Lead-free or Tin-lead Through-hole Soldering
adjustable dual waves permit lead-free or tin/lead processing of through-hole and SMD boards to a maximum width of 250 mm
As PCBs are loaded onto the adjustable titanium finger conveyor, they are automatically prepped by an adjustable internal spray fluxing system which houses a precision spray nozzle assembly mounted to a reciprocating Y-axis drive mechanism to ensure even and accurate application of flux.
Run as Dual or Single Wave
Solder processing temperature is settable to a lead-free compatible 300°C. The system includes an economical low-volume 200 kg (550 lbs. Approximate weight for lead free solder) capacity solder pot with an easy-handling roll-out feature. A built-in alarm signals when solder level is at the refill point.
Forced Hot Air Convection Pre-Heat
The preheat stage takes place in a 600 mm (23.6″) glass-covered chamber where boards are heat-bathed by energy-saving forced hot air convection, as opposed to power-consuming, uneven IR heat.
