For a brief time, we will be giving away a FREE Gerber File.
For the first time, Southern Machinery is giving away a FREE Gerber File! If you need help with your design process, we are gladly here to help. Let us make your manufacturing set-up easy and efficient.
We at Southern Machinery know and understand what is needed for a successful PCB Assembly. If you need pharmacy guidance with design, CAD, equipment configuration, training, just ask! Southern Machinery is not just a place to buy machines, but also a place to get your technical questions answered. So ask us! We want to help you find your PCBA solutions.
Industrial IoT, exciting words that get thrown around in today’s EMS. While we are actively engaged with developing Smart Factories with embedded technologies, we know that today’s after-sales services are vital. Here’s a look at our process and how you can find confidence in our approach to After-Sales Services.
After Sales Service Plan:
We arrange for your engineers to come to China and offer accommodationsincluding meals, and transportation while learning in our facilities.
Installation – your equipment is delivered and installed by our engineers
We then send our engineers to your home factory
We recommend 7-15 days of Training and Production for full quality control
Our Engineers are responsible for training your team and work with you to produce your products
Follow-up – our team follows-up to ensure things are running smoothly
Our engineers are always here to make sure that your EMS Factory is always performing at top capacity. Here are some of the ways we ensure that you have everything you need to maintain top performing Equipment. We offer video trainings, Skype trainings, troubleshooting via Team Viewer, amongst other channels.
The future of After Installation Service with IoT:
With Industrial IoT, we look toward a future where all sensors will be extremely intelligent and collaborate to perform tasks via an entire network geared toward constant monitoring and improvement. Southern Machinery will continue to provide the customer service you are used to but will also have the capability to offer instant feedback with intelligent sensors that constantly read data and measure equipment output and quality. We look forward to this future with you.
Higher Quality, Lower Costs, Most Knowledgeable and helpful Engineers
Service Engineer Built Southern Machinery
Did you know that Southern Machinery was founded by a Veteran Service Engineer? Founder, Jason Wu spent over 12 years as a service engineer. Jason’s mode of operation is tailored to the engineering needs of your manufacturing system. If you need guidance with design, CAD, equipment configuration, training, just ask! Southern Machinery is not just a place to buy machines, but also a place to get your technical questions answered. So ask us! We want to help you solve your PCBA problems.
Do you have a question you need answered and can’t seem to locate the information you need? Ask us and we will feature your Q&A!
Ensuring the Best Design for Final PCB Production Stage with Testing! Ensuring the Best Design for Final PCB Production Stage with Testing!
Avoiding Design Mistakes with Testing
Improve EMS Productivity by Testing Early
PC Board errors are a drain to EMS productivity. Through analysis and testing PCBs in the pilot stages, a smoother and more educated production set-up can be achieved. By performing automatic impedance measurements and testing of components (chip resistors and capacitors) early on, you can ensure the best design for production.
We recommend applying the best design logics when creating your PCB layout and Test, Test, Test for maximum efficiency and output. According to Circuits Assembly’s December 2016 Magazine, here is the list of 5 Most Common PCB Design Mistakes: “1. The components do not suit the production technology 2. Thermal imbalance 3. Incompatibility between fabrication and assembly technology 4. Component placement at PCB edge 5. Placing fiducials on the PCB’s edge.”
Once you have planned your PC Board with best practices, Southern Machinery’s High-Speed In-line Circuit Board Test Machine will help with testing by incorporating a visual inspection function which allows mounting status checks on each component (e.g.: typo descriptions in alphanumeric characters, orientation, size) on the operator’s monitor will serve to best analyze testing up close. As well as automatically generating test data from mounting data and component list.
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What solution can reflect the quickest ROI (Return on Investment)?
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We welcome any of your inquiries, questions or concerns. Contact us to find out how to greatly save on your manufacturing costs, and increase your benefits.
Acceptability for Electronic Assemblies :Soldering Acceptability Requirements
Target-Class1,2,3 .Solder fillet appears generally smooth and exhibits good wetting of the solder to the parts being joined. .Outline of the parts is easily determined. .Solder at the part being joined creates a feathered edge. .Fillet is concave in shape.
See pic for examples of soldering anomalies.
