| 1. Environmental and ESD Control | |
| 1.1 | Are there temperature & humidity sensors in the Manufacturing area to monitor temperature & humidity over time? |
| 1.2 | Are there documented upper & lower specification limits for temperature and humidity to assure Paste viscosity, ESD & MSD control? |
| 1.3 | Is there evidence to demonstrate that effective action was taken when the temperature/humidity was outside the defined limits? |
| 1.4 | If AC Ground is used as Earth Ground for ESD purposes, is it clearly understood that AC Ground must be connected to a grounding rod? |
| 1.5 | Is ESD Earth Ground impedance (grounding rod to earth) measured at least annually? |
| 1.6 | Does the above measurement result comply with established specifications? |
| 1.7 | Is either an ESD Conductive or Static Dissipative floor installed in the Manufacturing areas? ESD Matting also scores 0, except for 7 thru 10. |
| 1.8 | Is there evidence that the floor was installed using conductive adhesive with copper earth grounding straps? |
| 1.9 | Is there evidence that the floor is cleaned in accordance with the floor/coating manufacturer’s specification? |
| 1.10 | Are fixed material storage racks for components/assemblies earth grounded? |
| 1.11 | Do portable material storage racks for components/assemblies use conductive wheels or drag chains to contact the ESD floor? |
| 1.12 | Are all machines ESD Earth Grounded? |
| 1.13 | Are timed Resistance-to-Ground tests conducted using an ESD Meter to periodically evaluate ESD performance? |
| 1.14 | Is there evidence that at least five tests are taken per 5000 square feet of production floor space? |
| 1.15 | Is there evidence of periodic performance testing of the floor, fixtures, and all work and material storage surfaces in the ESD protective area? |
| 1.16 | Are ESD protective areas appropriately marked and labeled? |
| 1.17 | Is there evidence that anyone in the ESD protective area is required to wear ESD Smocks and two ESD Shoe Straps/ESD Shoes? Note* |
| 1.18 | Is there evidence that anyone seated must use a wired ESD strap while handling components in addition to Shoe Straps/ESD Shoes? |
| 1.19 | Is there evidence that the chairs used are ESD safe and are they in conductive contact with the floor? |
| 1.20 | Is there evidence that Shoe Straps/ESD Shoes and wired wrist/ankle straps are tested each time ESD Protective items are garbed? |
| 1.21 | Is there evidence that the materials used in operator tools inside the ESD protective area ESD safe? |
| 1.22 | Is there evidence that Antistatic & Static dissipative material (usually pink) is not used outside the ESD area for component storage? |
| 1.23 | Is there evidence that Static Shielded material (usually gray) is used outside the ESD area for component storage? |
| 1.24 | Is there evidence that periodic Static Audits are conducted to verity the ESD grounding system deployed in the ESD area? |
| 2. Line Set-Up and Control | |
| 2.1 | Is a Forced Board Routing system and WIP Tacking system fully deployed throughout SMT, PTH and Test? |
| 2.2 | Are all boards tracked through the process by serial number and is board history available for traceability purposes? |
| 2.3 | Does the system verify the ‘last’ step processed and compare it to the expected ‘last’ step? |
| 2.4 | Are quality performance or buffer trigger points established to ensure machine shut down should the limits be exceeded? |
| 2.5 | Are line shutdown criteria clearly specified for both quality and buffer limiting requirements? |
| 2.6 | Is there a documented checklist available and in use to ensure successful product changeover? |
| 3. Machine Maintenance | |
| 3.1 | Is there a recommended Spare Parts list for the selected machine? |
| 3.2 | Are on-hand stock quantities and minimum reorder points set and controlled using a database? |
| 3.3 | Does the on-hand stock balance reflect the physical stock quantities for two samples taken? |
| 3.4 | Are Daily Maintenance logs kept at the machine and are they up to date? |
| 3.5 | Is a Preventative Maintenance System used to flag when periodic Preventative Maintenance is required? |
| 3.6 | Is there evidence to demonstrate that Preventative Maintenance records are up-to-date? |
| 3.7 | Are problem descriptions and their closure recorded and verified on the Daily and Preventative Maintenance logs? |
