|1. Work Instructions
|Is there a revision controlled Operator Work Instruction which contains unique details for the specific product being built? (Score 0 if any unsigned/undated handwritten instructions or any handwritten instructions more than 48 hrs old)
|Are Work Instructions readily available to the operator and are they followed at Paste Print?
|Is the Solder Paste specified in the Paste Printing program or on Work Instructions?
|Is the Solder Paste manufacturer, number, & mesh defined in the Paste Print Program or on Work Instructions?
|Is the Stencil’s identification specified in the Paste Printing program or on Work Instructions?
|Is the Stencil’s identification traceable to a specific PWB part number, revision level and board side?
|Is the Stencil loading orientation specified on the Stencil or on Work Instructions?
|Is the Squeegee in use specified in the Paste Print program or Work Instructions?
|Is the number, location, type and height of the Support Blocks/Pins specified on Work Instructions?
|Are all hand tools needed by the operator listed with their descriptions on Work Instructions?
|Has the use of metal tools for the application and/or removal of paste been specifically disallowed?
|Is the PWB part number and Revision specified on the Work Instruction or line set-up instructions?
|Is the PWB orientation to the Stencil identified in the Work Instructions or line set-up instructions?
|Is the machine Program Name specified on the Work Instruction or line set-up instructions?
|2. Solder Paste
|Is there a Standard Operating Procedure for the cold storage of solder paste?
|Is the cold storage temperature within the manufacturers’ recommended range for all solder paste in cold storage?
|Is the Solder Paste FIFO controlled while in cold storage? A gravity feed rack is preferred.
|Does the cold storage unit have a temperature recorder, which can be read without opening the unit, to record temperature over time?
|Is there a documented requirement to periodically check that the recorded temperature is within the required storage limits?
|Is there evidence to demonstrate that action was taken when the temperature was outside the defined storage limits?
|Is the cold storage expiration date of the Solder Paste specified on the Solder Paste container?
|Is the date and time that the Solder Paste has been removed from cold storage specified on its container?
|Is the date and time that the Solder Paste is available for use, after removal from cold storage, specified on its container?
|Is the date and time that the Solder Paste expires at ambient temperature with its ‘seal broken’ documented and known?
|Is the date and time that the Solder Paste expires at ambient temperature with its ‘seal in place’ documented and known?
|Is there evidence to demonstrate that this information has been correctly completed and that this process is fully understood by users?
|Are Screen Print Operators required to wear gloves when handling Solder Paste?
|Is there a specification readily available for the Solder Paste?
|Is the mesh for the Solder Paste used suitable for the pitch technology on the board being built?
|Is the maximum time that the Solder Paste is allowed to remain on a board prior to reflow documented, known, & followed?
|Is the Solder Paste lot code recorded and fully and easily traceable to the individual product serial number product?
|Are all Stencils adequately stored in a manner to avoid potential damage and to keep out foreign or airborne materials?
|Are all Stencils identified with process proof labels or plates which are visible when the stencil is in its rack or mounted in the Printer?
|Is the Stencil cleaned in a automatic stencil cleaner at the end of a production run or after a fixed time has elapsed?
|Is there a documented requirement to inspect a Stencil for damage once cleaned?
|Is the evidence of cleaning and inspection documented?
|Is there a documented Stencil Cleaning process which identifies the chemicals, wash times, dry times, & consumables to be used?
|Is there a documented Stencil Cleaner maintenance procedure which defines frequency for checking filters and solution levels?
|Is there evidence to demonstrate that the Stencil Cleaner’s Maintenance procedure and records are adequate and up-to-date?
|Is there a documented requirement to periodically check the Stencil tension and is there evidence that this is done?
|Is there a document which specifies Stencil ordering requirements with respect to size, thickness, ratio, orientation, identification, etc.?
|Is there a document which specifies the conditions for when Laser vs. Chemical Etched vs. Electroformed Nickel, should be used?
|Is there evidence to demonstrate that the Stencil ordering requirements are followed?
