace the filter cartridge when cleaning a certain amount of steel net, the filter element needs to be replaced to satisfy the cleaning effect.

The replacement method is as follows


6.1. Remove the bottom of the filter with the left hand of the filter and remove the wrench into the disassembly hole, rotate the wrench to the left, remove the filter, then remove the filter element












6.2 installation of filter element

Wipe the filter clean and put in the new filter. (note that you can install a 5-micron filter on the outside by installing a 1-micron filter.

Then the left hand holds the bottom of the filter, and the right hand moves the filter nut.

When the hands are wrung, remove the wrench and hold it until it is unscrewed.

Pay attention to the filter cartridge when operating, the position of the filter should be put in place, for the positive


6.3 Replacement of seal rings

The sealing ring of the filter shall be soaked in the solvent for a long time because the chemical function will become larger. When the filter is removed, it will be difficult to install again.

The sealing ring should be removed at this time, with the spare ring installed.

Close the sealing ring after getting bigger, and substitute elastic back for backup


7. Use precautions

7.1. The installation site of the equipment is strictly prohibited near the source of fire, heat source and power supply.

The ground wire and exhaust duct must be installed and installed completely independently. It shall not be connected or connected with any other equipment


7.2. Replace the solvent, add, discharge the solvent, change the filter core, and when the steel net is taken, please wear protective equipment.To ensure the operator’s health and safety accidents.


7.3. Require strict access, adjustment and use of air source pressure according to the rated standard.Operate the machine according to the operating instructions and procedures of the machine.


7.4. It is not possible to bring cloth, paper scraps or other sundries into the machine cleaning room, or leave it in the storage tank, or it may cause blockage of the pipe and damage to the machine.


7.5. When operating the machine, please pay attention to the moderate intensity to avoid damage to the machine components.


7.6. No solvent cleaning machine surface or other non-stainless steel components shall be used to ensure the service life of the machine


8. Working principle


S-1688 Stencil Cleaner Machine

9.0 maintenance and fault handling


9.1 maintenance













9.2 fault handling













How to use Bowl vibration feeder for Bulk Electronic components for PCBA

For the last 20 years any odd-form components that did not come pre-packaged have been assembled BY HAND. Any PCB Assembly in today’s market can gain quick advantages by automating their assembly line. Huge costs are spent unnecessarily on labor and import fees.
If you are considering automation of odd-form components in your PCBA, consider these questions:
  1. Does your desired component come available in a package?
  2. Is your lead to hole ratio appropriate for automating?
  3. Is the quality and repeatability of the component suitable for automation?
  4. Does your component require lead preparation prior to insertion?
  5. Does your process require that the component is clinched?
Need help with these questions? Let us know and we will help design your Odd-Form Assembly tailored to your needs!


      DIP, PCB Assembly,Chip Mounter, Pick and Place, IC Mounter, High Speed Mounter, Wave soldering,LED lighting, LED Lamp, LED Display, LED tube,UPS, Power Converter, Power Adepter, Mobile Charger, PCB board handling system, Loader, Unloader, Conveyor,Shuttle, Chip Mounter, Pick and Place, IC Mounter, High Speed Mounter Induction Cooker, AC, Electric Cooker, Fan, TV, Settle Box

      Reflow oven technology and precautions

      Reflow oven technology and precautions

      Far infrared reflow again

      In 80s the use of far infrared reflow has the characteristics of fast heating, energy saving, stable operation, but because the printed circuit board and various components for different material, color and thermal radiation absorption rate to have very big difference, caused by a variety of different components and different parts of the circuit temperature is not uniform, the local temperature difference. For example, the black plastic package of integrated circuit will be overheated due to the high radiant absorption rate, and the welding part of it will lead to false welding on the silver lead instead of low temperature. In addition, the heat radiation blocked on printed boards, such as welding pins or small components in the shadow parts of big (high) components, will cause poor welding due to insufficient heating.