| 4. Machine Operator | |
| 4.1 | Does the Operator have the Standard Operating Procedure (SOP) for the machine available to them at all times? |
| 4.2 | Are WIs & SOPs free of hand written updates? Temporary hand written updates are OK if signed and dated with expiration date <48 hrs. |
| 4.3 | Is there evidence that the Operator has been trained and certified against the Standard Operating Procedure for the Machine? |
| 4.4 | Does the Operator know the content of the Standard Operating Procedure for the Machine and do they and follow it? (Score 1 if the operator has not memorized the contents, but can quickly reference the SOP to answer the auditors questions.) |
| 4.5 | Are Operators required to log in at the Machine station and does this provide an automatic verification of training status? |
| 5. PCBA Inspector | |
| 5.1 | Is the Inspector required to wear gloves or finger cots when handling boards and do they wear them? |
| 5.2 | Does the Inspector have the IPC-610 standard available to them at all times? (Score 1 if a copy of IPC 610 is available in the general area.) |
| 5.3 | Is there evidence that the Inspector has been trained and certified against the IPC-610 Standard and on component identification? |
| 5.4 | Does the Inspector know the content of the IPC-610 Standard and are they able to read component identification markings? |
| 5.5 | Are Operators required to log in at the inspection station and does this provide an automatic verification of training status? |
| 5.6 | Do quality inspectors have access to sampling plans (e.g. ANSI, MIL, ASQ) at all times? |
| 5.7 | Does the quality inspector know the sampling plan and switching rules for increased/decreased sample sizes? |
| 5.8 | Does quality inspector have access to product specific reference tools, (e.g. golden unit, templates)? |
| 5.9 | Is there evidence that quality inspector has been trained/certified in basic quality practices and statistics/SQC? |
| 6. Chemical Compatibility | |
| 6.1 | Is there a master matrix which outlines the Chemical Compatibility for solder wire, fluxes, flux pens, cleaning solutions, etc? |
| 6.2 | Was a study conducted to assure the chemical compatibility of the consumables on the list and is it available? |
| 6.3 | Are specifications readily available for the various types of solder, flux, cleaning agents, etc. being used? |
| 6.4 | Are Chemical Industry standard labeling used to identify all chemicals used, e.g. flux, alcohol, etc? |
| 7.Programmed Parts | |
| 7.1 | Are revision controlled Work Instructions displayed for the operator at the programming station? (Score 0 if any unsigned/undated handwritten instructions or any handwritten instructions more than 48 hrs old) |
| 7.2 | Are component part numbers and their descriptions specified on Work Instructions? |
| 7.3 | Are component descriptions sufficiently detailed to ensure the correct blank component is being used? |
| 7.4 | Are label part numbers identified and a drawing/picture of the label contents included on the Work Instruction if labels are required? |
| 7.5 | Is the orientation of the label on the component consistent and does it include the correct checksum information if required? |
| 7.6 | Are parts only labeled post programming with the program information if such info is required as per Dell’s specification drawings? |
| 7.7 | Is there evidence to demonstrate that programmed parts are clearly segregated from unprogrammed parts? |
| 7.8 | Is the Master Program name/number and revision indicated on the Work Instructions and traceable to the current PCBA revision? |
| 7.9 | Do Work Instructions indicate the orientation for loading blank components into the programmer? |
| 7.10 | Are the Moisture Sensitive Devices (MSDs) readily known to the operator? |
| 7.11 | Are MSDs time stamped at opening and their exposure time recorded as a result of programming? |
| 7.12 | Can MSD control, according to J-STD-033A,l be demonstrated for MSD devices that need programming? |
| 7.13 | Is the orientation of programmed parts in their packaging preserved before and after programming? |
| 7.14 | Is there evidence that a defined process for non-conforming material such as damaged, failing or programmable parts is in operation? |
