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SMT Lead-Free Reflow Over S-R1000 for electronic manufacturing PCB assembly

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1.Control System: PC + Siemens PLC control system,accurate temperature control and more stable,ensures temperature stability rate to be more than 99.99%.

2.Hot air system: first-class heating module, the best temperature zone interval design makes optimum temperature uniformity and repeat.The effective utilization and thermal compensation efficiency,it needs less than 20 minutes from temperature control accuracy ± 1 ℃ ambient temperature to a temperature stabilization .

3.Monitoring Software:Windows interface, traditional and simplified Chinese and English online free switch, and operator password management, easy to operate.Operation records, temperature curve measurement and analysis functions, virtual simulation, fault self-diagnosis, process monitoring, automatic generate and save process control documents, substrate transport dynamic display.

4.Cooling System: new cooling zone, quick and easy adjustment, easily reach the cooling requirements of different slopes.

5.Temperature protection: using third-party over-temperature protection, multiple layers protection to ensure safe operation.

6.Products comply with CE, CCC, UL , other standards and specifications.

7.User-friendly design: fault detection (such as heaters abnormal alarm, etc.), regular maintenance reminders, the economy functions and tool-free maintenance, reducing equipment failure rates.

8.Heating module: Transverse reflow design makes temperature from each zone is not influenced by neibour to ensure accurate temperature curve, while ensuring a high production capacity and heat exchange capacity to achieve high adaptability (to meet the soldering of automotive, communications, electronics, computers and mobile phones consumer electronics.)

9.Hot air motor with independently inverter controlled, set operating frequencies depending on different technology to meet a variety of lead-free processes.

10. Machine using zero gas source design, furnace cover with motor lifting, safety rod support, providing significant security.

11.Main parts:Imported main parts ensure equipment runs smoothly and lower the maintenance cost.

12. Customers can choose optional flux processing system according to their own production features  to ensure furnace chamber clean.

13.Closed-loop transmission speed control systems, transportation accuracy ± 2mm / min, ensuring more stable transmission speed.

14.Central support, dual transmission, external water cooling system is optional.

TOP Advantage:

1.Simple: combined with advanced international concepts, based on the Oriental-designed operating system, easy to understand, easy to learn, easy to maintain.

2.Expertise: learn imported reflow oven’s advanced design concepts, and the machine core components are using imported top brands.

3.Hedging: Import hardware configuration,low failure rate in production,more than a decade service life.

4.Safety: Based on the general rules of international design, close to imported reflow rating, the highest security level.

5.Stable: mature software, hardware and top production processes ensures stability of each equipment.


Widely used in high precision products like 01005-QFP, BGA, CSP, Flip,and POP ,automotive electronics, mobile devices, home appliances, communications, LED, semiconductor and other industries.



Southern Machinery  Reflow Oven Specifications
S – Standard, O – Option, M – Manual, A – Auto, N/A – Not Availible)
Specifications S-R800 S-R1000 Specifications E8 E10
Dimension (L*W*H)mm 5310x1353x1490 6100x1353x1490 Board Dropped Alarm S S
Standard Color Computer Grey Computer Grey Electrical SMEMA Interface S S
Weight Approx.2150KG Approx.2400KG Computer Lenovo Lenovo
Number Of Heating Zones Up8/Bottom8 Up10/Bottom10 Max.Width Of PCB 400mm 400mm
Length Of Heating Zones 3121mm 3891mm Temperature Deviation on PCB ± 1.0℃ ± 1.0℃
Rail Width Adjustment A and M(Multi mode) A and M(Multi mode) Max. Temp. Gap Between Preheat Zones Setting 40℃ 40℃
Rail Number 1 Lane or 2 Land 1 Lane or 2 Land Temperature Control Precision ± 1.0℃ ± 1.0℃
Exhaust Volume 10M3/minx2 Exhausts 10M3/minx2 Exhausts Conveyor Height 900+/-20mm 900+/-20mm
Control System PLC+Computer PLC+Computer Length Of Cooling Zones 600mm 600mm
Transmission Agent  Chain + Mesh  Chain + Mesh Center Support O O
Electric Supply Required 3phase,380V 50/60Hz 3phase,380V 50/60Hz Siemens PLC S S
Power For Warm Up 30KW 36KW Lubrication Auto-Afflux S S
Power Consumption 8KW 12KW Ups S S
Warming Time Approx.25 minute Approx.25 minute Temp. Thermocouple Slot S S
Temp. Setting Range Room Temp.– 300℃ Room Temp.– 300℃ Driven Top Hood Opening A A
Oil Supply A and M(Multi mode) A and M(Multi mode) Temperature Control Method PID + SSR S S
Conveyor Speed Range 300~2000mm/min 300~2000mm/min Number of Cooling Zones 2 2
Components Clearance Top/ Bottom is 25mm Top/ Bottom is 25mm On Line Editing S S
Conveyor Direction L→R (Option: R→L) L→R (Option: R→L) Max.Temp.Gap Between Preheat & Reflow Setting 80℃ 80℃
Commutated Element Aluminum Alloy Plate (8mm) Aluminum Alloy Plate (8mm) Max. Temp. Gap Between Reflow Zones Setting 50℃ 50℃
Fixed Rail Side Front Fixed  (Option:Rear  Fixed) Front Fixed  (Option:Rear  Fixed) Process Data & Status Storage S S
Cooling Method Forced-Air Motor and fan (Standard) Forced-Air Motor and fan   (Standard) Temperature Alarm S S



