THT Dual Sided AOI

Description

 

 

THT AOI (DIP AVI) – Before or after Wave soldering , use high speed in-line AOI solution – Applicable for • Before or after Wave solder THT/DIP component insertion check (DIP through hole component) • Optional: Press-fit inspection ability of pressing parts • Optional: SMD component placement test ability

SMT,THT,PCB,PCBA,AI,wave soldering,reflow oven,nozzle,feeder,wave soldering

SMT,THT,PCB,PCBA,AI,wave soldering,reflow oven,nozzle,feeder,wave soldering

Typical Defect Types

THT/DIP Components

  • –Missing / Wrong Components
  • *Optical shape recognition
  • *Color and Band Inspection
  • –Polarity Check
  • *Electrolytic Capacitors, Resistors & Diodes
  • *All components w/ text including IC’s (character verification)
  • *Connectors and other components w/ polarity requirements
  • –Solder Bridge and Solder Joint

◆Optional inspection functions

  • –Press-fit Inspection (down to 0.5×0.5mm2)
  • *Lifted components & Pin shifting (top side)
  • *Pin invisible & Pin unseated (bottom side)
  • –SMD Inspection (down to 0603 package)
  • *Drop / Wrong parts / Polarity check
  • *Solder bridge
  • *Missing components (down to 0402 package)
  • –Label Inspection by OCR
  • *Missing component
  • *Polarity check

◆Optional inspection functions

  • –Surface Inspection (down to 0.5×0.5mm2)
  • *Board surface inspection (scratch, particle)
  • *Drop solder / component –Laser Height Detection (down to 0.5×0.5mm2)
  • *Lifted components & Pin shifting (top side)

CLICK HERE TO SEND ME A EMAIL

Save

Save

Save