      1.2 full hot air reflow again

      Full hot air reflow oven  is a welding method by which the flow of airflow is forced through a convective nozzle or a heat-resistant fan, so that the welded parts are heated. This kind of equipment began to rise in 90s. Due to the adoption of this heating mode, the temperature of PCB and components is close to the temperature of the given heating area, which completely overcomes the temperature difference and shadowing effect of infrared reflow soldering, so it is widely applied now. In all hot air reflow oven  equipment, the convection velocity of the circulating gas is very important. In order to ensure that the circulating gas acts on any area of the printed board, the air flow must have a fast enough speed. To a certain extent, it is easy to cause the jitter of the printed board and the displacement of the components. In addition, in terms of heat exchange, the efficiency is poor and the power consumption is more.

      1.3 infrared hot air reflow again

      This kind of reflow oven is a more ideal heating method, which is based on the IR oven with hot air to make the temperature even more uniform insaide the oven. The characteristics of this kind of equipment to make full use of the infrared penetration, high thermal efficiency, energy saving, and effectively overcome the temperature difference of infrared reflow soldering and shadowing effect, and make up the influence of hot air reflow on gas flow caused by excessive demand, therefore  at international this kind of IR+Hot reflow is used most commonly  at present .

      With the increase of assembly density and the appearance of fine spacing assembly technology, a reflow oven  furnace with nitrogen protection has appeared. Welding under nitrogen protection conditions can prevent oxidation, improve welding wetting power and speed up wetting speed. It is more suitable for uncleaning process to reduce the welding force and reduce welding beads.

      2  The establishment of  temperature curve

      The temperature curve is the curve of the temperature of a point on the SMA will change over time when SMA through the reflow oven. The temperature curve provides an intuitive method to analyze the temperature change of a component during the whole reflow process. This is very useful for obtaining the best weldability, avoiding damage to the components due to overheating, and ensuring the quality of the welding.

      The following is a brief analysis of the preheating section.

      2.1 preheating section

      The purpose of this section is to put PCB at room temperature as soon as possible heating, to achieve second specific targets, but the heating rate should be controlled in the appropriate range, if excessive, will produce thermal shock, circuit boards and components may be damaged; if too slow, will not fully solvent, affecting the welding quality. Due to the rapid heating rate, the temperature difference in the rear section of the temperature zone is larger than that in the SMA. In order to prevent the damage of thermal shock to the component, the maximum speed is 4℃/s. However, the normal rise rate is set to 1-3℃/s. The typical heating rate is 2℃/s.

      2.2 heat preservation section

      The heat preservation section is the area where the temperature rises from 120℃-150℃ to the melting point of the solder paste. Its main purpose is to make the temperature of each element in the SMA stable and minimize the temperature difference.In this area, the temperature of the larger components can have enough time to catch up with the smaller components and ensure that the flux in the solder paste is fully volatile. The oxide of the soldering plate, the solder ball and the pin of the element is removed, and the temperature of the entire circuit board is balanced until the end of heat preservation section. It should be noted that all elements on the SMA should have the same temperature at the end of heat preservation section, otherwise, entering the reflux section will cause various bad welding phenomena due to the uneven temperature of each part.

      2.3 reflow  section

      In this area, the temperature of the heater is set to the highest, which makes the temperature of the component up to the peak temperature. In reflow sectionthe,the different of peak temperature is according to the solder paste to change, the general recommendation for solder melting point temperature plus 20-40℃. For 63Sn/37Pb solder paste with melting point of 183℃ and Sn62/Pb36/Ag2 solder paste with melting point of 179℃, the peak temperature is generally 210-230℃. Reflow time should not be too long to prevent adverse effects on SMA. The ideal temperature curve is the smallest area covered by the “tip zone” of the solder melting point.

      DIP, PCB Assembly,Chip Mounter, Pick and Place, IC Mounter, High Speed Mounter, Wave soldering,LED lighting, LED Lamp, LED Display, LED tube,UPS, Power Converter, Power Adepter, Mobile Charger, PCB board handling system, Loader, Unloader, Conveyor,Shuttle, Chip Mounter, Pick and Place, IC Mounter, High Speed Mounter Induction Cooker, AC, Electric Cooker, Fan, TV, Settle Box

      Reflow oven process principle and introduction

      The reflow oven process principle and introduction

      As we know,reflow oven is the most important welding technology in surface mount technology. It has been widely used in many industries including mobile phones, computers, automotive electronics, control circuits, communications, LED lighting and many other industries. More and more electronic devices are converted from through hole to surface mount, and reflow oven  replaces wave  soldering is a obvious  trend in welding industry.

