Description
THT AOI (DIP AVI) – Before or after Wave soldering , use high speed in-line AOI solution – Applicable for • Before or after Wave solder THT/DIP component insertion check (DIP through hole component) • Optional: Press-fit inspection ability of pressing parts • Optional: SMD component placement test ability
Typical Defect Types
- –Missing / Wrong Components
- *Optical shape recognition
- *Color and Band Inspection
- –Polarity Check
- *Electrolytic Capacitors, Resistors & Diodes
- *All components w/ text including IC’s (character verification)
- *Connectors and other components w/ polarity requirements
- –Solder Bridge and Solder Joint
◆Optional inspection functions
- –Press-fit Inspection (down to 0.5×0.5mm2)
- *Lifted components & Pin shifting (top side)
- *Pin invisible & Pin unseated (bottom side)
- –SMD Inspection (down to 0603 package)
- *Drop / Wrong parts / Polarity check
- *Solder bridge
- *Missing components (down to 0402 package)
- –Label Inspection by OCR
- *Missing component
- *Polarity check
◆Optional inspection functions
- –Surface Inspection (down to 0.5×0.5mm2)
- *Board surface inspection (scratch, particle)
- *Drop solder / component –Laser Height Detection (down to 0.5×0.5mm2)
- *Lifted components & Pin shifting (top side)
