The reflow oven process principle and introduction
As we know,reflow oven is the most important welding technology in surface mount technology. It has been widely used in many industries including mobile phones, computers, automotive electronics, control circuits, communications, LED lighting and many other industries. More and more electronic devices are converted from through hole to surface mount, and reflow oven replaces wave soldering is a obvious trend in welding industry.
So what is the role of reflow oven equipment in the increasingly mature lead-free SMT process? Let’s take a look at the whole SMT surface mount line:
The whole SMT surface mounting line consists of three parts, such as steel mesh solder paste printing machine, SMT machine and reflow oven furnace. For the machine, and compared with lead free, and no new demands on the equipment itself; for screen printing machine, and a lead-free solder paste in the physical properties there are some differences, so put forward some improvement on the device itself, but there is no qualitative change. the key of lead-free is in the reflow oven.
The lead paste (Sn63Pb37) melting point of 183 degrees, if you want to form a good weld must have the thickness of 0.5-3.5um intermetallic compounds in welding, intermetallic compound formation temperature is above the melting point of 10-15, the lead welding is 195-200. The maximum withstand temperature of the electronic device on the circuit board is generally 240 degrees. Therefore, for lead welding, the ideal welding process window is 195-240 degrees.
Because of the change of melting point of lead-free solder paste, lead-free welding has brought great changes for welding process. At present, the lead-free solder paste is Sn96Ag0.5Cu3.5 and the melting point is 217-221 degrees. Good lead-free solder must also be formed 0.5-3.5um thickness intermetallic compounds, intermetallic compound formation temperature is also above the melting point of 10-15 degrees, for lead-free welding, that is, 230-235 degrees. Since the highest temperature of lead-free solder electronic device will not change, therefore, for lead-free soldering, ideal welding process window is 230-245 degrees.
The substantial reduction of process window brings great challenge to ensure welding quality, and also brings higher requirements to stability and reliability of lead-free wave soldering equipment. Because the equipment itself is coupled with the electronic device transverse temperature difference, due to differences in size of heat capacity will produce temperature difference in the heating process, so in the process control of lead-free reflow oven can be adjusted in the process of welding temperature window becomes very small, this is the real lead-free reflow to the difficulty.
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How to print soldering flux on the bottom pad of BGA
In general, Use flux soldering of high viscosity, to splice and process, should ensure that the printing pattern is clear, the overflow flux.
Sometimes,solder paste can be replaced by solder paste, and the metal component of solder paste should be matched with the metal component of solder ball.
When printing, BGA special small template is used. The thickness and opening size of the template should be determined according to the ball diameter and the ball distance.
After printing, the printing quality must be checked. If it is unqualified, it must be printed again after cleaning.
PCB loader/unloader
The latest introduction of PCB loader/unloader 2017
Characteristics of the equipment.
1.Special aluminum alloy mechanism to better understand the operation status of magazines.
Humanized programming, 4 kinds of PITCH selection, can set the step distance of receiving/transmitting PCB.
Standard SMEMA communication interface, which can communicate with other automation equipment.
The material box shall be transported by the engineering plate.
Adjustable push plate speed control.
Three-point positioning type upper and lower pneumatic clamping, ensure the location of the material box is accurate.
Push plate protection system to ensure that PCB board is not crushed, reducing process loss. This equipment adopts SMT circuit board production line operation
PCB size: (mm)： 50 x50~330 x445
Working height (mm)： 900 + 20 (STD)
groove Change time: bout 6 seconds
The machine size ：1650(L)845（W）1250（H）
Step selection: 10.20.30.40 mm
Power supply: AC 110/220v plus or minus 10V, 50/60hz knife bank
Dimensions (L * W * H, MM) : 355 (L) * 320 (W) * 565 (H)
Air pressure and gas flow : 4-6bar / 10 litres/min
Weight (KG)：140 kg
This equipment is used SMT circuit board production line operating upper and lower plates
PCB SIZE:（mm）:50×50~330×250
Working height (mm):900±20(std)
Tank replacement time: about 6 seconds
Machine dimensions:1920(L)845（W）1250（H）
Step Select: 10.20.30.40 mm
Power Supply: AC 110/220V±10V, 50/60HZ
Magazine size (LWH，MM):355（L)320(W)565(H)
Barometric pressure and gas flow rate: ４－６bar/up to 10 l / min
Weight (KG):260KG
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India's LED and Surface Mount Technology market is poised for extensive growth. There is much development, strategic planning, and intelligent decisions to make along the way. But the direction and decisions that key electronics manufacturing players make in India today will speak to a future of leadership in LED Manufacturing as a whole, not just for India but worldwide. The LED market is expected to grow 20% per year and the Surface Mount Industry expected to reach a turnover of $5.42 billion by 2022, that is a CAGR of 8.9% 2017-2022.
