How to remove the misprinted solder paste on the PCB surface?
Prepared by Ming
firstname.lastname@example.org This article describes that paying attention to some details can often prevent common problems in assembly processes and equipment selection.
Question: Can I use a small spatula to remove misprinted solder paste from the board? Will this get the solder paste and small tin beads into the holes and small gaps?
Answer: Using a small spatula to remove the solder paste from the misprinted board may cause some problems. It is generally practicable to immerse the misprinted board in a compatible solvent, such as water with an additive, and then remove the small tin beads from the board with a soft brush. I prefer to soak and wash repeatedly instead of violent dry brush or shovel. After the solder paste is printed, the longer the operator waits to clean the misprint, the harder it is to remove the solder paste. Misprinted boards should be placed in the soaking solvent immediately after the problem is discovered, as the solder paste is easily removed before it is dried.
Avoid wiping with a strip of cloth to prevent solder paste and other contaminants from smearing on the surface of the board. After soaking, brushing with a gentle spray can often help remove unwanted tins. It is also recommended to dry with hot air. If a horizontal stencil cleaner is used, the side to be cleaned should face down to allow the solder paste to fall off the board.
As usual, note that some details can eliminate undesirable conditions, such as misprinting of the solder paste and removal of the solder paste from the board. It is our goal to deposit the right amount of solder paste at the desired location. Stained tools, dry solder paste, and misalignment of the stencils and plates can cause undesirable solder paste on the underside of the stencil or even the assembly. During the printing process, the template is wiped with a certain pattern between printing cycles. Ensure that the template is seated on the pad, not on the solder mask, to ensure a clean solder paste printing process. On-line, real-time solder paste inspection and inspection prior to reflow after component placement are process steps that reduce process defects prior to soldering.
For fine-pitch stencils, if damage is caused between pins due to thin stencil cross-section bending, it can cause solder paste to deposit between the pins, causing printing defects and/or short circuits. Low viscosity solder paste can also cause printing defects. For example, high operating temperatures or high blade speeds can reduce the stickiness of the solder paste during use, resulting in printing defects and bridging due to excessive solder paste deposition.
In general, the lack of adequate control of materials, solder paste deposition methods and equipment are the main causes of defects in the reflow soldering process.
Question: What type of assembly board depaneling equipment provides the best results?
Answer: There are several sub-board systems that offer a variety of techniques for slab assembly boards. As a rule, there are many factors that should be considered when selecting such a device. Regardless of whether there is routing, sawing or blanking to separate individual panels from the composite panel, stable support during the splitting process is the most important factor. Without support, the resulting stress can damage the substrate and solder joints. Distorting the plate, or stressing the assembly during the splitting, can result in hidden or significant defects. While sawing often provides minimal clearance, shearing or die cutting with tools can provide cleaner, more controlled results.
In order to avoid component damage, many assemblers attempt to maintain component solder joints at least 5.08 mm from the edge of the board when the splitter is required. Sensitive ceramic capacitors or diodes may require extra care and consideration.
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0201 assembly, from difficult to conventional placement
This article explains and discusses the guiding principles governing 0201 placement in both high-volume and high-mix assembly operations.
By Ming Gan, email@example.com
Although generally considered to be a relatively recent development, printed circuit boards (PCBs) have been available since the early 1950s. Since then, the demand for smaller, lighter, and faster electronic products has driven electronic components, PCB, and assembly equipment technology toward SMT. The earliest general acceptance of SMT occurred in the early 1980s, when machines such as the Dynapert MPS-500 and FUJI CP-2 entered the market. At that time, 1206 (3216) resistors and capacitors were the most popular placement components. However, in one or two years, 1206 gave way to 0805 (2125) as the most common component package for SMT placement. During this time, both machines and components evolved rapidly. As the machine became faster and more flexible, the 0603 (1608) component began to evolve. At this point, many assembly machine manufacturers went back to the R&D, research and development lab to re-evaluate the technology used to accommodate these newer, smaller components. Higher resolution cameras and smaller vacuum nozzles are among the variations that these components bring to the assembly equipment. The emergence of 0402 (1608) packaging poses further challenges in all aspects of PCB assembly. In terms of machine development, vacuum nozzles have become smaller and more fragile. A new focus is placed on the component’s feeder, which acts as a unit for improvement, giving the machine more accurate parts. With the advent of 0402 components, process challenges have increased to those that need to be addressed for successful component placement. Solder paste printing becomes even more critical – stencil thickness and solder paste mesh are increasingly important process considerations. The technology required for such placement also involves significant new costs. The combination of these factors creates a new form of packaging that is the slowest to adopt in the history of the electronics industry. In total, for almost five years, 0402 packaging was widely accepted in the industry – and many assembly plants today never put a 0402 sheet. Now, I entered 0201. Over the past year and a half, 0201 placement has been a key topic of discussion throughout the industry. Due to the size, weight and power consumption requirements, many OEM board assemblers need to incorporate even smaller components and technologies into their products. Contract manufacturers (CM, contract manufacturer) must also have new technologies to keep the assembly process up to date and provide customers with a complete range of services. For machine builders, the challenge is to develop more resistant to obsolete assembly equipment in an era of dynamic technological change.
0201 placement challenge The placement of the 0201 component is more challenging than the component intervention in front of it. The main reason is that the 0201 package is approximately one-third of the corresponding 0402 size. The previously acceptable machine placement accuracy immediately became a limitation of the introduction of 0201. In addition, the traditional industrial tapeding specification allows for too much movement for reliable 0201 placement, and the level of process control must be increased to make the 0201 placement a production reality. Although these obstacles are very large, they are far from insurmountable. Of course, they need all the determination, because the technology necessary for the 0201 placement requires a lot of money and top management’s promise of research and development (R&D).
The key to reliable 0201 placement At FUJI, the aggressive R&D program has produced the ability to make all circuit assembly machines compatible with 0201 at 100% speed, with a minimum suction reliability of 99.90%, a target suction reliability of 99.95%, and minimal placement reliability. It is 99.99%. In the beginning, every aspect of the design was evaluated for its ability to work on a complete 0201 program, and the combination of single elements of closely related machine component parameters proved critical to success. These parameters include:
Figure 1 Component feeder table. The R&D program concluded that the ability to precisely position the carriage table – and make minimal adjustments to compensate for the inaccuracy of the tape – is a key factor in achieving component pickup reliability above 99.95%.
