Introduction – Reflow Oven Soldering
Process where solder paste is heated to above its melting point to form a solder joint between component and pcb pad.
Pcb is transferred on a conveyor belt through an oven to over 183 degrees Centigrade
The joints that are formed should be electrically and mechanically sound
Reflow Profile
Profile considerations
Each solder paste has a recommended temperature range that suits its characteristics and will produce the best joints.
Components and the pcb can only withstand certain maximum temperatures ( eg. FR4 at 250º C for 60-75 sec )
Customers specify profiles for the products