Independent Upper and Lower PID Temperature Controls

Independent Upper and Lower PID Temperature Controls for Each Heating Zone Permit Precise Temperature Profiling

S-R1000’s heating zone temperature controllers have an accuracy of ±1°C and, in conjunction with a high-speed blower adjacent to each heat source for maximum convection, ensure a ΔT of ±2°C across the PCB assembly. The Series diffuser design provides low-velocity, low-turbulence air flow to prevent component shift or disturbance.

Optional thermocouples can be attached at critical locations on the PCB and connected to three built-in inputs (standard) on the oven for communication with  control software for accurate, real-time temperature profiling to match any solder paste manufacturer’s specifications.

CR-10000 SMT Reflow Oven Pin over mesh conveyor

Pin-Over-Mesh Conveyor Meets Virtually Any Product Specification or Production Requirement

The S-R1000 is supplied as standard with an adjustable-rail, pin-type conveyor system that handles PCBs up to a maximum of 450 mm (17.7″) installed over a 570 mm (22″) stainless-steel mesh belt. The pin conveyor permits inline and double-sided processing. The mesh belt is ideal for fast changeovers.

To eliminate the possibility of jamming or dropped PCB assemblies, all components are constructed of high-quality, high-strength, stainless steel and are built to maintain dimensional tolerances at the high temperatures of lead-free processing.

Advanced automatic chain lubrication and motorized width adjustment are standard features on the pin conveyor. Automatic width adjustment of the pin conveyor, based on the parameter settings for specific reflow programs, is available as an option. For processing of larger PCBs at higher lead-free temperatures, a center support system is available to prevent board warpage.

Conveyor speed is programmable from 400-1800 mm (16″-71″) per minute to accommodate any process requirement.

Nitrogen Atmosphere Compatible Models Widen Lead-Free Processing Window Through Reduced Oxidation

While the debate over air or inert reflow atmospheres continues, as an option, offers the S-R1000 in a nitrogen-compatible configuration for manufacturers who want the flexibility for soldering in both environments.

Most experts agree that the reduction of oxygen through the introduction of an inert gas (usually N2) will allow a wider process window and provide better solder joints through reduced oxidation. The enhanced flow design of the heating chamber in the S-R1000 nitrogen compatible system lends itself to efficient heat transfer and ensures low nitrogen consumption while maintaining O2 levels between 300-1000 ppm.

CR-10000 reflow oven internal water-chilled recirculating cooling system available

Internal Water Cooling Provides Maximum Control Over Critical Cooling Rates Required By Some Lead-Free Solders

Because the higher liquidus temperatures required by lead-free solders approach the limits of many SMT components and PCB assemblies, more aggressive cooling is often required to reduce peak temperature exposure times. Some recent studies also indicate that cooling rates have a significant effect on solder joint grain structure.

For these reasons, an internal water-chilled recirculating cooling system is available for the S-R1000. It allows users to alter cooling rates to meet solder paste manufacturers recommendations to a much greater degree than is possible with the exclusive use of air cooling.

CR-10000 reflow oven real-time profiling

Advanced Functionality and Process Management Capability

Operation and control of all  reflow systems is accomplished through an attractive, colorful, visual user interface that features a full-screen, virtual view of the system with display of pre-set and actual zone temperatures, system status and conveyor speed.

The Windows-based operating system and control software includes advanced functions for temperature profiling, timed automatic startup and shutdown, audible and visual alarms, and password protection.

A PC-controller with 15″ flat screen monitor, keyboard and trackball allow unlimited storage and networking capability.

All systems employ UPS battery backup to ensure removal of all product from the oven in the event of a power outage.

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