Category Archives: PCB

UIC spare parts 25584001 Electronic manufacturing.PCB.PCB Assembly THT-Through Hole Technology:AI, Auto Insertion : Axial Inserter; Radial Inserter; JW (Jumper Wire) Inserter; Odd form Inserter; PIN inserter; Eyelet Inserter; Terminal Inserter IM, Insertion Mount,MI,Manual Insertion, DIP, Wave soldering . SMT - Souface Mount Technology:BHS: PCB board handling system, Loader, Unloader, Conveyor,Shuttle.Printer: Solder paste screen printerSPI: Solder Paste Inspection.Mounter: Chip Mounter, Pick and Place, IC Mounter, High Speed Mounter.AOI.Reflow Oven.LED:LED lighting, LED Lamp, LED Display, LED tube.Power Supply: UPS, Power Converter, Power Adepter, Mobile Charger,CAR Electronic: Car Audio, GPS.Home appliance: Induction Cooker, AC, Electric Cooker, Fan, TV, Settle Box, AI:Panasert, Panasonic, Universal, UIC, Dynapert, TDK, Sciencgo, Hanasert, Universal, UIC SMT:FUJI.Siemens,Panasonic,Universal,Assemblon,JUki, Yamaha,Samsung,

UIC 25584001 JW Feed Wheel

 

UIC spare parts 25584001 Electronic manufacturing.PCB.PCB Assembly THT-Through Hole Technology:AI, Auto Insertion : Axial Inserter; Radial Inserter; JW (Jumper Wire) Inserter; Odd form Inserter; PIN inserter; Eyelet Inserter; Terminal Inserter IM, Insertion Mount,MI,Manual Insertion, DIP, Wave soldering . SMT - Souface Mount Technology:BHS: PCB board handling system, Loader, Unloader, Conveyor,Shuttle.Printer: Solder paste screen printerSPI: Solder Paste Inspection.Mounter: Chip Mounter, Pick and Place, IC Mounter, High Speed Mounter.AOI.Reflow Oven.LED:LED lighting, LED Lamp, LED Display, LED tube.Power Supply: UPS, Power Converter, Power Adepter, Mobile Charger,CAR Electronic: Car Audio, GPS.Home appliance: Induction Cooker, AC, Electric Cooker, Fan, TV, Settle Box, AI:Panasert, Panasonic, Universal, UIC, Dynapert, TDK, Sciencgo, Hanasert, Universal, UIC SMT:FUJI.Siemens,Panasonic,Universal,Assemblon,JUki, Yamaha,Samsung,
UIC 25584001 JW Feed Wheel
40075420 O-RING
47104702 MOTOR:BRUSHLESS:DC:ENCDR
47405502 SWITCH BRACKET
47636701 COUPLING
49752203 LEAD SCREW, HEAD
47898701 FORMER, R INSIDE
47898801 FORMER,L INSIDE
80031922 MSDP 1.5MM X 8MM
52924402 PUSHER, PRECISION
48241402 SPRING, COMPRESSION
53069001 MSHCS M2 X 10MM
52924701 BEARING, HOLDER SPRING
52946001 BEARING, SQUARE HOLDER
52924501 HOLDER,PRECISION INS PAD
 BLKM06303 RET RING 5100-12
 47631004 CAM,30/135 CENTERING
 46442715 BELT,TIMING
23502002 PAD
40075420 O-RING
40520201  GO-RINGS
47405502   SWITCH BRACKET
47307703 CONTINUITY CABLE ASSY
30953801   PIN
30997611   PUSHER
42502304   HOLDER #44Ñ PUSHER TIP
42502403    ACTUATOR ARM
48241402    SPRING COMPRESSION
41631401     SPRING COMPRESSION
52344901     GUIDE JAW
45729304     RED
47356403      BLACK
47356404      BLUE
47356405       BEIGE
40833022      FUSE
BLKE01244    FUSE
BLKE01241     FUSE
BLKE01251    FUSE
BLKE01234    FUSE

 

17459000
17459000
print soldering flux on the bottom pad of BGA

How to print soldering flux on the bottom pad of BGA

How to print soldering flux on the bottom pad of BGA

In general, Use flux soldering of high viscosity, to splice and process, should ensure that the printing pattern is clear, the overflow flux.

Sometimes,solder paste can be replaced by solder paste, and the metal component of solder paste should be matched with the metal component of solder ball.

When printing, BGA special small template is used. The thickness and opening size of the template should be determined according to the ball diameter and the ball distance.

