THT Dual Sided AOI

Description

 

 

THT AOI (DIP AVI) – Before or after Wave soldering , use high speed in-line AOI solution – Applicable for • Before or after Wave solder THT/DIP component insertion check (DIP through hole component) • Optional: Press-fit inspection ability of pressing parts • Optional: SMD component placement test ability

Typical Defect Types

◆THT/DIP Components

• –Missing / Wrong Components
• *Optical shape recognition
• *Color and Band Inspection
• –Polarity Check
• *Electrolytic Capacitors, Resistors & Diodes
• *All components w/ text including IC’s (character verification)
• *Connectors and other components w/ polarity requirements
• –Solder Bridge and Solder Joint

◆Optional inspection functions

• –Press-fit Inspection (down to 0.5×0.5mm2)
• *Lifted components & Pin shifting (top side)
• *Pin invisible & Pin unseated (bottom side)
• –SMD Inspection (down to 0603 package)
• *Drop / Wrong parts / Polarity check
• *Solder bridge
• *Missing components (down to 0402 package)
• –Label Inspection by OCR
• *Missing component
• *Polarity check

◆Optional inspection functions

• –Surface Inspection (down to 0.5×0.5mm2)
• *Board surface inspection (scratch, particle)
• *Drop solder / component –Laser Height Detection (down to 0.5×0.5mm2)
• *Lifted components & Pin shifting (top side)

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