The latest introduction of PCB loader/unloader 2017
Characteristics of the equipment.
1.Special aluminum alloy mechanism to better understand the operation status of magazines.
Stable casting platform structure design, improve the stability of equipment 0.3. Panasonic PLC control, multi-function circuit and program design, performance stability, ensure the smooth and smooth production line.
Humanized programming, 4 kinds of PITCH selection, can set the step distance of receiving/transmitting PCB.
Standard SMEMA communication interface, which can communicate with other automation equipment.
The material box shall be transported by the engineering plate.
Adjustable push plate speed control.
Three-point positioning type upper and lower pneumatic clamping, ensure the location of the material box is accurate.
Push plate protection system to ensure that PCB board is not crushed, reducing process loss. This equipment adopts SMT circuit board production line operation
PCB size: (mm)： 50 x50~330 x445
Working height (mm)： 900 + 20 (STD)
groove Change time: bout 6 seconds
The machine size ：1650(L)845（W）1250（H）
Step selection: 10.20.30.40 mm
Power supply: AC 110/220v plus or minus 10V, 50/60hz knife bank
Dimensions (L * W * H, MM) : 355 (L) * 320 (W) * 565 (H)
Air pressure and gas flow : 4-6bar / 10 litres/min
Weight (KG)：140 kg
This equipment is used SMT circuit board production line operating upper and lower plates
Working height (mm):900±20(std)
Tank replacement time: about 6 seconds
Step Select: 10.20.30.40 mm
Power Supply: AC 110/220V±10V, 50/60HZ
Magazine size (LWH，MM):355（L)320(W)565(H)
Barometric pressure and gas flow rate: ４－６bar/up to 10 l / min
If you want to get more product introductions, please contact us: www.smthelp.com
The current design approach to PCBs does not fully account for quantifying efforts toward understanding the full scope of what a PCB design project can cost in its totality. It is valuable to consider the methods established to solve this problem proposed by Gollapudi Ramya and M.Anil Kumar in their study "μPCBComplexity" featured in the International Journal of Engineering Research and Applications. These methods are continually being evaluated, yet there is room for establishing an official algorithm for calculating the efforts (time & costs) for PCB design for your factory.
Factors that Contribute to the Complexity of Design Include:
# mixed signal
Total area (mm2)
PCB Size (mm2)
# of sides with components
# of routing layers
# of layers
Productivity Factory (level of designer experience)
Equations to Measure μPCBComplexity:
Whereby ρ is a constant measuring design team productivity, per company/team, inversely proportional to S, the aggregate set of statistics that are weighted by (w) a constant associated with it which assigns a weight to the importance of every statistics used in the model.
Sample Measuring μPCBComplexity:
Finally, the factors that contribute to time and costs loss by not pre-calculating PCB design efforts should be allocated and quantified for best practices of design model systems. Only when we can begin to quantify complexity and relate that to design efforts will we be able to mark a designated expected outcome for cost and time.
THT Dual Sided AOI (DIP AVI) - Before or after wave soldering, use high speed in-line AOI solution – Applicable for • Before or after Wave solder THT/DIP component insertion check (DIP through hole component) • Optional: Press-fit inspection ability of pressing parts • Optional: SMD component placement test ability.