After printing, the printing quality must be checked. If it is unqualified, it must be printed again after cleaning.

PCB Loader/Unloader The latest introduction to 2017

PCB  loader/unloader

The latest introduction of PCB loader/unloader 2017

Characteristics of the equipment.

PCB Automatic UNloader PCB conveyor

1.Special aluminum alloy mechanism to better understand the operation status of magazines.

  1. Stable casting platform structure design, improve the stability of equipment 0.3. Panasonic PLC control, multi-function circuit and program design, performance stability, ensure the smooth and smooth production line.
  2. Humanized programming, 4 kinds of PITCH selection, can set the step distance of receiving/transmitting PCB.

  3. Standard SMEMA communication interface, which can communicate with other automation equipment.

  4. The material box shall be transported by the engineering plate.

  5. Adjustable push plate speed control.

  6. Three-point positioning type upper and lower pneumatic clamping, ensure the location of the material box is accurate.

  7. Push plate protection system to ensure that PCB board is not crushed, reducing process loss. This equipment adopts SMT circuit board production line operation

PCB size: (mm):   50 x50~330 x445
Working height (mm): 900 + 20 (STD)
groove Change time:   bout 6 seconds
The machine size :1650(L)845(W)1250(H)
Step selection:  10.20.30.40 mm
Power supply:  AC 110/220v plus or minus 10V, 50/60hz knife bank
Dimensions (L * W * H, MM) : 355 (L) * 320 (W) * 565 (H)
Air pressure and gas flow : 4-6bar / 10 litres/min
Weight (KG):140 kg

自动装载机 PCB loader
loader

 

This equipment is used SMT circuit board production line operating upper and lower plates

PCB SIZE:(mm):50×50~330×250
Working height (mm):900±20(std)
Tank replacement time: about 6 seconds
Machine dimensions:1920(L)845(W)1250(H)

Step Select: 10.20.30.40 mm
Power Supply: AC 110/220V±10V, 50/60HZ
Magazine size (LWH,MM):355(L)320(W)565(H)
Barometric pressure and gas flow rate: 4-6bar/up to 10 l / min
Weight (KG):260KG

PCB Automatic UNloader
PCB Automatic UNloader

PCB

SMT loader

SMT loader
This equipment is used SMT circuit board production line operating upper and lower plates
AI smt线
AI smt line           

If you want to get more product introductions, please contact us:
www.smthelp.com
ming@smthelp.com
jasonwu@smthelp.com

 

Quantifying PCB Design Efforts with μPCBComplexity

μPCBComplexity

Quantifying PCB Design Efforts

The current design approach to PCBs does not fully account for quantifying efforts toward understanding the full scope of what a PCB design project can cost in its totality. It is valuable to consider the methods established to solve this problem proposed by Gollapudi Ramya and M.Anil Kumar in their study "μPCBComplexity" featured in the International Journal of Engineering Research and Applications. These methods are continually being evaluated, yet there is room for establishing an official algorithm for calculating the efforts (time & costs) for PCB design for your factory.

Factors that Contribute to the Complexity of Design Include:
Components:

# passive

# digital

# analog

# mixed signal

Total #

Total area (mm2)






Pins:

Passive


Digital


Analog


Mixed Signal

PCB Size (mm2)

# of sides with components


# of routing layers


# of layers

Additionally:

Component Density

(x1000)

Pin Density

μPCBComplexity (hours)

Productivity Factory (level of designer experience)








Equations to Measure μPCBComplexity:

info@smthelp.com pcb complexity

Whereby ρ is a constant measuring design team productivity, per company/team, inversely proportional to S, the aggregate set of statistics that are weighted by (w) a constant associated with it which assigns a weight to the importance of every statistics used in the model.

Sample Measuring μPCBComplexity:

PCB Complexity Measurements

Finally, the factors that contribute to time and costs loss by not pre-calculating PCB design efforts should be allocated and quantified for best practices of design model systems. Only when we can begin to quantify complexity and relate that to design efforts will we be able to mark a designated expected outcome for cost and time.

PCB AOI Testing

THT Dual Sided AOI

THT Dual Sided AOI

THT Dual Sided AOI (DIP AVI)  - Before or after wave soldering, use high speed in-line AOI solution – Applicable for • Before or after Wave solder THT/DIP component insertion check (DIP through hole component) • Optional: Press-fit inspection ability of pressing parts • Optional: SMD component placement test ability.