      So what is the role of reflow oven equipment in the increasingly mature lead-free SMT process? Let’s take a look at the whole SMT surface mount line:

      The whole SMT surface mounting line consists of three parts, such as steel mesh solder paste printing machine, SMT machine and reflow oven furnace. For the machine, and compared with lead free, and no new demands on the equipment itself; for screen printing machine, and a lead-free solder paste in the physical properties there are some differences, so put forward some improvement on the device itself, but there is no qualitative change. the key of lead-free  is  in the reflow oven.

      The lead paste (Sn63Pb37) melting point of 183 degrees, if you want to form a good weld must have the thickness of 0.5-3.5um intermetallic compounds in welding, intermetallic compound formation temperature is above the melting point of 10-15, the lead welding is 195-200. The maximum withstand temperature of the electronic device on the circuit board is generally 240 degrees. Therefore, for lead welding, the ideal welding process window is 195-240 degrees.

      Because of the change of melting point of lead-free solder paste, lead-free welding has brought great changes for welding process. At present, the lead-free solder paste is Sn96Ag0.5Cu3.5 and the melting point is 217-221 degrees. Good lead-free solder must also be formed 0.5-3.5um thickness intermetallic compounds, intermetallic compound formation temperature is also above the melting point of 10-15 degrees, for lead-free welding, that is, 230-235 degrees. Since the highest temperature of lead-free solder electronic device will not change, therefore, for lead-free soldering, ideal welding process window is 230-245 degrees.
      The substantial reduction of process window brings great challenge to ensure welding quality, and also brings higher requirements to stability and reliability of lead-free wave soldering equipment. Because the equipment itself is coupled with the electronic device transverse temperature difference, due to differences in size of heat capacity will produce temperature difference in the heating process, so in the process control of lead-free reflow oven can be adjusted in the process of welding temperature window becomes very small, this is the real lead-free reflow to the difficulty.


      PCB Loader/Unloader The latest introduction to 2017

      PCB  loader/unloader

      The latest introduction of PCB loader/unloader 2017

      Characteristics of the equipment.

      PCB Automatic UNloader PCB conveyor

      1.Special aluminum alloy mechanism to better understand the operation status of magazines.

      1. Stable casting platform structure design, improve the stability of equipment 0.3. Panasonic PLC control, multi-function circuit and program design, performance stability, ensure the smooth and smooth production line.
      2. Humanized programming, 4 kinds of PITCH selection, can set the step distance of receiving/transmitting PCB.

      3. Standard SMEMA communication interface, which can communicate with other automation equipment.

      4. The material box shall be transported by the engineering plate.

      5. Adjustable push plate speed control.

      6. Three-point positioning type upper and lower pneumatic clamping, ensure the location of the material box is accurate.

      7. Push plate protection system to ensure that PCB board is not crushed, reducing process loss. This equipment adopts SMT circuit board production line operation

      PCB size: (mm):   50 x50~330 x445
      Working height (mm): 900 + 20 (STD)
      groove Change time:   bout 6 seconds
      The machine size :1650(L)845(W)1250(H)
      Step selection: mm
      Power supply:  AC 110/220v plus or minus 10V, 50/60hz knife bank
      Dimensions (L * W * H, MM) : 355 (L) * 320 (W) * 565 (H)
      Air pressure and gas flow : 4-6bar / 10 litres/min
      Weight (KG):140 kg

      自动装载机 PCB loader


      This equipment is used SMT circuit board production line operating upper and lower plates

      PCB SIZE:(mm):50×50~330×250
      Working height (mm):900±20(std)
      Tank replacement time: about 6 seconds
      Machine dimensions:1920(L)845(W)1250(H)

      Step Select: mm
      Power Supply: AC 110/220V±10V, 50/60HZ
      Magazine size (LWH,MM):355(L)320(W)565(H)
      Barometric pressure and gas flow rate: 4-6bar/up to 10 l / min
      Weight (KG):260KG

