| 1. Work Instructions | |
| 1.1 | Is there a revision controlled Operator Work Instruction which contains unique details for the specific product being built? (Score 0 if any unsigned/undated handwritten instructions or any handwritten instructions more than 48 hrs old) |
| 1.2 | Are Work Instructions readily available to the operator and are they followed at Paste Print? |
| 1.3 | Is the Solder Paste specified in the Paste Printing program or on Work Instructions? |
| 1.4 | Is the Solder Paste manufacturer, number, & mesh defined in the Paste Print Program or on Work Instructions? |
| 1.5 | Is the Stencil’s identification specified in the Paste Printing program or on Work Instructions? |
| 1.6 | Is the Stencil’s identification traceable to a specific PWB part number, revision level and board side? |
| 1.7 | Is the Stencil loading orientation specified on the Stencil or on Work Instructions? |
| 1.8 | Is the Squeegee in use specified in the Paste Print program or Work Instructions? |
| 1.9 | Is the number, location, type and height of the Support Blocks/Pins specified on Work Instructions? |
| 1.10 | Are all hand tools needed by the operator listed with their descriptions on Work Instructions? |
| 1.11 | Has the use of metal tools for the application and/or removal of paste been specifically disallowed? |
| 1.12 | Is the PWB part number and Revision specified on the Work Instruction or line set-up instructions? |
| 1.13 | Is the PWB orientation to the Stencil identified in the Work Instructions or line set-up instructions? |
| 1.14 | Is the machine Program Name specified on the Work Instruction or line set-up instructions? |
| 2. Solder Paste | |
| 2.1 | Is there a Standard Operating Procedure for the cold storage of solder paste? |
| 2.2 | Is the cold storage temperature within the manufacturers’ recommended range for all solder paste in cold storage? |
| 2.3 | Is the Solder Paste FIFO controlled while in cold storage? A gravity feed rack is preferred. |
| 2.4 | Does the cold storage unit have a temperature recorder, which can be read without opening the unit, to record temperature over time? |
| 2.5 | Is there a documented requirement to periodically check that the recorded temperature is within the required storage limits? |
| 2.6 | Is there evidence to demonstrate that action was taken when the temperature was outside the defined storage limits? |
| 2.7 | Is the cold storage expiration date of the Solder Paste specified on the Solder Paste container? |
| 2.8 | Is the date and time that the Solder Paste has been removed from cold storage specified on its container? |
| 2.9 | Is the date and time that the Solder Paste is available for use, after removal from cold storage, specified on its container? |
| 2.10 | Is the date and time that the Solder Paste expires at ambient temperature with its ‘seal broken’ documented and known? |
| 2.11 | Is the date and time that the Solder Paste expires at ambient temperature with its ‘seal in place’ documented and known? |
| 2.12 | Is there evidence to demonstrate that this information has been correctly completed and that this process is fully understood by users? |
| 2.13 | Are Screen Print Operators required to wear gloves when handling Solder Paste? |
| 2.14 | Is there a specification readily available for the Solder Paste? |
| 2.15 | Is the mesh for the Solder Paste used suitable for the pitch technology on the board being built? |
| 2.16 | Is the maximum time that the Solder Paste is allowed to remain on a board prior to reflow documented, known, & followed? |
| 2.17 | Is the Solder Paste lot code recorded and fully and easily traceable to the individual product serial number product? |
| 3. Stencil | |
| 3.1 | Are all Stencils adequately stored in a manner to avoid potential damage and to keep out foreign or airborne materials? |
| 3.2 | Are all Stencils identified with process proof labels or plates which are visible when the stencil is in its rack or mounted in the Printer? |
| 3.3 | Is the Stencil cleaned in a automatic stencil cleaner at the end of a production run or after a fixed time has elapsed? |
| 3.4 | Is there a documented requirement to inspect a Stencil for damage once cleaned? |
| 3.5 | Is the evidence of cleaning and inspection documented? |
| 3.6 | Is there a documented Stencil Cleaning process which identifies the chemicals, wash times, dry times, & consumables to be used? |
| 3.7 | Is there a documented Stencil Cleaner maintenance procedure which defines frequency for checking filters and solution levels? |
| 3.8 | Is there evidence to demonstrate that the Stencil Cleaner’s Maintenance procedure and records are adequate and up-to-date? |
| 3.9 | Is there a documented requirement to periodically check the Stencil tension and is there evidence that this is done? |
| 3.10 | Is there a document which specifies Stencil ordering requirements with respect to size, thickness, ratio, orientation, identification, etc.? |
| 3.11 | Is there a document which specifies the conditions for when Laser vs. Chemical Etched vs. Electroformed Nickel, should be used? |
| 3.12 | Is there evidence to demonstrate that the Stencil ordering requirements are followed? |