To achieve this, the feeder table must be precision machined to ensure repeatable positioning of the individual feeders and combined with a high-resolution semi-closed-cycle servo system using a two-track linear moving guide. This design allows for minor adjustments – based on the results of the suction accuracy as judged by the vision system. This ensures that the component is as close as possible to the center. Component feeder. The feeder must be manufactured to extremely tight tolerances to ensure repeatability of the suction position, regardless of component height and a large number of possible component positions. The mechanism used to position and lock the feeder in position must be durable and precise, yet be user friendly. In addition, the materials used to make the feeder must be high in strength and light in weight to allow for ergonomic operation while ensuring precise, repeatable delivery of the carrier tape. The feeder drives the sprocket. The drive sprocket plays a key role in the ability of the machine to position the component tape. The shape, taper and length of the drive sprocket teeth significantly affect the ability of the feeder to position the tape. Other factors have also been investigated, such as the diameter of the drive sprocket and the number of belts in contact with the sprocket. Changes to the basic sprocket design resulted in improved positioning accuracy, with earlier designs increasing by 20% in the X direction and 50% in the Y direction.
Figure 2 sucks the head. After properly feeding the component, the next step is to draw the component onto the vacuum nozzle and bring it to the board. Vacuum nozzles are compliant to absorb shock during pick-and-place components, compensate for small variations in solder paste height, and reduce the risk of component breakage. For these reasons, the nozzle must be able to move within its fixture.
Material selection, material hardness, machining tolerances, and thermal characteristics must all be understood to construct a reliable suction head. The nozzle must move freely within its holder without sacrificing accuracy (Figure 1). The nozzle shaft is assembled. The nozzle shaft is also a key design element – eliminating overdrive by keeping the entire nozzle in direct alignment with the shaft assembly. Overpressure is caused by the inertia generated when the head is moved up and down. If the nozzle and the shaft are not in a straight line, there is a little whip – or overpressure. Overpressure causes a change in positioning accuracy, which is determined by the speed of movement, the weight of the nozzle, and the weight of the component. By eliminating overpressure, direct alignment reduces the number of negative factors associated with component pick-and-place placement (Figure 2). Figure 3 nozzle design. Variations in the design of the nozzle are an important factor in allowing the 0201 component to be received. In order to draw a 0.6×0.3 mm component, the nozzle must have an outer diameter of no more than 0.40 mm. This forms a long, thin nozzle shaft that is fragile but must also maintain precision to maintain high reliability of suction. Changes from the linear axis to the tapered design increase the nozzle strength and allow the nozzle to resist bending (Figure 3). Matrix structure. All machines generate vibrations during operation. The base frame design is a key first step in reducing the speed and motion effects of vibration and harmonic resonance. By using a cast iron base frame and state-of-the-art structural technology, vibration and harmonic resonance can be reduced to a controllable level within the machine, so that negative effects can be dealt with. Up to standard Through all six key factors, the obstacles to reliable 0201 placement have been eliminated. As a result, R&D’s focus has shifted to newer, smaller components, and 0201 is no longer considered a leading edge component packaging technology. For 0201 component placement, the accepted process window is approximately 75 μm X and 75 μm Y at 3 。. To achieve 6 贴 placement reliability, the X and Y tolerances must be reduced to 50 μm. The latest high-speed placement equipment has a rating of 66μm with an actual standard deviation of approximately 35~45μm. As the 0201 component becomes more widely used and the manufacturing process becomes tighter, improved accuracy can be achieved. The difference in component size between suppliers poses a challenge to 0201 feeding and placement. Bulk feeding is being opened and should be available in 2001. Although the machine now has this capability, only a small percentage of users will be ready to take the 0201 placement in the next 12 to 24 months. This is similar to the introduction of a ball grid array (BGA) and 0402 components, in which the machine’s capabilities are ahead of the process state.
Challenge ahead While the placement of 0201 components is now a standard feature of new placement equipment, additional work is needed to improve the overall process for the end user. The relationship between machine builders, component suppliers, board manufacturers, formwork factories, and solder paste manufacturers needs to be strengthened to create a more seamless development process. The end result will be a unified understanding of the process and a better working relationship that will benefit end users, especially by making new production technologies faster and more efficient.
Bulk material handle method and process on SMT production line
SMT patch bulk material problems have plagued many SMT people, as we all know, once the placement machine starts, there will definitely be a problem in the SMT production line. For a variety of reasons, many bulk materials are produced, thrown, or are originally bulk materials, or other reasons. Some bulk materials, such as resistors, capacitors, inductors, etc., are not easily distinguishable and have little value in themselves, and there is no value for reuse. However, for large devices, especially some imported chip components, they are of high value and can be distinguished and distinguished, so they are generally reused. However, for scattered components, if the original package is a tray or a suitable tray, the problem may be solved better. Otherwise, it may be more difficult to handle. Southern Machinery today will talk about the handling of bulk material in the SMT production line. Method and process. First, the bulk material handle process
Collecting materials – material personnel sorting materials – using electrostatic bags to pack – paste material specifications – technicians based on bulk material springboard – hand paste bulk material – QC confirmation
Second, the definition
Bulk material: refers to the components that are separated from the original packaging during the production process due to machine throwing, or loading and unloading materials.
Third, job responsibilities
Material staff: responsible for the collection, classification, identification, storage, placement, and placement information of bulk materials, and the material loss rate is calculated according to the order.
QC in front of the furnace: responsible for the manual placement of bulk materials, the front back grain and material code confirmation, PCBA mark, and the classification of bulk materials.
Technician: Responsible for programming, patch production, monitoring patch quality distribution and timely improvement.
QC after the furnace: It is responsible for checking and checking the first piece of all the machines, and the quality is abnormal. Immediate feedback is provided to the front station to improve and track.
Fourth, the work content
In the production process, the material may be thrown due to equipment and other factors, so the operator should check the material step before the patch and after the shift, and check the throwing box and the trash can each time the garbage is dumped. Collect the bulk material and report to the supervisor about excessive bulk material anomalies.
