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What is NEXT Reflow Oven Soldering : IPC APEX 2016 booth No. :#2930.

Introduction – Reflow Oven Soldering

Process where solder paste is heated to above its melting point to form a solder joint between component and pcb pad.
Pcb is transferred on a conveyor belt through an oven to over 183 degrees Centigrade
The joints that are formed should be electrically and mechanically sound

Reflow Profile

Profile considerations

Each solder paste has a recommended temperature range that suits its characteristics and will produce the best joints.

Components and the pcb can only withstand certain maximum temperatures ( eg. FR4 at 250º C for 60-75 sec )

Customers specify profiles for the products