SMT Reflow soldering process specification for electronic manufacturing PCBA

• Reflow soldering process specification
• Profile measurement equipment

Reflow profile shall be measured using a temperature measurement equipment specifically designed for pass-through reflow profile measurements.

The profiling equipment shall be calibrated regularly according to the maintenance instructions by the supplier.

Only the thermocouples recommended and approved by the measurement equipment supplier shall be used.

Reflow profile measurement method

Reflow profile specification

Figure 1. Illustration of critical reflow process parameters.

Recommended reflow oven settings

The following settings shall verified for each oven using oven calibration method (section 6.2) and settings shall be adjusted if necessary to achieve a profile within the specification in section 6.3.

ERSA Hotflow 7

BTU VIP98

MANUAL SOLDERING PROCESS AND WORKMANSHIP CRITERIA

1. Manual and semi-automatic hot gas soldering and rework

Warning! A visual change in PWB surface characteristics during heating is a sign of too high a temperature and/or too long exposure time and must result in rejection of module.