According to the shape of the components, the bulk material is classified according to the shape of the components, and the back code of the components is checked to determine the material code. Then, the checked bulk materials are packed in anti-static bulk box or bulk bag, and the material code identification is performed to confirm the signature of the person. .
When using machine mounting, the operator should first check whether the components are consistent with the normal materials, confirm the material number, and then load the FEEDER tape.
The first piece of material feeding / mid-way refueling, the technician firstly inspects the materials that will be short of materials in the machine half-hour in advance, and collects the materials of the same item number in the component preparation area, and check them correctly, and submit them to the quality department QC/materials. The staff will check again and confirm the total signature of the refueling sheet.
Automatic wave soldering machine is currently the mainstream of electronic products welding process, compared with other manual welding with a variety of manual, has unparalleled advantages, and thus widely used by electronics manufacturers. The automatic claw wave soldering machine produced by our company is the most advanced using modern high-tech technology.
The new design of crystallization:
(1) Unique automated preparation program;
(2) Perfect work/adjustment function;
(3) The temperature is controlled by the temperature control table of WINPARK. The speed is high and the precision is high. It is suitable for long-distance transmission in harsh industrial environments and has high reliability.
(4) The chain speed is controlled by the frequency conversion speed control motor, which is easy to adjust.
(5) Solder joints are of high quality, easy operation and good service. They are reliable products in this industry.
Thank you for your inquiry and use this machine, thank you very much! Before use, please read this manual carefully. It will provide you with all the functions of the machine thoroughly, and it will be fully utilized in production.
a) Confirm that the machine is connected to three-phase ac380v, 5- line power supply and ensure the machine is grounded properly.
b) Open the total air switch and the switch in the electric control box, then open the power switch on the operator panel.
c) The machine Time control switch is lit, at this time presses the manual/The automatic switch icon, the time control switch displays On state, touch screen lit
d) Touch ( enter ) the button until you enter the operating interface, please refer to the instructions.
3.2time-controlled switch operation instructions
Instructions for use (Time controller is not used for a long time, every three months need to charge once, the charge times <12 hours)
1. first use, or long time after use, when the controller is not displayed, please after the power, with small items in the lower left corner of the hole open.
2. when powered on, the timer is 24-hour system, please hold the “clock” key for 5 seconds, the monitor will display AMin the upper left corner, indicating that it has been the hour system. Press 5 seconds and return to the hour system, at which time AM display is turned off.
(12 hours When AM is the morning, PM means the afternoon)
3. Set switch time: (if the set opening and closing time is the same, the time controller relay suction for a second ) set steps:
Set up a project
Press (SET) (??)
Enter timed setting (show 1 on)
Press (Week) (??)
set every day the same, or week 1-5 the same, week Six Sunday the same, or daily different (if the same daily, you can not press this key, this time does not show the week, while correcting the clock also
No need to press this key)
Press(time) (?)(? )
Set Time to open
Enter the timer setting (show 1 off)
Press(time) (? )(? )
Time to set off
Press (week) (??)
If the date of the set off is the same as open, you may not press this key
Repeat 2-6 steps
Set the 2-8 times switch time
End Time setting
* If you do not need 8 switch timing, press (clock) key can be into the clock correction.
* If set error or cancel set this press (clear)(??) key, and then restore the original settings once again
* Display without setting (–:–)
4.1Press Live (Clock ) and repeatedly press (week ) to the same day. ( if the daily set switch time is the same, can not press this key, direct correction time, points)
4.2Press and hold (the clock) and adjust the time by (time) or (minutes).
5.when you have completed the above operation, pressThe Open/Auto/ off ” key, be sure to base your current time on the set of self
controls the time switch, causes the monitor the most downlink to display as (on / off ) or at off(auto / off)
Indicates that the timer is in automatic control and in the open state
Indicates that the timer is in automatic control and is off state
Indicates that the contact is in a connected state but the timer does not switch on the set switch time
Indicates that the switch time is invalid in the long shutdown state.
6.check: Press (set) key to check whether the time set is correct.
7.Modify : please press (clear ) The key at the setting , then reset the time and week of the timing switch.
8.End check: Press (clock) to finish checking and setting, display clock.
9.Manual control: Press (ON/off/off) key, can realize random switch
1.Open The setting of time, can not cross set, should be set according to the order of time.
2.Implement timing Switch Controlsystem Time to set the state in the auto , that is, show on / off (on) or from Move / Close ( at off).
3.The use of the environment should be in line with the environmental requirements of the controller, to avoid vibration, shock, corrosion, dust, electrostatic, high-temperature, high-temperature, direct sunlight environment to use.
4.Please store it in the rated voltage and temperature and humidity condition.
5.maximum current refers to the maximum current when resistive load, lamp current = rated current x20%, motor current = rated power Flow x30%, please use in the specified voltage and current range, if exceed the specified capacity, please contact the AC contactor.
Chapter 4 Interface Operation
4.1 when the machine electric source button is opened , touch the screen into the Welcome interface ( figure 1 ), waiting about Ten seconds, after the completion of the PLC , the machine automatically open tin furnace heating function.
Figure 1 Startup initial interface
4. 2 Click to touch the screen into the Secretary to introduce the painting surface, such as ( figure 2) Click into the system
Figure 2 Company Introduction
4. 3 Click into the system , touch the screen into the machine to manipulate.the painting surface , as 3.
This painting surface controls all the operation of the machine,
including the manual mode and the self – moving die style.
4.3.1 : Manual mode: Touch screen left upper corner display manual (click to Automatic), manual mode, click Transport, open the chain claw
transport function; Click Preheat, turn on preheat function (must turn on transport to turn on preheating); Preheat temperature to reach, click on the peak, according to the actual product to open the crest, unicast or double wave (long leg wave soldering only a valid), generally only in the back of the red glue patch components need to open the double wave, at this time the peak has been running , the technical personnel can adjust the crest height according to the actual situation; Click on the spray, click the spraying, spray has been working, at this time can adjust the spray size, close to spray, the spray becomes automatic state.
4.3.2 : Automatic mode: Click on the touch screen in the upper left hand corner of the manual switch to Automatic mode, point Open Transport, preheating, as needed to open the crest, spray fog. In the manual mode after adjusting the machine state, at this time the machine can be normal production, when the circuit board into the machine, machine automatic spray, automatic spray, automatic wave soldering.