| 3.13 | Is there a documented Stencil First Article procedure which checks, tension, thickness, aperture sizes and design, first print, etc.? |
| 3.14 | Is there evidence to demonstrate that the Stencil First Article procedure and records are adequate and up-to-date? |
| 4. Squeegee | |
| 4.1 | Are the Squeegees length, angle, style/durometer, defined to ensure correct Squeegee selection? |
| 4.2 | Is there evidence to demonstrate that the Squeegee used is correct and is fully and easily traceable to the product and stencil? |
| 4.3 | Are all Squeegees adequately stored in a manner to avoid potential damage? |
| 4.4 | Is there evidence that Squeegees inspected for damage prior to use and prior to storage? |
| 4.5 | Is there a requirement to ensure the Squeegee is leveled either automatically or manually documented, prior to use? |
| 5. Vacuum Blocks and Tooling | |
| 5.1 | Is there a documented requirement to indicate that Blocks, Support Pins or Vacuum Blocks are needed for specific products? |
| 5.2 | Are all Vacuum Blocks identified with a name or tooling number that is fully and easily traceable to the product and board side? |
| 5.3 | Are all Vacuum Blocks clean and adequately stored in a manner to avoid potential damage? |
| 6. PCB | |
| 6.1 | Are there satisfactory methods in place to control PCB handling and exposure? |
| 6.2 | Does the PWB part number and Revision cross-reference to the PCBA part number and Revision? |
| 6.3 | Is a unique tracking label or PPID label placed on the PWB for tracking purposes at Paste Print? Score NA if Dell Assy Dwg does not require. |
| 6.4 | Does the unique tracking label or PPID label date code specify the date the PWB was paste printed? |
| 6.5 | Are misprinted PWBs cleaned in an automatic board cleaner using appropriate fixturing? |
| 6.6 | Is there a documented Board Cleaning process which identifies the chemicals, wash times, dry times, & consumables to be used? |
| 7. Machine Capability | |
| 7.1 | Is the Paste Printing technology suitable for the product being built? |
| 7.2 | Is the Paste Printing operation automated with fiducial camera alignment? |
| 7.3 | Is contact printing with stainless steel stencils and squeegees being used? |
| 7.4 | Does the Printing machine have the capability to automatically wet and dry wipe the Stencil? |
| 7.5 | Does the Printing machine use the automatic wet and dry wipe capability? |
| 7.6 | Does the Printing machine have Vacuum Stencil clean capability? |
| 7.7 | Does the Printing machine use Vacuum Stencil clean? |
| 7.8 | Is there a documented minimum frequency for stencil clean specified based on the technology used on the board? |
| 7.9 | Are stencil wet and/or dry automatic clean rates specified for each product and shown in the program? |
| 7.10 | Are all materials used to wipe the stencil specified as low lint or preferably lint free? |
| 7.11 | Are changes to clean rates approved based only upon performance feedback? |
| 7.12 | Does the Printing machine have the capability to automatically dispense Solder Paste? |
| 7.13 | Does the Printing machine use automatic Solder Paste dispense? |
| 7.14 | Does the Printing machine flag when the Solder Paste container is near empty? |
| 7.15 | Are all Printers enclosed in order to keep out foreign or airborne materials? |
| 7.16 | Are localized climate control units installed and in use on all Paste Printers? |
| 7.17 | Is the Printing machine programmable? If not score 0 for next 4 questions. |
| 7.18 | Is the machine Program Name revision controlled to show traceability of program changes? |
| 7.19 | Is the machine Program Name traceable to the PCB and PCBA part number? |
| 7.20 | Is access to the machine program password protected with restricted access? |
| 7.21 | Do program changes to critical parameters during machine control remain unsaved unless approved by a technician/engineer? |
| 8. Solder Paste | |
| 8.1 | Is automatic 2D or 3D solder paste inspection deployed and effective? Review ICT or AOI/AXI results to determine effectiveness. |
| 8.2 | Can it be demonstrated that the machine calls are reviewed by the operator to determine if real or false? |
| 8.3 | Is the 2D or 3D coverage % calculated based on the total # of pads with 2D or 3D vs the total # of apertures on the stencil? |
| 8.4 | Does the exit conveyor from the API Equipment, stop to allow for verification of defects so that defective boards may be captured? |
| 8.5 | Are rejected boards automatically stopped on this conveyer for operator false call validation? |
| 8.6 | Are changes to 2D or 3D coverage made based only on performance feedback? Is this reflected in the Program Revision? |
| 8.7 | Is there a document which defines the effect of changing critical Paste Printing parameters on the quality of the output? |
| 9. PCBA | |
| 9.1 | Are outputted boards at least sample inspected for print quality to ensure process control? |
| 9.2 | Is there a documented frequency for checking print quality? |
| 9.3 | Is there evidence to demonstrate that this print quality inspection is conducted? |
| 9.4 | Is there a specification that defines acceptability of paste printing, available and used at the Paste Printer? |