      PCB Automatic UNloader
      PCB Automatic UNloader


      SMT loader

      SMT loader
      This equipment is used SMT circuit board production line operating upper and lower plates
      AI smt线
      AI smt line           

      If you want to get more product introductions, please contact us:


      Full Line SMT line for LED info@smthelp.com ROI

      Timely Support for India’s Rapid SMT Growth

      Southern Machinery's LED Solutions

      Timely Support for India's Rapid SMT Growth

      India's LED and Surface Mount Technology market is poised for extensive growth. There is much development, strategic planning, and intelligent decisions to make along the way. But the direction and decisions that key electronics manufacturing players make in India today will speak to a future of leadership in LED Manufacturing as a whole, not just for India but worldwide. The LED market is expected to grow 20% per year and the Surface Mount Industry expected to reach a turnover of $5.42 billion by 2022, that is a CAGR of 8.9% 2017-2022.

      Between SLNP (Street Lighting National Project), UJALA (Unnat Jeevan by Affordable LEDs and Appliances for All) which aims to supply domestic LEDs to constituents, and (DDUGJY) Deen Dayal Upadhyaya Gram Jyoti Yojana which is a government plan designed to provide continuous power supply to rural India as well as distribute 27.3 million LED bulbs, there is a green surge of job and business creation that has so far saved 34,239 mn kWh/year and INR13,696 Cr/ year. In addition to relieving the planet of 2,77,33,505 tons CO2/year these measures are creating an urgent demand for EMS and ODM to become extremely serious about urgent planning and implementation. But this implementation doesn't come without careful analysis of suppliers. Reliable suppliers will be poised for optimal supply chains that build smart factories for the future with traceability, full automation, minimization of costs, top quality and reliability with 24 hour technical and automated support.

      Key players in the India LED market are ramping up their automation and bringing full factory assembly, including SMT circuit board manufacturing, in house. This model will be ideal moving forward into a globalized, longevity-based model. Self-sufficiency in LED and electronic manufacturing will be a driving force toward complete automation process. Key players are aiming, not for just name brand but for high quality, full support systems in this burgeoning market. Key players include:

      Key LED Categories

      • Philips India Limited
      • Havells India Limited
      • Bajaj Electricals Limited
      • Syska LED lights Pvt. Ltd.
      • Surya Roshni Limited

      Key LED Types

      • Street lights & Flood Lights
      • Bulbs/ Lamps
      • Luminaires
      • Strip Lights

      Key LED Categories

      • Roadways & Area lights
      • Residential lights
      • Commercial & Industrial lights

      Urgency to ramp up EMS production facilities are in full swing. Even companies like Everready, known for their battery production are ramping up their LED manufacturing segment. Now is the essential time for factories to move forward with plans based on current and future forecasting.

      Full line manufacturers in India are poised for great advantages as the world not only moves toward solid state lighting and increased EMS demands. Sample Line up:

      Full Line SMT line for LED info@smthelp.com
      Full Line SMT line for LED info@smthelp.com ROI

      Quantifying PCB Design Efforts with μPCBComplexity


      Quantifying PCB Design Efforts

      The current design approach to PCBs does not fully account for quantifying efforts toward understanding the full scope of what a PCB design project can cost in its totality. It is valuable to consider the methods established to solve this problem proposed by Gollapudi Ramya and M.Anil Kumar in their study "μPCBComplexity" featured in the International Journal of Engineering Research and Applications. These methods are continually being evaluated, yet there is room for establishing an official algorithm for calculating the efforts (time & costs) for PCB design for your factory.

      Factors that Contribute to the Complexity of Design Include:

      # passive

      # digital

      # analog

      # mixed signal

      Total #

      Total area (mm2)





      Mixed Signal

      PCB Size (mm2)

      # of sides with components

      # of routing layers

      # of layers


      Component Density


      Pin Density

      μPCBComplexity (hours)

      Productivity Factory (level of designer experience)

      Equations to Measure μPCBComplexity:

      info@smthelp.com pcb complexity

      Whereby ρ is a constant measuring design team productivity, per company/team, inversely proportional to S, the aggregate set of statistics that are weighted by (w) a constant associated with it which assigns a weight to the importance of every statistics used in the model.