4. 4 Click on the machine in the lower right corner of the EEG map , the machine into the set interface , as shown in Figure four , this screen is used to set the machine‘s shipping parameters. Spray Distance: This parameter sets the automatic spray time when PCB The board is
transported to the top of the sprinkler start spray, recommended set value to 7 , if PCB
The office has not reached the top of the nozzle has been opened Start Spray, then change
this parameter large, conversely, if PCB after the board is over the nozzle before
beginning to spray, then the parameter is adjusted small;
Spray coefficient: This parameter is not set;
Wave Distance: This parameter is automatic Qipo parameter, when the PCB board is
transported to the front of the tin Furnace, automatic Qipo, this parameter and spray
distance set the same way;PCB board in distance tin furnace 20cm
The peak effect is the best when it is opened.
Wave time: This parameter is the peak after the automatic start of the operation time, it is recommended to set the 50-80.
Figure 4 parameter setting screen
4. 5 Click Control Screen left -pointing arrow chart , into the machine– like monitoring Screen , this screen is used to monitor the operation Status of PLC .
Fig . 5 The status monitor drawing surface
Chapter 5 Installation Adjustment and Commissioning
5.1 Machine Adjustment
After the machine positioning, the level adjustment, first the Foot Cup, so that the rubber wheel off the ground water leveling ruler on the machine to adjust, must make it in a horizontal state.
Adjustment of rail height
(Note: Tin furnace before shaking out, the first tin furnace trolley and rack fixed connection code loosened, and then the tin furnace height lowered, so that the tin furnace nozzle and titanium Claw in the height of a certain gap to avoid damage collision.) The tin furnace can be smoothly shaken out. Note: The foot wave soldering furnace to disconnect the titanium claw first
5.2 Adjustment of Plate feeder
Installation of the machine to install the first access to the plate feeder, the board will be connected with screws fixed, with two
PCB Board to adjust the docking plate, a piece of PCB into the titanium claw inside clamping, a PCB board placed in the plate feeder, two PCB board docking up, By adjusting the plate to the side of the four screw wire To adjust the height of the board connection, so that the two PCB board height parallel, through the adjustment of the machine, such as plate connected to the side of the rice screws to adjust the parallel to the plate feeder and titanium Claw, two fast PCB The joint of the plate butt is completely kissed so that the plate feeder has been installed and adjusted.
Adjustment of 5.2 guideway width
The width of the guide rail can be adjusted according to the different width of the printed board, the printed board Pinto on the Import board, and the printed board side to the fixed edge of the import plate, the rotation width adjustment handwheel to the printed circuit board can be placed on the guide, and can be moderately pushed to the conveyor chain claw mechanism
1. Can not hold too tight or loose, too tight will cause the chain claw and plate deformation; Taisong may appear drop board or PCB side stop affect the quality of welding.
2. before adjusting the width of the chain to check whether the two sides of the solder furnace nozzle plate, if you can touch, it is necessary to increase the guide or reduce the tin furnace, so that the chain claw higher than tin furnace spout Guide.
5.2 Adjustment of Tin Furnace
The height adjustment of the tin furnace can be completed by the tin Furnace trolley lift, and the height standard is approximately 6mm~8mmfrom the top edge of the nozzle by the base board component foot.
5.3 Conditioning of preheating box
The position of the preheating box is fixed before leaving the factory, and can not be easily changed, the preheating box should ensure the bottom
The temperature of the face is between the 80?-180?.
5.4 adjustment of flux spray height
The spray height adjustment is done by adjusting the nozzle height and adjusting the appropriate air pressure and gas.
Loosen the screw that the nozzle is connected with the shaft, the nozzle can be moved up and down, and appropriate adjustments can be made according to the actual needs.
* The adjustment of the volume of wash claw liquid. (see chart below)
4.- Chain Claw
The claw pump has a switch control in the touch screen and requires alcohol in the alcohol box and turns on the drive Chain to open
Claw Washer is to ensure that the chain claw clean, to achieve solder quality one of the factors. The device uses a loop-back -flow design, the chain claw through the alcohol moist brush cleaning, flow through the control valve. The capacity of the alcohol box should be Paute 2/3 or more, otherwise the pump will burn, every two days will wash the claw box out of the tin slag clean.
Note: Do not turn the adjustment switch too large and the alcohol overflow machine, so as not to cause a fire.
after the equipment is installed, the equipment should be fully checked, and after the system and mechanism are working normally, then put into normal use.
* Prepare Equipment
flux approx . 20L
Cleaning Lotion about 12L
Solder lead -free solder 400kg
Electric Stove 3Kw 1
Stainless steel tank 1
* Molten Tin
The solid solder is poured into the stainless steel container in batches, heated to the furnace to fully melt ( about the? ), and then poured into the tin tank of the equipment, when the solder liquid surface is about 8mm from the tin Groove mouth , Stop feeding start-up equipment, the tin furnace temperature preset for 245?, to tin furnace temperature, start the crest, adjust the crest height, check whether the crest is normal. Josi surface is low, at this time can be the bar-shaped solder directly into the tin furnace, adjust the tin surface to fit. Note:a. Tin Tank for the first time, the Solid Tin Bar ( block ) material directly into the tin furnace to melt, In case a large amount of heat can not be passed to the solid solder in time, resulting in high-temperature burning tin trough and heating pipe. b. Before dissolving the tin, the tin trough and the stainless steel container should be cleaned to prevent the impurity from polluting the solder.
* Check Flux Spray Condition
The flux is injected into the rosin groove, connected to the gas source and activated. “Spray Fog ” , check whether the spray is normal. the proportion of flux in accordance with the requirements of manufacturers and actual use of the situation, can be 0.80~0.87 within the scope of appropriate adjustments. ( manufacturers are best to provide free cleaning flux)
Check the transmission, adjust the body is normal, respectively, start the transport, washing claws, cooling, preheating and so on, check is normal, commissioning completed.
Chapter 6 Inverter Description
(See VFD-M Manual and temperature control sheet , This manual is presented in conjunction with the instructions )
Chapter 7 Spray Type Rosin Furnace
7.1 composition of rosin furnace
Rosin furnace is made of stainless steel, sealed containers, flux stored in this will not evaporate and absorb moisture in the air, and maintain a stable solvent composition, and with high-precision import nozzle and Germany or the United States rod-free cylinder, imported light eye, is currently the most ideal welding equipment users. The structure is shown in the figure below.
