- Reflow soldering process specification
- Profile measurement equipment
Reflow profile shall be measured using a temperature measurement equipment specifically designed for pass-through reflow profile measurements.
The profiling equipment shall be calibrated regularly according to the maintenance instructions by the supplier.
Only the thermocouples recommended and approved by the measurement equipment supplier shall be used.
Reflow profile measurement method
Reflow profile specification
Figure 1. Illustration of critical reflow process parameters.
Recommended reflow oven settings
The following settings shall verified for each oven using oven calibration method (section 6.2) and settings shall be adjusted if necessary to achieve a profile within the specification in section 6.3.
MANUAL SOLDERING PROCESS AND WORKMANSHIP CRITERIA
- Manual and semi-automatic hot gas soldering and rework
Warning! A visual change in PWB surface characteristics during heating is a sign of too high a temperature and/or too long exposure time and must result in rejection of module.