Between SLNP (Street Lighting National Project), UJALA (Unnat Jeevan by Affordable LEDs and Appliances for All) which aims to supply domestic LEDs to constituents, and (DDUGJY) Deen Dayal Upadhyaya Gram Jyoti Yojana which is a government plan designed to provide continuous power supply to rural India as well as distribute 27.3 million LED bulbs, there is a green surge of job and business creation that has so far saved 34,239 mn kWh/year and INR13,696 Cr/ year. In addition to relieving the planet of 2,77,33,505 tons CO2/year these measures are creating an urgent demand for EMS and ODM to become extremely serious about urgent planning and implementation. But this implementation doesn't come without careful analysis of suppliers. Reliable suppliers will be poised for optimal supply chains that build smart factories for the future with traceability, full automation, minimization of costs, top quality and reliability with 24 hour technical and automated support.
Key players in the India LED market are ramping up their automation and bringing full factory assembly, including SMT circuit board manufacturing, in house. This model will be ideal moving forward into a globalized, longevity-based model. Self-sufficiency in LED and electronic manufacturing will be a driving force toward complete automation process. Key players are aiming, not for just name brand but for high quality, full support systems in this burgeoning market. Key players include:
Key LED Categories
Key LED Types
Key LED Categories
Urgency to ramp up EMS production facilities are in full swing. Even companies like Everready, known for their battery production are ramping up their LED manufacturing segment. Now is the essential time for factories to move forward with plans based on current and future forecasting.
Full line manufacturers in India are poised for great advantages as the world not only moves toward solid state lighting and increased EMS demands. Sample Line up:
In the next revolution of manufacturing IoT, or Internet of Manufacturing, many adaptions will need to be made in order to reap the benefits of a truly smart factory that optimizes time, work force, efficiency, materials, supplier and full chain data analytics monitoring. But the key benefits that stand to be achieved are a great boost for the electronics manufacturing floor and business model. What do Electronics Manufacturing factories stand to gain from Industry 4.0? Here are some major improvements that can be expected:
Suppliers in IoT Manufacturing
Some vendors will be more interested in investing in your efforts to elevate to a 4.0 Industry factory by improving systems, using AR/VR/MR technologies to connect you to your machines, providing solutions and plans for upgrading to full automation. But the bottom line is that the trajectory to Industry 4.0 will require automation on every level that can possibly connect to a smart grid system of machine analytics, communications, control, and decision-making.
Solutions like real-time solder monitoring, data exchange formats like XML, and new standards of machine communication, like transitioning from SMEMA to more interconnected methods of SMT communication are on their way. Be prepared to work more closely with vendors based on their preparedness to serve this new model. Many major EMS factories are beginning to test the waters of integration in Industry 4.0. But the one thing that will be required of all future models of Electronics Manufacturing is automation of machine monitoring, engineering, communicating, delivering, and more. Automation is the key component moving us from sluggish manual system of unpredictable output to measurable systems with multiple streams of highly integrative data aimed at top performance decision-making.
The symbiotic relationship of the Solid State Lighting Industry with Electronics Manufacturing is an ever-evolving one that requires a needs analysis where Electronics Solutions providers are able to deliver on the promise of full service and complete solutions. LED chips are the integral bond in the relationship of LEDs and electronics manufacturing along with full service provisions for LED Drivers and Power Supplies.
LED companies that struggle with PCB Design, especially in the age of IoT, require a complete source to assist with full scale projects from design to execution. An Electronics Manufacturing Expert who deeply understands PCB design longevity, lumen/watts issues, and the great many challenges that will rear their head in the near future, is key to a solid LED production line platform.
There are few go-to electronics industry brands that can truly offer one full scale solution from concept to solution to execution and profit. When considering your options, choose a company that guarentees full scale solutions and 24/7 support for your LED production line.
Is your SMT factory ready for the increasing electronic automotive demands? As consumer interest shifts from engine performance to interior infotainment, the automotove microelectronics manufacuturing demands will continue to rise. The latest and upcoming electronic technologies in vehicles, i.e. navigation technologies, sensor controls, smart technologies in vehicle and cellular communication is creating urgency now more than ever to evaluate your manufacturing process.
Considering the rising demands for the latest electronic gadgets and the predicted growth in Electronic Vehicles (EV) and autonomous cars makes you question how much production you should be doing in-house for the most growth, higher profits and most efficient productivity. Automotive Electronics and IoT are in the midst of growth, and there are many expected changes in the very near future fueling this growth. Design activity will remain strong and that this will ensure new products enter now and in the coming years. Miniaturization of device footprint fuels innovation in printed-circuit board (PCB) designs.
Outsourcing manufacturing is no longer as cost effective as it once was, as labor costs are continuing to rise, as well as importing and exporting costs. Companies are finally realizing in order for the highest productivity, quality, and monetary gains, considering domestic manufacturing is the solution.
The electronics industry is an ever fast-changing world, and we are here to help you keep up with your business advancements and needs. What trends are you noticing? Have questions on how you can keep up in your industry? Let us know.