7.2 correct use of rosin furnace
the height of the rosin spray can be adjusted (see spray height adjustment), can also adjust the solenoid valve on the airflow regulator or pressure regulator on the air conditioner, the factory has been adjusted so easy to change, to avoid making into the spray system chaos, when working when the substrate through the input photoelectric tube, time control system started, and began to delay spraying and spraying tin until the substrate through the rosin furnace 3-5 seconds to stop spraying.
Note: The flux must be clean-free dapoxetine type, which is characterized by the plate surface after welding without ultrasonic cleaning, clean and beautiful board.
7.3 instructions for the use of nozzles
I, the safe operation of the case of special attention to the following matters:
7.3.1. Take appropriate precautions before use to prevent injury to the human body or damage to the product.
7.3.2. Do not point an open flame or close to an open fire place, to avoid static electricity.
7.3.3. In the installation or maintenance process should be all fittings with raw tape, such as the connection slack, in the gas
Under the pressure of the body, various liquids will be sprayed into the body.
7.3.4. When connecting the air pipe and the solvent pipe, please select different material and pay attention to the pressure of the hose can not exceed the regulation, do not use the damaged old trachea.
7.3.5. Often clean the nozzle on the solvent, the residue on the road, may cause trouble, is in the direction of people can not press the switch.
7.4.1. after Regular cleaning nozzle to ensure smooth nozzle.
7.4.2. always keep the liner slide clean and lubricated, no solvent immersion, so as not to affect the rod the normal use of cylinders.
Chapter 8 Preheater
8.1 the role of Preheater
The role of preheater is to increase the expansion rate on solder pads by preheating the flux activation and
To promote the evaporation of the PCB flux solvent, thus obtaining the best soldering effect. In addition, the circuit board after preheating, reduce the PCB and tin furnace temperature difference, to avoid the thermal impact of electronic components and circuit board sudden thermal deformation.
the optimum temperature for preheating is 120~180?. The temperature is too high can cause undesirable consequences; too low temperature affects welding quality.
8.2 The construction of preheating box
the preheating system is composed of imported blackbody heating pipe. The Preheating box and the guide rail are connected by screws to facilitate the inspection and maintenance of the line.
The best preheating temperature on the circuit board is 120-180 ?, the temperature of the preheating box is passed by the high accuracy temperature probe to the preheating electronic thermostat to adjust, can accurately control the preheating box temperature, protect the circuit board, achieve the most ideal preheating effect.
8.3 Daily Maintenance and Precautions
8.3.1 The temperature of the circuit board’s bottom surface is often tested to ensure that 120~180? between the two to ensure the best solder effect.
8.3.2. Check whether the circuit wire aging, in order to prevent current interruption.
8.3.3. Clear the flux residue in the drawer of preheating box, lest the set will cause fire.
Chapter 9 Tin Furnace
Tin furnace structure using stainless steel production. By the wave generator, nozzle filter, impeller, motor and other groups
Yes. The use of pump-type principle to form a crest.
Tin furnace structure is reasonable, high technical content, the use of Japanese and American tin Furnace advantages of the development of high standard tin furnace. Its characteristics:
1 reduce the tin oxidation to a minimum.
2 nozzle wave smooth, tin surface can be adjusted vertically to adapt to different PCB board welding requirements,
3) External heating effectively avoids the phenomenon of explosion tin, good insulation performance, tin furnace durability does not deform.
Tin furnace body is by corrosion-resistant stainless steel plate welding into, heating tube installed in the tin furnace two outside. Use
Plate to radiate heat, so that the temperature uniformity of the tin furnace, the overall heat balance does not deform, spray cavity set up without clogging nets,
Can keep the peak smooth and smooth, and not plug, thus reducing maintenance, improve efficiency.
9.2 correct use of tin furnace
Tin Furnace high and low and in and out of the mobile can be used to set up the joint hand wheel and lifting screw adjustment , adjust the tin Furnace crest can be adjusted by the frequency converter, the higher the impeller speed, tin furnace crest is higher;
Solder temperature controlled by the thermocouple in the tin Furnace. First of all, the expected solder temperature set, usually the normal solder temperature is 230-250 ?.
In the back of the tin furnace with a row of tin Tsui, used to clear the tin furnace. The tin furnace to the back of the removal, cleaning and maintenance, before the tin furnace removed, must first be the guide rail high or tin furnace to reduce a certain height to avoid the rail chain claw and tin furnace collision caused by the chain claw deformation.
In the demolition of the furnace, referring to the structure shown above, the nozzle removed first, the motor frame and impeller out, loosen the furnace liner fastening bolts, you can remove the furnace.
9.3 Daily maintenance and precautions
9.3.1. Regularly check the amount of tin to control the “spray tin wave.”
9.3.2 . measure soldering temperature with mercury thermometer ( standard temperature0?). If the preset solder temperature is unstable , it can be adjusted in the temperature control table.
9.3.3. Depending on the resulting oxide, add antioxidant grease. (Anti-oxidation grease and flux supporting use)
9.3.4. Frequently remove oxides from tin furnaces.
9.3.5. Check the tin furnace motor coupling on the machine rice and impeller shaft coupling machine meter and its operation, to ensure its normal operation.
9.3.6. Pay attention to check the wire has no aging, as well as the parts of the screws, nuts are loose.
9.3.7. Spray nozzle every day after work with alcohol automatic cleaning, lest block.
Chapter 10 Maintenance and precautions
1. Often the fuselage, transport, claw pump, cooling fan, such as motor housing cleaning to facilitate the cooling and insulation.
2. Regular inspection of electrical control box in the electrical appliances and fastening the screws on its terminals, such as the discovery of contact ablation, suction and not flexible, etc., should be dealt with in a timely manner.
3. Regular inspection of preheater, tin furnace heating pipe joints, such as the discovery of head loosening, poor contact, insulation aging and other phenomena should be tightened, clean and replace.
4. Regular inspection of equipment to protect the grounding device is good.
5. In the operation of the equipment, pay attention to monitor the shell temperature of each motor, overheating phenomenon should be stopped check.