      Sample Measuring μPCBComplexity:

      PCB Complexity Measurements

      Finally, the factors that contribute to time and costs loss by not pre-calculating PCB design efforts should be allocated and quantified for best practices of design model systems. Only when we can begin to quantify complexity and relate that to design efforts will we be able to mark a designated expected outcome for cost and time.

      PCB AOI Testing

      THT Dual Sided AOI

      THT Dual Sided AOI

      THT Dual Sided AOI (DIP AVI)  - Before or after wave soldering, use high speed in-line AOI solution – Applicable for • Before or after Wave solder THT/DIP component insertion check (DIP through hole component) • Optional: Press-fit inspection ability of pressing parts • Optional: SMD component placement test ability.

      IoT Integration Across Industry | Smthelp.com

      Industry 4.0 Requires… Automation

      The IoT Movement in Electronics Manufacturing

      Industry 4.0 Requires... Automation

      In the next revolution of manufacturing IoT, or Internet of Manufacturing, many adaptions will need to be made in order to reap the benefits of a truly smart factory that optimizes time, work force, efficiency, materials, supplier and full chain data analytics monitoring. But the key benefits that stand to be achieved are a great boost for the electronics manufacturing floor and business model. What do Electronics Manufacturing factories stand to gain from Industry 4.0? Here are some major improvements that can be expected:

      1. Smarter Supply Networks
      2. Intelligent Manufacturing Systems (remote visualization and engineer integration, remote monitoring, alerts, control, and remote production scheduling)
      3. Cloud Storage – secure processing, data storage and sharing on cloud network
      4. Advanced Decisions based on Data Analytics and real time monitoring
      5. Encrypted Technologies to protect against cyber threats
      6. Intelligent Sensors – integrated into machines that communicate on a wireless network that share data and analytics
      7. Smart Maintenance – predictive maintenance, remote monitoring and maintenance
      8. Mobile workforce - Augmented Reality devices for workers to process real-time alerts and information remotely
      9. Cyber physical system of interconnected social machines that work together to improve efficiency
      10. Robotics – use of flexible automated machines that can interact with humans and other machines
      11. Product intelligence – products that carry information for data analytics and decision making

      Suppliers in IoT Manufacturing

      Some vendors will be more interested in investing in your efforts to elevate to a 4.0 Industry factory by improving systems, using AR/VR/MR technologies to connect you to your machines, providing solutions and plans for upgrading to full automation. But the bottom line is that the trajectory to Industry 4.0 will require automation on every level that can possibly connect to a smart grid system of machine analytics, communications, control, and decision-making.

      Solutions like real-time solder monitoring, data exchange formats like XML, and new standards of machine communication, like transitioning from SMEMA to more interconnected methods of SMT communication are on their way. Be prepared to work more closely with vendors based on their preparedness to serve this new model. Many major EMS factories are beginning to test the waters of integration in Industry 4.0. But the one thing that will be required of all future models of Electronics Manufacturing is automation of machine monitoring, engineering, communicating, delivering, and more. Automation is the key component moving us from sluggish manual system of unpredictable output to measurable systems with multiple streams of highly integrative data aimed at top performance decision-making.

      IoT Integration Across Industry | Smthelp.com

      AI, Auto Insertion : Axial Inserter; Radial Inserter; JW (Jumper Wire) Inserter; Odd form Inserter; PIN inserter; Eyelet Inserter; Terminal Inserter IM, Insertion Mount, MI,Manual Insertion, DIP, Wave soldering

      6 Key Technologies for LED Pick & Place Machines

      6 Key Technologies for LED Pick & Place Machines

      At present, LED lighting products, environmental protection and energy saving, cost-effective features have been accepted by the market, while governments have introduced policies, phasing out incandescent, LED in the promotion of indoor lighting applications, LED light industry will become a solution to energy and the environment The term synonyms, LED lighting market rapid development. This rapid development will inevitably involve the LED placement machine, LED production equipment, the rapid development of the field.

      First, SMT and placement machine

      Surface mount technology (SMT), can also be called surface assembly technology, surface mount technology and patch welding technology. It is a board-level electronic assembly technology that mounts surface-mounted components (SMDs) onto printed circuit boards (PCBs). At present, advanced electronic products, especially in computer and communications electronics, has been widely used surface mount technology.

