Automated optical inspection machine (AOI) is a new type of testing technology. It has developed very rapidly in recent years. The structure of AOI consists of four parts: workbench, CCD camera system, electromechanical control and system software. When testing, firstly, the circuit board to be tested is placed on the workbench of the AOI machine, and the detection procedure of the product to be detected is called out through positioning. The X/Y workbench will send the circuit board under the lens according to the command of the setting program. With the help of the special light source, the lens will capture the image required by the AOI system and analyze it, then the processor will move the lens toward the lens. The next position is collected for the next image and then analyzed, and the image is subjected to continuous analysis and processing to obtain a higher detection speed. The process of AOI image processing essentially digitizes the extracted image, and then compares it with the pre-stored “standard”. After analysis and judgment, it finds the defect to make a position prompt, and at the same time generates image text, and the operator further confirms or sends the repair station. Overhaul.
Why Use AOI ?
AOI plays a full role in the miniaturization, high-density, rapid assembly, and diversified development of SMT. The amount of information detected is large and complex, both in terms of real-time detection and feedback, and in the analysis and diagnosis of correctness. The era of manual visual inspection is gone forever. The intelligent development of AOI technology is bound to become an inevitable development trend.
Automated optical inspection S-AO600C AOI machine for PCB Assembly Inspection.
Specifications:
| ON LINE S-AO600C | OFF LINE S-AO680C | ||
| Detection application | Applicable process | Solder paste before and after SMT reflow, before and after DIP wave soldering | |
| Programming mode | Manuor ,auto written, CAD data import automatic corresponding component library | ||
| Detection type | Solder paste printing: presence, offset, less tin, more tin, open circuit, even tin, pollution, scratches, etc. | ||
| Defects in parts: missing parts, multiple pieces, offsets, skews, tombstones, sideways, flips, wrong parts, breakage, reverse, etc. | |||
| Solder joint defects: more tin, solder, tin, solder balls, glue, pins not exposed, copper foil contamination. | |||
| Calculation method | Color calculation, color extraction, grayscale calculation, image contrast, etc. | ||
| Detection mode | Optimized inspection technology covering the entire board, jigsaw and multi-mark, including Bad mark function | ||
| SPC Statistical function | Record test data and perform statistics and analysis throughout, and view production status and quality analysis in any area | ||
| Component angle | Support 0~359° rotation, minimum 1° angular distance | ||
| Mini Component | 15um/Pixel：01005 chip、0.3 pitch IC | ||
| Optical configuration | Camera | Full color high speed industrial digital camera | |
| Lens resolution | 10um/15um/18um/20um/25um | ||
| Light source | Ring stereo multi-channel color light, depending on application selection RGB/RGBW/RGBR/RWBR | ||
| Computer | CPU | Intel core | |
| VGA | NVIDIA 1GB+ | ||
| RAM | 4GB | ||
| HDD | 500GB+ | ||
| OS | Win XP 32bit | ||
| Monitor | 22 inches(Top door)，16:10 | 22 inches，16:10 | |
| ON LINE S-AO600C | OFF LINE S-AO680C | ||
| Machine system | Transmission and detection methods | Auto，L-R/R-L， Stepper motor to transport PCB and widen track， XY servo motor drive camera take picture | Manual， Y servo motor move PCB， X servo motor drive camera take picture |
| PCB-Größe | 50*50mm (Min.) ～400*360mm (Max.) | 20*20mm (Min.) ～460*350mm (Max.) | |
| PCB-Dicke | 0,3 bis 5,0 mm | ||
| PCB-Gewicht | Maximal: 3 kg | ||
| PCB-Marge | 3mm, (kann nach Maß gefertigt werden) | ||
| PCB-Krümmung | <5 mm oder 3 % der Leiterplattendiagonalenlänge | ||
| PCB-Komponente H | Oben: 35 mm, Unten: 75 mm.Verstellbar | ||
| XY-Antriebssystem | AC-Servomotor, präzisionsgeschliffene Kugelumlaufspindel | ||
| XY-Bewegungsgeschwindigkeit | Max: 830 mm/s | ||
| XY-Positionierungsgenauigkeit | ≦8um | ||
| Parameter | Abmessungen | L980 * B960 * H1600 mm | L900 * B1100 * H1400 mm |
| Leistung | AC220V/110V, 50/60Hz, 1,5KW | AC220V, 50/60Hz, 1,2KW | |
| PCB-Förderhöhe | 900 ± 20 mm | 820 ± 20 mm | |
| Gewicht | 600 kg | 360 kg | |
| Kommunikationsstecker | Smema | — | |
| Luftversorgung | 0,5 MPa (optionale Stromverteilungssteuerung) | Keine Verwendung | |
| Zertifizierung | Erfüllen Sie die CE-Sicherheitsstandards | ||
| Umgebungstemperatur und Luftfeuchtigkeit | 10–35 °C, 35–80 % relative Luftfeuchtigkeit (keine Kondensation). | ||
[pdf-embedder url=“//hk03-1251009151.file.myqcloud.com/smthelp.com/desc/2019/07/AOI-machine-S-AO600C-for-PCB-Assembly-Inspection.pdf“ title=“ AOI-Maschine S-AO600C für die Inspektion von Leiterplattenbestückungen“]