Acceptable-Class1,2,3 .There are materials and processes,e.g.,lead free alloys and slow cooling with large mass PCBs, that may produce dull matte,gray,or grainy appearing solders that are normal for the material or process involved.These solder connections are acceptable. .The solder connection wetting angle (solder to component and solder to PCB termination do not exceed 90°(Figure). .As an exception,the solder connection to a termination may exhibit a wetting angle exceeding 90°(Figure)when it is
created by the solder contour extending over the edge of the solder able termination area or solder resist.
Figures below illustrate acceptable solder connections with various solder alloys and process conditions.
SnPb Solder； No Clean Process SnAgCu Solder;No Clean Process
Exposed basis metal on component leads,conductors or land surfaces from nicks,scratches,or other conditions cannot exceed
there quirements of 7.1.2.3 for leads and 10.2.9.1 for conductors and lands.
Component leads,sides of land patterns,conductors,and use of liquid photo image able solder resist,can have exposed basis
metal per original designs.
Some printed circuit board and conductor finishes have different wetting characteristics and may exhibit solder wetting only to
specific areas. Exposed basis metal or surface finishes should be considered normal under these circumstances,provided the
achieved wetting characteristics of the solder connection areas are acceptable.
Acceptable-Class 1,2,3 .Exposed basis metal on: .Vertical conductor edges. .Cut ends of component leads or wires. .Organic Solderability Preservative (OSP) coated lands. .Exposed surface finishes that are not part of the required solder fillet area.
Acceptable-Class 1
Process Indicator-Class 2,3
.Exposed basis metal on component leads,conductors or land surfaces from nicks or scratches provided conditions
do not exceed the requirements of7.1.2.3 for leads and 10.2.9.1 for conductors and lands.
Soldering Anomalies-Pin Holes/Blow Holes
Acceptable-Class1 ProcessIndicator-Class2,3
.Blowholes (Figures 1,2),pinholes (Figure 3),voids (Figures 4,5),etc.,providing the solder connection meets all other requirements.
1 2
3 4
5
Defect-Class 2,3
Solder connections where pin holes,blowholes,voids,etc. reduce the connections below minimum requirements(not shown).
Soldering Anomalies-Reflow of Solder Paste
Defect-Class1,2,3 .Incomplete reflow of solder paste.
Soldering Anomalies-Nonwetting
IPC-T-50 defines nonwetting as the inability of molten solder to form a metallic bond with the basis metal.In this Standard,that
includes surface finishes.
Defect-Class 1,2,3 .Solder has not wetted to the land or termination where solder is required. .Solder coverage does not meet requirements for this termination type.
Soldering Anomalies-Dewetting
Defect-Class 1,2,3 .Evidence of dewetting that causes the solder connection to not meet the SMT and thru-hole solder fillet requirements.
Soldering Anomalies-Excess Solder-Solder Balls/Solder Fines
Solder balls are spheres of solder that remain after the soldering process.Solder fines are typically small balls of the original
solder paste metal screen size that have splattered around the connection during there flow process.
Target-Class 1,2, 3 .No evidence of solder balls on the printed wiring assembly.
Acceptable-Class 1,2,3 .Solder balls are entrapped/encapsulated and do not violate minimum electrical clearance. Note:Entrapped/encapsulated/attached is intended to mean that normal service environment of the product will not cause a solder ball to become dislodged.
Defect- Class 1,2,3 .Solder balls violate minimum electrical clearance. .Solder balls are not entrapped in no-clean residue or encapsulated with conformal coating,
or not attached(soldered)to a metal surface.
Soldering Anomalies-Excess Solder-Bridging
Defect-Class 1,2,3 .A solder connection across conductors that should not be joined. .Solder has bridged to adjacent noncommon conductoror component.
Surface appearance with cooling lines as shown in Acceptable pic is more likely to occur in lead free alloys and is not a disturbed solder condition.
Defect-Class 1,2,3 Characterized by stress lines from movement in the connection (SnPb alloy).
Soldering Anomalies-Fractured Solder
Defect-Class 1,2,3 Fractured or cracked solder.
Soldering Anomalies-Solder Projections
Defect-Class 1,2,3
.Solder projection,figure 1,violates assembly maximum
height requirements or lead protrusion requirements.
.Projection,figure 2,violates minimum electrical clearance(1).
