3D showing SMT nozzle for EMS factory

How to layout EMS smart SMT production line for Industrial 4.0

Main content of lean factory design
The traditional way of plant layout begins with equipment and tooling, and finally considers the flow of processes. Unlike traditional factory layouts, lean factory design layout begins with the customer and then designs the process flow around the workforce.
Lean factory design should comprehensively apply the knowledge of lean production ideas, system engineering, enterprise management, etc., and use parallel technology, information technology and other means to determine the factory design plan that meets the requirements of lean production concept. The main design contents are as follows:

(1) Production line layout based on lean thinking
The design of the best production line must be independent of the current legacy workflow and should reduce or eliminate large amounts of moving time for products and materials. According to the assembly requirements, placing the part loading process on the assembly point where the material of the production line is consumed will reduce the movement and waiting time.

(2) Lean logistics system design
According to the lean production point of view, logistics is not a value-added link. Therefore, the goal of lean logistics system design is to minimize the logistics and strive to minimize the waste in the logistics process while meeting the production requirements. To break the limitations of the profession, try to set up and no intermediate inventory area, and completely follow the process flow layout. All ideas that minimize the amount of movement and optimize the flow of the product should be tested. Ultimately, a practical and appropriate approach should be taken to finalize the production line in order to maximize the benefits of the production process. .

(3) Lean selection and arrangement of equipment
It is necessary to fully consider the relationship between the various production links, and on the basis of realizing the capacity requirements, try to achieve a balanced production capacity and reflect the idea of ​​lean flow. At the same time, the choice of equipment is not based on the most advanced standards, but the small size, low investment, flexibility and other indicators are put in the first place, in order to meet the needs of flexible production in the future.

(4) Lean staffing
Traditional factories use the “scheduled system” staffing, but this method increases the cost of the enterprise and reduces the response speed of the enterprise under the multi-variety and small-batch production methods. Lean factory design, it is recommended to use the least staff to achieve the same production needs, through the training of employees, so that it has a variety of skills, so that with the change in production, flexible arrangements for operators.

(5) Lean selection of auxiliary equipment
Although the fixtures and tools required for production assistance are not resource equipment, they must be considered for lean production. It must be designed to accommodate the movement of the required materials, such as the passage of the automatic loading and unloading trucks and large material containers. It is necessary to design the station to be more compact, but at the same time, the operator should be considered to be as ergonomic as possible.

In addition, the design of the lean factory should also include the planning of the public facilities of the factory, the design of the information system, etc., and should be carried out according to the specific needs of the factory and the actual situation of the enterprise.
The goal of lean plant design is to minimize waste and overload in the work process while enhancing visual communication on site.




Megatrend_ Infotainment

Megatrend: Automotive Infotainment Microelectronics

Committing to growth

Megatrend: Automotive Infotainment Microelectronics

Is your SMT factory ready for the increasing electronic automotive demands? As consumer interest shifts from engine performance to interior infotainment, the automotove microelectronics manufacuturing demands will continue to rise. The latest and upcoming electronic technologies in vehicles, i.e. navigation technologies, sensor controls, smart technologies in vehicle and cellular communication is creating urgency now more than ever to evaluate your manufacturing process.

Considering the rising demands for the latest electronic gadgets and the predicted growth in Electronic Vehicles (EV) and autonomous cars makes you question how much production you should be doing in-house for the most growth, higher profits and most efficient productivity. Automotive Electronics and IoT are in the midst of growth, and there are many expected changes in the very near future fueling this growth. Design activity will remain strong and that this will ensure new products enter now and in the coming years. Miniaturization of device footprint fuels innovation in printed-circuit board (PCB) designs.

Outsourcing manufacturing is no longer as cost effective as it once was, as labor costs are continuing to rise, as well as importing and exporting costs. Companies are finally realizing in order for the highest productivity, quality, and monetary gains, considering domestic manufacturing is the solution.

The electronics industry is an ever fast-changing world, and we are here to help you keep up with your business advancements and needs. What trends are you noticing? Have questions on how you can keep up in your industry? Let us know.

Megatrend_ Infotainment

Is your SMT factory ready for the increasing electronic automotive demands?

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12 Common Errors that Cause FAI Rejection

First Article Inspection

12 Common Errors That Cause FAI Rejection

FAI First Article Inspection - 12 Common Mistakes that Cause FAI Rejection

First Article Inspection (FAI) is of vital importance to industries that are governed by strict guidelines and a high standard of quality assurance. These are the 12 common errors which cause FAI Rejection:

1. Typos, incorrect knowledge, revisions, numbers, and values are some of the most common causes for FAI rejection.

2. Missing or hidden requirements for detailed Commercial Off the shelf “COTS” parts, where dimensions are not included in the official drawings. Elements & hardware set up should be addressed in the document as specified.

3. All Dimensions and notes are not accounted for. Any notes that include a dimension shall have a bodily measurement recorded.

4. Incorrect or lacking course of action for supplier and buy order requirements.

Specific course of action for provider should be MEC accepted according to buy order necessities.Supplier shall be licensed to construct to RDD (Reduced Dimension Drawing) per buy order necessities.

5. Incorrect tolerances assigned to dimension leading to non-conformance.

Standard dimension tolerances akin to +/- .010 are discovered within the tolerance block.

Tolerances assigned to this dimension are outlined by the Feature Control Frame related to the Basic Dimension.

6. Adherence to Raw Materials Shelf Life. Proper use of expiration dates and labeling.Raw Material required to be indicated on type MEC-0293/AS9102 Form 2Parts for a meeting are required to be indicated on type MEC-0292/AS9102 Form

7. Incorrect Revision Degree

Ensure PO revision matches launched engineering specifications for merchandise(s) on FAI report.

Verify the required revision of MEC specs, like 79P050000. Indicate all revision ranges in block 6 of MEC-0293/AS9102 Form 2

8. Incorrect inspection gear used or not recognized on FAI report.

When inspection gear is listed, be sure that inspection gear has enough measurement accuracy for necessities being measured.

9. Wrong quantities listed on FAI type(s).

There shall be no typographical errors, lacking sprint numbers, and/or designators similar to Q1, D1,TPSS

Example: If the acquisition order requires K/I 7979797-003 Q1 the FAI type shall contain the complete G/I: 7979797-003 Q1

10. Missing Certificates of Conformance

Check & Review FAI types as a part of the FAI Package.

Ensure there isn't any missing or incomplete sub-tier provider information.

11. FAI type(s) not signed, authorized, or dated by applicable consultant.

Form(s) MEC-0293 & MEC -0294 should be signed by the preparer of the FAI.

12. Incomplete recording of a number of actuals.

A function that requires a number of locations also requires recording a number of actuals.

Example: FIN #6 needs to be put in 12 locations (point to those 12 locations or measurements as outlined by engineering).

Welcome to #2930 IPC APEX EXPO 2016

The need to reduce the size and weight of
electronic products is continuing as Surface
Mount Technology matures further. Size reduction
in both active and passive components coupled
with improved printed circuit board technology
is producing smaller, lighter weight, and
higher performing end products. Extensive
research and development continues to reduce
the size of active packages. Passive components
have also been reduced in size to enable designers
to use smaller printed circuit boards to perform
a given task. The use of 0603 and 0402
components have been prevalent for a number
of years. These component sizes can be run in
high volume applications at very high yields.
More recently, 0201 components have been
implemented in high density applications. The
0201 component is approximately one-quarter
the size of a 0402 component and this could
reduce the assembly process robustness and

Component Size Comparison

Stencil Aperture Position Relative to Attachment Pad

Insufficient Solder Volume

Excessive Solder Volume