6. When the general switch on the power supply, should first stop the tin Furnace, preheating and wave crest and other large current load before entering
7. After the main power switch trip, you must find out the cause of the failure, before the closing.
8. In the process of melting solder and injecting high temperature liquid solder into the welding furnace, wear protective articles to prevent
9. Flux, Wash claw liquid are flammable materials, use should pay attention to fire safety.
Ten after working every day, you need to clear the flux residues in the preheater to prevent accumulation. cause an open flame.
11. The limiter can not be added lubricating oil, so as to avoid the transmission chain claw not go.
12. Anti-oxidation wax (oil) should be used with flux to avoid fire.
13. Each transmission part should maintain the good lubrication, except the angle adjustment mechanism may use the ordinary ointment, other all uses the High-temperature ointment lubrication.
14. The tightness of each transmission chain should be checked and adjusted regularly.
15. Regular inspection of tin furnace speed motor lubrication and operation, to ensure its normal operation.
– Tin furnace Nozzle should be based on the peak stability, the peak when the exception to clean the nozzle, so as not to affect welding quality.
18. Spray nozzle should always check the tightness of its connection.
Chapter 11 Wiring
This equipment needs external 3? , ac380v,50HZ power supply ( three-phase five wire system ), power supply capacity
The quantity is not less than 20KVA, the equipment shell should protect the grounding, the grounding resistance ?4?, the grounding conductor is not less than
4mm2, the incoming line should be no less than 6mm2?
Chapter 12 General Trouble shooting
To ensure high quality, the devices used in the equipment are advanced industrial countries of high-quality products, such as million
In the event of an accident, please check each of the items listed in one table. If you are still unable to resolve, please contact the company directly.
All action buttons are invalid
1. Time is not in the state of timing
2. The tin temperature is not up to the set value
1. Set the scheduled boot time before the current time.
2. Wait until the temperature of the tin furnace, then operation.
Control power LED not lit
1. Power supply Missing phase
2. Fuse on the bottom plate of the electric vessel
1. Overhaul power supply.
2. Check whether there is a short-circuit phenomenon in the lights, etc.
In addition to the failure, replace the new insurance pipe (4A).
Power supply Total Switch tripping
1. Load and line occurrence short-circuit phenomenon
2. Power supply Total Switch Contact bad
1. Check the load and related lines, troubleshooting short-circuit.
2. Check the wiring area of the power supply master switch for appearanceloosening, heating, oxidation and whether the switch contact point is outcontact is bad, ablation and other phenomena, or to be seized
repaired or replaced.
Tin Furnace or preheating
Slow warming of the device
1. Power supply is too low
2. Additional Hotline(tube)partially damaged
1. Improve the quality of power supply.
2. Replace the hotline(tube).
Transport Claw not running
1. Transport motor shaft end of the drive chain skid, Force nut Loose
2.chain speed set to “0”
3.fx-2da or inverter damage
1. Fixed nut for fastening drive sprocket.
2.chain speed set to not “0” position.
3.fx-2da or inverter.
Failure and solder welding problem analysis
Press the button to press,But the LEDs are not lit
1. Total switch not open, emergency stop switch not open
Clean copper foil and component ends;PCB, components for long-term storage, research flux is no problem, for new flux.
Out of the tin pillar
1. Copper foil surface, component ends of oxidation and pollution
2. Solder welding of flux is not good
3. The chemical changes of the coating flux and copper foil4. Flux metamorphism
Clean copper foil surface, fully preheat, Preheat temperature standard: Aldehyde circuit board to
– ?, epoxy circuit board120 to?
(Solder surface temperatureadjustment flux, eutectic solder , temperature for250~260? circuit boardand tin liquid contact do not exceed the road plate thickness of the 1/2. Reduce the height of the tin liquid to adjust the speed of transmission , research circuit board design, in
Circuit board coating Protective film.
The occurrence of the lap
1. Copper foil surface, component ends of the oxidation of pollution
Use of PCB Pallets in Wave Soldering Patch components are used more and more on the circuit board, but there are still some perforated components between them. For this kind of board, selective soldering is the best solution, but not every company has enough funds to purchase selective soldering equipment, or the number of this type of circuit board is too small, specifically to buy selective soldering equipment is not Cost-effective. Manual welding is prohibited in certain industries such as the automotive industry
Therefore, in PCB wave soldering, using trays to block those patch components is a good method: reliable, fast production, and adaptability to high-capacity requirements.
The benefits of using trays: Lead-free soldering requires higher soldering temperatures. Therefore, the circuit board is more easily bent during welding. The tray provides maximum protection of the circuit board during soldering and prevents bending.
Similarly, in the automotive and consumer electronics industries, many special-shaped circuit boards have emerged for the needs of applications. It is sometimes difficult to transport these shaped plates with conventional chain rails and mesh belts, and placing the circuit board plates in trays allows any type of circuit board to be shipped.
By soldering some of the bottom components through the tray, it is also possible to use PCB wave soldering equipment for selective soldering of the product.
Since most trays are thick (sometimes 15 mm), solder certainly does not flow to the top of the board. The oxide layer on the solder surface will also be washed away by the edge of the tray before the board reaches the peak, so that when the solder starts, the tin is relatively clean.
By adding some stiffening strips to the tray, it can increase its hardness to withstand high-strength welding. It is also possible to install heat-absorbing blocks, component fixing devices and some other auxiliary devices on the upper part.
The use of pallets also helps standardize the width of the product line, soldering different circuit boards on the same production line, and can use bar code readers and other identification tools to quickly change process programs for different boards.
Although there are many advantages to using trays in lead-free soldering, it can also cause solder balls.
Requirements for pallet materials: In order to maximize the service life of the trays, the trays must be made of materials that can withstand high temperatures and harsh process conditions, especially for lead-free soldering.
To meet these requirements, the material used to make the tray must meet the following characteristics: • High dimensional stability • Good thermal shock resistance • Can remain flat after repeated use • Corrosion resistance (flux and cleaning agent) • Does not absorb moisture
The use of the tray brings the process problems: The flux system must be able to spray the circuit board completely with flux. Poor tray designs can lead to “shadow effects” in flux spraying: Some parts of the board have insufficient flux or no flux at all. The flux must be sprayed onto the board and spread through the capillary action.