|Is there a documented Stencil First Article procedure which checks, tension, thickness, aperture sizes and design, first print, etc.?
|Is there evidence to demonstrate that the Stencil First Article procedure and records are adequate and up-to-date?
|Are the Squeegees length, angle, style/durometer, defined to ensure correct Squeegee selection?
|Is there evidence to demonstrate that the Squeegee used is correct and is fully and easily traceable to the product and stencil?
|Are all Squeegees adequately stored in a manner to avoid potential damage?
|Is there evidence that Squeegees inspected for damage prior to use and prior to storage?
|Is there a requirement to ensure the Squeegee is leveled either automatically or manually documented, prior to use?
|5. Vacuum Blocks and Tooling
|Is there a documented requirement to indicate that Blocks, Support Pins or Vacuum Blocks are needed for specific products?
|Are all Vacuum Blocks identified with a name or tooling number that is fully and easily traceable to the product and board side?
|Are all Vacuum Blocks clean and adequately stored in a manner to avoid potential damage?
|Are there satisfactory methods in place to control PCB handling and exposure?
|Does the PWB part number and Revision cross-reference to the PCBA part number and Revision?
|Is a unique tracking label or PPID label placed on the PWB for tracking purposes at Paste Print? Score NA if Dell Assy Dwg does not require.
|Does the unique tracking label or PPID label date code specify the date the PWB was paste printed?
|Are misprinted PWBs cleaned in an automatic board cleaner using appropriate fixturing?
|Is there a documented Board Cleaning process which identifies the chemicals, wash times, dry times, & consumables to be used?
|7. Machine Capability
|Is the Paste Printing technology suitable for the product being built?
|Is the Paste Printing operation automated with fiducial camera alignment?
|Is contact printing with stainless steel stencils and squeegees being used?
|Does the Printing machine have the capability to automatically wet and dry wipe the Stencil?
|Does the Printing machine use the automatic wet and dry wipe capability?
|Does the Printing machine have Vacuum Stencil clean capability?
|Does the Printing machine use Vacuum Stencil clean?
|Is there a documented minimum frequency for stencil clean specified based on the technology used on the board?
|Are stencil wet and/or dry automatic clean rates specified for each product and shown in the program?
|Are all materials used to wipe the stencil specified as low lint or preferably lint free?
|Are changes to clean rates approved based only upon performance feedback?
|Does the Printing machine have the capability to automatically dispense Solder Paste?
|Does the Printing machine use automatic Solder Paste dispense?
|Does the Printing machine flag when the Solder Paste container is near empty?
|Are all Printers enclosed in order to keep out foreign or airborne materials?
|Are localized climate control units installed and in use on all Paste Printers?
|Is the Printing machine programmable? If not score 0 for next 4 questions.
|Is the machine Program Name revision controlled to show traceability of program changes?
|Is the machine Program Name traceable to the PCB and PCBA part number?
|Is access to the machine program password protected with restricted access?
|Do program changes to critical parameters during machine control remain unsaved unless approved by a technician/engineer?
|8. Solder Paste
|Is automatic 2D or 3D solder paste inspection deployed and effective? Review ICT or AOI/AXI results to determine effectiveness.
|Can it be demonstrated that the machine calls are reviewed by the operator to determine if real or false?
|Is the 2D or 3D coverage % calculated based on the total # of pads with 2D or 3D vs the total # of apertures on the stencil?
|Does the exit conveyor from the API Equipment, stop to allow for verification of defects so that defective boards may be captured?
|Are rejected boards automatically stopped on this conveyer for operator false call validation?
|Are changes to 2D or 3D coverage made based only on performance feedback? Is this reflected in the Program Revision?
|Is there a document which defines the effect of changing critical Paste Printing parameters on the quality of the output?
|Are outputted boards at least sample inspected for print quality to ensure process control?
|Is there a documented frequency for checking print quality?
|Is there evidence to demonstrate that this print quality inspection is conducted?
|Is there a specification that defines acceptability of paste printing, available and used at the Paste Printer?