      1.1 Advantages of SMT

      SMT is with the development of the electronics industry was born, with the electronic technology, information technology, computer application technology development and development. The rapid spread of SMT benefits from its advantages.

      1) components assembly density, electronic products, small size, light weight.

      2) easy to achieve automation, improve production efficiency.

      3) high reliability. Automated production technology ensures reliable connection of each solder joint, and because the surface assembly components (SMD) is leadless or short lead, and firmly mounted on the PCB surface, so its high reliability, seismic capacity Strong.

      4) High frequency characteristics are good. Surface Assembling Components (SMD) No pin or segment pins, not only reduces the impact of the distribution characteristics, but also on the PCB surface welding solid, greatly reducing the parasitic capacitance and parasitic inductance between the lead, so to a large extent Reduce the electromagnetic interference and radio frequency interference, improve the high-frequency characteristics.

      5) reduce costs. SMT PCB wiring density increases, reduce the number of holes, the area becomes smaller, with the function of the PCB layer to reduce the PCB manufacturing costs are reduced. Leadless or short lead SMC / SMD saves lead material, omitting thread cutting, bending process, reducing equipment, manpower costs. Increased frequency characteristics reduce RF commissioning costs. Electronic product volume reduction, weight reduction, reducing the cost of the machine. Welding reliability is good, making the cost of rework reduced.

      LED lighting SMT PCB  13

      1.2 SMT basic process

      (1) SMT is a system engineering technology

      (2) a typical SMT production line

      1) to form a SMT production line must have three important equipment: printing press dispenser, placement machine, reflow furnace wave soldering machine, which wave soldering this process, with the development of surface mount technology, especially Bottom Lead IC Package BGA QFN a large number of applications, its role becomes more and more inadequate, so the current mainstream or reflow this process.

      2) Whether it is for large machine manufacturers or medium-sized machine manufacturers, the classic can recommend SMT production line generally consists of two placement machine, a high-speed placement machine (chip components placement machine) 1 high-precision placement machine ( IC component placement machine), so that their duties, is conducive to the entire SMT production line to play the highest production efficiency. But now the situation is changing, a lot of placement machine manufacturers introduced a multi-function placement machine, making the SMT production line only by a patch machine composition possible. 1 multi-function placement machine to maintain a high patch speed in the case, you can complete all the components of the placement, reducing investment, by small and medium enterprises, Academy of Sciences of all ages.

      1.3 The simplest placement machine model

      The most basic placement machine consists of rack, circuit board clamping mechanism, feeder (not shown in the figure), patch head, nozzle and X, Y, Z axis, which Z axis in addition to Z can move , And can also be rotated in the θ direction (so as to adjust the rotation angle of the component from the pad).

      1.4 LED placement machine

      On behalf of the LED placement machine is a surface mount technology (SMT) placement machine in a, with the development of LED technology, the traditional SMT placement machine has been unable to meet the LED industry production needs, LED placement machine It came into being.

      LED placement machine is designed specifically for the LED industry, custom SMT placement equipment, used to achieve large quantities of LED circuit board assembly. Equipment requires accuracy is not high, but requires fast speed. LED special placement machine to reduce the cost of patch equipment, and improve production efficiency. At present, many types of LED placement machine, but whether it is automatic high-speed placement machine or manual low-speed placement machine, their overall layout is similar.

      Automatic LED placement machine is a computer control, collectors electrical as one of the high-precision automation equipment, by the rack, PCB transmission and bearing organization, drive and servo positioning system, placement head, feeder, optical identification System, sensor and computer control system, which through the suction - displacement - positioning - placement and some other functions, completed the SMD quickly and accurately mounted to the PCB board.

      1.5 LED placement machine and the difference between the traditional placement machine

      LED lighting SMT PCB  3

      LED placement machine mainly to meet the 3014,2835,3528 and 5050,5630,5730 lamp beads placement accuracy requirements. Relative to the traditional placement machine processing accuracy, LED placement machine requirements are relatively low. But the LED placement machine is more focused on the performance, that is, the stability of the machine running, speed, operability, size requirements, so the requirements of the LED placement machine must have the following design ideas and hard requirements.