Before the tray touches the crest, it must be heated in the preheating unit. A typical preheating configuration is a combination of heat pipes and hot air forced convection. If the temperature drops before contact with the peak, the tray will have an endothermic effect, making the welding process difficult to control.
The use of trays requires a wave height of up to 0.5 inches (12.5 mm). In the case of such a high pump speed, the use of nitrogen can help reduce dross. When using pallets in lead-free soldering, Vitronics Soltec’s perturbed “smart wave” can also promote tinning of the perforated component.
In addition, we must pay special attention to keeping the circuit board in the pallet flat. If there is a gap between the circuit board and the tray, the flux will flow into the gap, and the solder will flow to the board when passing through the peak. This will cause solder residue on the board.
The gap between the circuit board and the tray may cause solder residue on the circuit board
Circuit board and tray design recommendations: Avoid placing larger components near the piercing element as this can cause shadowing effects and tin difficulties.
Leave proper clearance around the pins and edges of the through-hole components so that solder can flow. These tin guides will guide the solder to the seat of the tray opening, while also greatly improving the solder flowability.
The tin slot at the tail of the tray allows the solder to flow smoothly back to the tin tank
The opening of the tray should be as large as possible to facilitate the flow of solder. This will reduce some of the welding defects, such as: short circuit and solder balls. At the same time, it is also beneficial to the solder filling of the through hole, because the large opening also means that there is more energy to enter the welding area.
1, using the next vacuum mode, in line with the theory of free fall, good dust collection effect.
2, special jig fixed more solid, to avoid the poor positioning caused by the cutting accuracy error.
3, the system automatically fixes according to the product installation location, to ensure high-precision product cutting requirements.
4, the static eliminator is installed in addition to electricity, dust blower continued to work to eliminate static electricity generated when cutting high-speed spindle to avoid damage caused by static electricity parts to avoid accumulation of dust due to static electricity.
5, the use of safety doors, reduce noise and dust, improve safety.
Vacuum cleaner with vacuum collection box (according to production capacity or cutting dust collection time scheduled maintenance)
PCB Separator also called PWB Depaneling machine. Rotate router bit to cut high-density component PCB panel to single products v-groove or perforated line. Utilize all of our accumulated technology to help minimize dust attach on PCB. Router machine has following features.
The number of milling cutters (0-5 section)Break Detection断刀检测无(none)Cutter Life Control刀具寿命控制程序控制(controlled by Program)Table NumberTable数量1个Spindle Speed主轴转速60000rpmSpindle Cooling System主轴冷却系统气冷方式Air cooling modeCleaner Mode集尘方式下集尘(collect dust downside)Working Power工作电源220V ，50HZAir press空压供给0.4MpaSafety Device安全装置采用安全防护门加门锁感应器Safety door and door lock sensorMode机型模式离线机型，手工装载卸载PCBA(offline, load and unload PCBA by hand)Auto failure test and repair mode故障自动检知维修模式系统具有自我诊断功能，实时错误信息显示，能直观地查询设备各个IO端口状态，易于排除故障。
Self-diagnosis，display failure information in real time, query IO state visually, easy for troubleshootingComputer & Operation system电脑和操作系统工控机、Windows 7
IPC, Windows 7Program Backup程式备份USBSoftware access control软件权限管理密码保护，依权限进入对应操作界面，保护系统重要参数。(Password protection，the operator enter corresponding interface according to authority to protect important parameters.)Programming编程可视化界面，单个程序切割点容量无限制，切割路径动态模拟。(Visual interface, the cutting point capacity for a single program should be over 400, dynamic simulation of cutting schedule.)Auto correction of the mark pointMark点自动校准功能具备Mark点自动校准功能(Yes)Fixture 治具万用治具可供选择(universal fixture)Voice control噪音控制运行时，噪声小于60分贝（离设备一米距离测量）
≦78 dB（measured in 1M’s distance ）Maintenance Period保修周期整机1年或以上，主轴2年或主轴3000小时保养服务。
1 years or more, spindle for 2 years or spindle maintenance service for 3000 hours.Technology Support技术支持及培训提供设备操作、编程，硬件保养，维修培训服务；程序永久免费升级。(Offer service of operation, programming, hardware caring and maintenance training; free upgrade of application. )
1, vacuum cleaner built-in vacuum mode, in line with the theory of free fall, dust collection effect is good.
2, the equipment adopts automatic loading and unloading products, can be directly on the wiring body or on the board machine.
3, using a special fixture with products (pcb), to avoid poor placement caused by cutting error.
4, the system automatically fixes the installation error, to ensure product precision cutting requirements.
5.It is equipped with static eliminator. When dividing, the dust remover will work continuously to eliminate the static electricity generated when the high-speed spindle cut. It can avoid the damage caused by the static electricity and avoid the accumulation of dust due to static electricity.
6, the use of safety doors, reduce noise and dust, improve safety.
7, there are follow-up vacuuming function, dust collector attached to the dust collection box (according to capacity cutting needs or dust collection time scheduled maintenance).
8, touch the display as a display, setting, control, can display more content, the operation directly through the touch screen operation, easy to operate.
9, can be directly docking the next equipment, sub-plate processing.
10, in the cutting process, if broken knife, equipment with automatic tool change function, without manual to change the knife.
11, Equipment using Mes system, the factory can control the machine everywhere, equipped with WIFI function can be controlled.
