SMT Lead-Free Reflow Over S-R1000 for electronic manufacturing PCB assembly

Independent Upper and Lower PID Temperature Controls for Each Heating Zone Permit Precise Temperature Profiling

S-R1000’s heating zone temperature controllers have an accuracy of ±1°C and, in conjunction with a high-speed blower adjacent to each heat source for maximum convection, ensure a ΔT of ±2°C across the PCB assembly. The Series diffuser design provides low-velocity, low-turbulence air flow to prevent component shift or disturbance.

Optional thermocouples can be attached at critical locations on the PCB and connected to three built-in inputs (standard) on the oven for communication with  control software for accurate, real-time temperature profiling to match any solder paste manufacturer’s specifications.

Pin-Over-Mesh Conveyor Meets Virtually Any Product Specification or Production Requirement

The S-R1000 is supplied as standard with an adjustable-rail, pin-type conveyor system that handles PCBs up to a maximum of 450 mm (17.7″) installed over a 570 mm (22″) stainless-steel mesh belt. The pin conveyor permits inline and double-sided processing. The mesh belt is ideal for fast changeovers.

To eliminate the possibility of jamming or dropped PCB assemblies, all components are constructed of high-quality, high-strength, stainless steel and are built to maintain dimensional tolerances at the high temperatures of lead-free processing.

Advanced automatic chain lubrication and motorized width adjustment are standard features on the pin conveyor. Automatic width adjustment of the pin conveyor, based on the parameter settings for specific reflow programs, is available as an option. For processing of larger PCBs at higher lead-free temperatures, a center support system is available to prevent board warpage.

Conveyor speed is programmable from 400-1800 mm (16″-71″) per minute to accommodate any process requirement.

Nitrogen Atmosphere Compatible Models Widen Lead-Free Processing Window Through Reduced Oxidation

While the debate over air or inert reflow atmospheres continues, as an option, offers the S-R1000 in a nitrogen-compatible configuration for manufacturers who want the flexibility for soldering in both environments.

Most experts agree that the reduction of oxygen through the introduction of an inert gas (usually N2) will allow a wider process window and provide better solder joints through reduced oxidation. The enhanced flow design of the heating chamber in the S-R1000 nitrogen compatible system lends itself to efficient heat transfer and ensures low nitrogen consumption while maintaining O2 levels between 300-1000 ppm.

Internal Water Cooling Provides Maximum Control Over Critical Cooling Rates Required By Some Lead-Free Solders

Because the higher liquidus temperatures required by lead-free solders approach the limits of many SMT components and PCB assemblies, more aggressive cooling is often required to reduce peak temperature exposure times. Some recent studies also indicate that cooling rates have a significant effect on solder joint grain structure.

For these reasons, an internal water-chilled recirculating cooling system is available for the S-R1000. It allows users to alter cooling rates to meet solder paste manufacturers recommendations to a much greater degree than is possible with the exclusive use of air cooling.

Advanced Functionality and Process Management Capability

Operation and control of all  reflow systems is accomplished through an attractive, colorful, visual user interface that features a full-screen, virtual view of the system with display of pre-set and actual zone temperatures, system status and conveyor speed.

The Windows-based operating system and control software includes advanced functions for temperature profiling, timed automatic startup and shutdown, audible and visual alarms, and password protection.

A PC-controller with 15″ flat screen monitor, keyboard and trackball allow unlimited storage and networking capability.

All systems employ UPS battery backup to ensure removal of all product from the oven in the event of a power outage.