      1) intelligent means more mature to use to the LED special placement machine, all kinds of excellent performance of the sensor can be implemented in the operation of the full collection of data to the computer disposal to protect the stability of the entire placement process and reliability. At the same time and other equipment, according to the scientific methods and technical specifications, regular LED placement machine maintenance, such as the machine and the circuit board surface dirt cleaning and washing, can effectively prevent the dust and dirt caused by poor internal heat dissipation, Causing overheating burnout devices. LED placement machine has a good stability in order to maximize efficiency for enterprises to produce benefits and reduce production costs.

      2) LED placement machine speed must be fast, the minimum 18 000 points / h above the placement speed.

      3) easy to learn and user-friendly operation method can greatly shorten the training time, and in the production process to reduce misuse, improve production efficiency and product quality.

      4) LED placement machine can be mounted at least 1 200 mm length of the PCB, because a large part of the LED is to replace the traditional light pipe lighting, so the length will greatly exceed the traditional PCB size. In addition to these, in order to ensure that a single LED light board without color, requiring the placement of the entire batch of LED lights for the same color temperature BIN (BIN generally represents the LED lamp beads of some parameters range, different range can be used in different Number, said these parameters include voltage, color temperature, brightness, etc., so there will be voltage BIN, color temperature BIN, brightness BIN this argument, you can use BIN on behalf of the product model).

      1.6 China LED placement machine technology development

      As a fourth generation of light source of the huge market potential, coupled with the strong support of government policy, the domestic LED lighting industry is almost leapfrog development. From the early LED display hot, to the current transition to LED commercial lighting, interior lighting, outdoor lighting, lighting engineering, LED products from a single hot products, the transition to the field of LED applications and popularization.

      LED development led to the relevant equipment industry hot, reflow, wave soldering, printing presses, LED placement machine, LED packaging equipment, the momentum of rapid development. At present, most of the domestic LED equipment can be mounted 1.2 m light board of the small placement machine, basically use the platform movement structure, combined with double swing arm movement, to achieve LED placement. Track LED placement machine in the country less. This is the next step, many enterprises in the development of a direction.

      At present, the domestic LED placement machine technology is still in a primary stage. Developed products, can only meet the early needs of some small and medium enterprises. China is an electronics manufacturing power, need different grades of domestic LED placement machine. It must be based on the actual situation preferred models, reduce the difficulty of domestic LED placement machine development, rapid access to the electronic equipment industry.

      Second, LED placement machine the most critical technology

      2.1 precision machine photoelectric integration technology

      In the process of LED placement machine, this technology reflects: the placement of the head through the precise mechanical movement of the components from the feeder to pick out and through the calibration body, the accurate and rapid installation of components to the PCB board The

      2.2 visual technology

      Take non-stop fast shooting positioning technology, to achieve optical image capture positioning, flight alignment.

      2.3 magnetic levitation technology

      Can solve the high speed and patch precision motion control technology Magnetic levitation linear motor drive applications, improved the original servo rotary motor screw screws exist low speed, noise shortcomings. Linear motor applications are magnetic levitation technology, no friction when moving, no resistance, high speed, long service life.

      2.4 efficient intelligent software technology

      With the composition and structure of the placement machine increasingly complex and diversified, the importance of placement machine software technology is more and more reflected. Efficient real-time multi-task parallel processing operating system, intelligent placement process optimization, automatic diagnostic technology is bound to greatly improve the efficiency of production and product quality.

      LED lighting PCB 9

      2.5 modular and system integration technology

      The purpose of modular and system integration technology is to propose optimized and improved solutions for the three basic requirements of speed, accuracy and flexibility of LED placement machines. Flexible modular technology emphasizes the portability, interoperability, scalability and configurability of the device, providing a reconfigurable and openability of the device control platform to control requirements, enabling simple and efficient construction and completion of specific requirements Surface mount equipment to improve assembly productivity.