0-100mm/sX,Y,Z axis Driving SpeedX、Y、Z轴驱动速度X、Y轴至少1000mm/s(min)，Z轴至少750mm/s(min)，伺服马达方式驱动(driven by servo motor)Repeatability Accuracy机台重复精度±0.02mmMechanical hand X, Z stroke机械手X、Z行程X：420mm、I：60mmManipulator X, Z running speed机械手X、Z运行速度200mm/sMechanical hand grasp mode机械手抓取方式真空吸附Precision of repeated positioning of manipulator机械手重复定位精度±0.04mmMechanical hand grab products (PCB) dimensions机械手抓取产品（PCB）尺寸350mm*350mmPCB feeding trackPCB上料轨道皮带输送；宽度60~360mm可调Split plate product分板产品下料皮带输送；宽度420mmWorking Area工作区域（可加工行程）X:300mm，Y：350mm，Z：0-50mmPCB Thickness切割PCB厚度范围0.5-2mm(or thicker)，或范围更大 Router Bit Diameter铣刀直径0.8-2.0mmCutting Precision切割精度±0.01mmCutting Ability切割能力具有切割直线、圆弧、圆、L型和U型的能力
Smart to set the no. of knife section(0-3)Break Detection断刀检测有（have）Cutter Life Control刀具寿命控制程序控制(controlled by Program)Product testing产品检测有（have）Table NumberTable数量1个Table FunctionTable功能并行Table运行方式；设备能实现1个Table联动功能(1 tables run in parallel)Spindle Speed主轴转速60000rpmSpindle Cooling System主轴冷却系统风冷方式(air cooling)Cleaner Mode集尘方式下集尘(collect dust downside)Working Power工作电源220V ，50HZAir press空压供给0.5Mpa以上(above)Safety Device安全装置采用安全防护门或感应器(security door or sensor)Mode机型模式在线机型，全自动装载卸载PCBA(offline, load and unload PCBA by hand)Auto failure test and repair mode故障自动检知维修模式系统具有自我诊断功能，实时错误信息显示，能直观地查询设备各个IO端口状态，易于排除故障。
Self-diagnosis，display failure information in real time, query IO state visually, easy for troubleshootingComputer & Operation system电脑和操作系统工控机、Windows 7或以上版本。
PIC、Windows 7 or more advanced versionProgram Backup程式备份USBSoftware access control软件权限管理密码保护，依权限进入对应操作界面，保护系统重要参数。(Password protection，the operator enter corresponding interface according to authority to protect important parameters.)Programming编程可视化界面，单个程序切割点容量无限制，切割路径动态模拟。(Visual interface, the cutting point capacity for a single program should be over 400, dynamic simulation of cutting schedule.)Auto correction of the mark pointMark点自动校准功能具备Mark点自动校准功能(Yes)Fixture 治具ASC-3500S专用治具ASC-3500S special fixtureVoice control噪音控制运行时，噪声小于60分贝（离设备一米距离测量）
≦78 dB（measured in 1M’s distance ）Maintenance Period保修周期整机1年或以上，主轴建议2年以上并在保内提供主轴3000小时保养服务。
Over 1 year for the whole machine, and over 2 years for the spindle, and the spindle enjoys 3000 hours’ maintenance during the periodTechnology Support技术支持及培训提供设备操作、编程，硬件保养，维修培训服务；程序永久免费升级。(Offer service of operation, programming, hardware caring and maintenance training; free upgrade of application. )
1, the use of multiple sets of upper and lower knife while cutting
2, the bottom of the device with adjustable foot castors, easy to move equipment, non-moving need to be stable and fixed; feet Cup adjustable height 50MM or more;
3, equipped with SMEMA interface communication with other devices can be linked, with reserved network interface, the follow-up factory aspects of networking;
4, the device uses power: AC230V gas source: 4-6KGF / cm2
5, the necessary safety devices;
6, the equipment needs to operate smoothly, the necessary test components;
7, according to the normal production capacity needs to reach 1500PCS / H or more
8, there are data monitoring statistics output: boot time monitoring, capacity monitoring, equipment failure information and automatic rejection system
9, using multiple groups simultaneously cut down on the knife
10, the distance between the knife can be accurately adjusted, sub-board thickness to be met: 0.6MM-3.5MM up and down the distance between the knife can be accurately adjusted, sub-board thickness to be met: 0.6MM-3.5MM
11, the knife and the knife gap can be adjusted according to the PCB board V-CUT spacing, precision control in the 0.1MM
12, the distance between two adjacent blades can be adjusted between 8MM-25MM, can quickly adjust the required width;
Three general classes for the intended end use of electronic assemblies have been established. As applications and functionality increase there may be overlap of equipment between classes. The owner of the application has the responsibility to determine the class that applies. Although a single class may be referenced, specific requirements defined in other classes may apply as well. If a class is not stated for a criterion then the single criterion applies to all classes.
Class 1: Consumer Products: This class of product includes non-critical applications which shall be reliable and cost effective but for which extended life is not the primary objective. Examples include products manufactured for general consumer applications.
Class 2 – General Industrial. This class includes high performance commercial and industrial products in which extended life if required but for which uninterrupted service is not critical. Application and environmental considerations should be taken into account.
Class 3 – High Reliability. Equipment in this class includes those equipment which continued performance is critical, equipment whose downtime cannot be tolerated, or equipment used as a life support item. Unless otherwise specified, Class 3 shall be used for soldering requirements on military electronic equipment.
Printed circuit assemblies are manufactured in a variety of ways, exclusively using smt devices or smt mixed with through-hole components. Boards which have both SMC’s and through-hole components are called mixed technology boards. Surface
mount components are conventionally attached to the substrate using the reflow or the wave soldering process. Typically PCBs are assembled in one of the following ways and categorized as:
SMC’s only are placed on one or both sides of a printed circuit board. The components are attached via the Reflow soldering process.
A combination of both surface mount and insertion mounted components on a printed circuit board. Both SMC’s and IMC’s are assembled on the top side of the board while SMC’s only are attached to the bottom of the board. Top side smt components are Reflow soldered, while the through hole and bottom side smt components are Wave soldered.
IMC’s are assembled on the top side of the board while SMC’s only are attached to the bottom of the board. The components are soldered in place via the Wave solder process.
The fast growth of these applications and advanced packages has led to the development of high density boards. As the industry increases the use of these boards and packages in its products, two of the greatest challenges that it will face are; establishing effective printing guidelines and utilizing equipment that can reliably produce a wide variety of assemblies.
A company’s success or failure in the surface mount industry will weigh heavily on its ability to adapt to automated manufacturing practices through innovative product design and development. Manufacturers can effectively compete in the electronics marketplace today only by utilizing automated equipment throughout the entire SMC assembly process. This includes addressing changes in the SMC production process from initial board printing to final inspection. The companies that do not act positively on these factors and successfully adapt to changing trends in the electronics market will find their business being lost to competitors and foreign ventures.
Type 1 – Single Sided SMT SMT Components (Primary Side only)