1 2
Soldering Anomalies-Lead Free Fillet Lift
Acceptable-Class 1,2.3 .Fillet lifting-separation of the bottom of the solder and the top of the land(primary side of plated-through hold connection).
Process Indicator-Class 2 Defect-Class3
.Fillet lifting-separation of the bottom of the solder and the top of the land(secondary side of plated-through hold connection)(not shown). Defect-Class 1,2,3 .Fillet lifting damages the land attachment.
Soldering Anomalies-Hot Tear/Shrink Hole
Acceptable-Class1,2,3 .For connections made with lead free alloys: .The bottom of the tear is visible. .The tear or shrink hole does not contact the lead,land or barrel wall.
Defect-Class 1,2,3 .Shrink holes or hot tear in connections made with SnPb solder alloys:
.For connections made with lead free alloys: .The bottom of the shrink hole or hot tear is not visible. .The tear or shrink hole contacts the lead or land.
Acceptability for Electronic Assemblies : connector pins
Target-Class1,2,
.Pins are straight,not twisted and properly seated.
.No discernible damage
1.No discernible damage
2.Land
3.No discernible twist
Acceptable-Class1,2,3
.Pins are slightly bent off center by 50% pin thickness or less. .Pin height varies within tolerance.
Note:
Nominal height tolerance is per pin connector or master drawing specification.The connector pins and mating connector must havea good electrical contact.
1.Pin height tolerance
2.Less than 50% pin thickness
Acceptable-Class1,2 .Less than or equal to 75% of the width(W) of the annular ring is lifted. .Damaged nonfunctional lands for single and double-sided boards are acceptable if firmly attached to board in unlifted areas.
1.Land lifted 75% of annular ring or less
2.Land with conductor
3.Land not fractured
4.Land lifted,fractured but firmly attached land with out conductor (nonfunctional)
Defect-Class1,2 Any functional annular ring which is lifted more than 75% of the width(W).
Defect-Class3 Any lifted or fractured annular rings with press fit pins.
1.Land fractured
2.Functional land lifted greater than 75% of annular ring
3.Landlifted
Defect-Class1,2,3 Pin is bent out of alignment.(Pin is bent off center greater than 50% pin thickness.
Defect-Class1,2,3 Pin visibly twisted.
Defect-Class1,2,3 Pin height is out of tolerance as to specification.
Defect-Class1,2,3 Damaged pin as a result of handling or insertion. Mushroomed Bent
The term “press fit pins” is generic in nature and many types of pressure inserted pins,e.g. connector,staked,etc.,are not intended to be soldered,if soldering is required the following criteria is applicable
Target-Class1,2,3 .A 360 solder fillet is evident on the secondary side of the assembly. .Note:Solder fillet or fill on primary side is not required.
1.Bottom view
2.Side view
3.Land
4.Top view
5.PCB
Acceptable-Class1,2 Solder fillet or cover age (secondaryside) is present on two adjacent sides of the pin.
1.Bottom view
2.Side view
3.Land
4.Top view
5.PCB
Acceptable-Class1 Solder wicking is permitted above 2.5mm\[0.0984in] on sides of pins provided there is no solder build up which interferes with subsequent attachments to the pin.
Acceptable-Class2,3 Solder wicking on sides of pins is less than 2.5mm\[0.0984in], provided the solder does not interfere with subsequent attachments to the pin.
Defect-Class1,2 Solder fillet or coverage is evident on less than two adjacent sides of the pin on the secondary side.
Defect-Class3 Solder fillet is evident on less than four sides of the pin on the secondary side.
Defect-Class1,2,3 Solder build up interferes with subsequent attachments to the pin.
Acceptable-Class1,2,3 .Chip on nonmating surface of separable connector pin .Burnish on mating surface of separable connector pin,providing that plating has not been removed. .Chip that encroaches the mating surface of separable connector pin which will not be in the mating connector contact wear path.
A.Sheared/nonmating surface of connector pin
B.Coined/mating surface of connector pin
Defect-Class1,2,3 Chipped pin on mating surface of separable connector Scratched pin that exposes nonprecious plating or base metal. Missing plated on required areas. Burr on pin Cracked PCB substrate. Pushed out barrel as indicated by copper protruding from bottom side of PCB.
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