      2.6 Motor uses lightweight design concept

      Can significantly reduce the weight of the machine part of the movement, which makes the operation of the machine when the power consumption is also significantly reduced to only 1/4 of the ordinary placement machine consumption, power consumption up to 1/4 of the ordinary placement machine; LED placement machine The placement accuracy is not demanding, but requires faster. At present, the domestic professional for the LED placement machine, there are several to do, according to the speed can be divided into four different, six, eight equipment, you can refer to Taimu Rui LED640, LED660 V and LED680 V several LED special stickers The actual understanding of the machine. The middle of that number represents the number of patch head number. The higher the number, the higher the speed. LED placement machine mainstream applications should be able to mount a large area of ​​the PCB board, to meet the requirements of the online, so as to ensure the speed.

      Third, LED placement machine development trend

      LED placement machine in the manufacturing process plays a very important role in contemporary mainstream electronic assembly technology production equipment in the largest investment, the most technologically advanced, SMT production line production capacity and production efficiency of the largest equipment. In fact, the most failures, the speed bottleneck is largely from the patch of this process, so the development of placement machine equipment is the most compelling. Currently has the number and advanced level of placement machines, has become a business, regional or national electronic manufacturing capacity of the key signs. Here the development trend of the current placement machine described below.

      3.1 LED placement machine is moving towards higher precision

      Mounter accuracy refers to the placement machine X, Y-axis navigation movement of the mechanical precision and Z-axis rotation accuracy. Mounter using sophisticated mechanical and electrical integration technology to control the mechanical movement of the components from the feeder to capture and through the calibration mechanism after the precision and reliable placement to the circuit board. In order to produce products with higher performance, the first major challenge is to improve the placement accuracy of the placement machine. The following from the LED process began to say with a more accurate LED placement machine may be the future of LED production of the revolutionary impact.

      In the ordinary LED packaging technology, the chip electrode with the support of the pin is generally connected through the gold wire to achieve the way, but the golden wire break has been one of the common causes of failure. LED lighting applications in the gold line is the cause of dead lights and light failure of such a common problem of the culprit. Dead lights can be divided into two cases, one is completely not bright, the other is hot state is not cold or bright, or flashing. The main reason for the absence of electrical circuit is open circuit, the reason is because the gold wire Weld or poor contact.

      With the introduction of flip-chip welding technology, the two can be connected through a more stable metal bumps to connect, save costs and greatly improve the reliability and cooling capacity. LED has a long life and other advantages, with the flip-chip technology than the traditional use of gold wire interconnect packaging technology to play the advantages of LED, LED flip-chip welding technology to achieve a single chip and multi-chip module without gold Solid crystal plastic packaging, with high brightness, high light efficiency, high reliability, low thermal resistance, good color consistency and many other advantages.

      LED non-gold line package that the industry commonly known as "no package" "free package." This process is the use of flip chip and circuit board direct SMT paste, the SMD package process omitted, directly flip the chip with SMT method to fit on the circuit board or carrier, because the chip area is much smaller than the SMD device, so This process requires a very sophisticated design.

      The future of LED placement machine to improve the accuracy of the basic conditions, the direct use of flip-chip package without the process, which will be a small revolution LED process, you can save a lot of packaging costs, and greatly improve the production costs and shorten the production cycle, Making LED products really high performance and low price to enter the general lighting market. The LED placement machine directly to the LED process, great potential to become the future trend of technology.

      LED lighting PCB 8

      3.2 LED placement machine is developing in the direction of high efficiency

      One of the most important features of today's society is competition. It is this competition that inspires people to explore innovation; it is this competition that promotes the ever-changing development of science and technology. Driven by the LED lighting market in full swing, LED placement machine's efficient work must become the core competitiveness of the embodiment. High efficiency is to improve production efficiency, reduce working hours, increase production capacity, and create economic benefits. On the basis of the current efficiency of the main methods are: to strengthen the LED placement machine automation performance and improve the equipment structure and work mode.

      3.2.1 to strengthen the LED placement machine automation performance

      The development and perfection of information science and technology today has greatly promoted the level of automation, such as automatic control, automatic adjustment, automatic compensation, automatic identification and so on to self-learning, self-organization, self-maintenance, self-repair and other higher level of automation become possible. At the same time for the placement of this automated CNC equipment, the efficiency of software programming to improve the efficiency of equipment is also essential to develop a more powerful software function system