Category Archives: Auto insertion

45798402

45798401 Tube Continuity to save Auto Insertion machine running cost

 

 

45798407 Tube Continuity

45798406 Tube Continuity

45798405 Tube Continuity

45798404 Tube Continuity

45798403 Tube Continuity

45798402 Tube Continuity

45798401 Tube Continuity

 

 

Preventive Maintenance Schedule

 

WARNING Do not perform any preventive maintenance with power on unless specifically instructed otherwise. Failure to observe this warning may result in personal injury.

 

CAUTION When performing machine maintenance, wear a wrist strap connected to ground to prevent electrostatic discharge damage to printed circuit boards.

 

500,000 Cycles Check: Perform Maintenance:

  1. Clean the clinch scrap tube with the pipe cleaner (40940101) twice daily (every 250,000 cycles).

 

3,000,000 Cycles Check: Perform Maintenance:

  1. Check for excessive wear on the pins 1. Lubricate the cutter linkage pins with Magnalube and linkage. Replace if necessary. (40833809).

 

12,000,000 Cycles Check: Perform Maintenance:

Check for worn cutters and bushings on 1. Replace if necessary. the cut and clinch by observing the quality of the production board component leads. 2. Lubricate the clinch lead screw with Super Blue (BLKM07680). 3. Replace the O-rings and bumpers in the cutter cylinders on the cut and clinch assembly. 4. Lubricate the three surfaces of the notch in the rocker guide Kendall Super Blue (BLKM07680).

48,000,000 Cycles Check: Perform Maintenance: 1. Lubricate the anvil slides with Kendall Super Blue (40833838) and grease gun (47408201).

 

 

 

DIP, PCB Assembly,Chip Mounter, Pick and Place, IC Mounter, High Speed Mounter, Wave soldering,LED lighting, LED Lamp, LED Display, LED tube,UPS, Power Converter, Power Adepter, Mobile Charger, PCB board handling system, Loader, Unloader, Conveyor,Shuttle, Chip Mounter, Pick and Place, IC Mounter, High Speed Mounter Induction Cooker, AC, Electric Cooker, Fan, TV, Settle Box

Reflow oven technology and precautions

Reflow oven technology and precautions

Far infrared reflow again

In 80s the use of far infrared reflow has the characteristics of fast heating, energy saving, stable operation, but because the printed circuit board and various components for different material, color and thermal radiation absorption rate to have very big difference, caused by a variety of different components and different parts of the circuit temperature is not uniform, the local temperature difference. For example, the black plastic package of integrated circuit will be overheated due to the high radiant absorption rate, and the welding part of it will lead to false welding on the silver lead instead of low temperature. In addition, the heat radiation blocked on printed boards, such as welding pins or small components in the shadow parts of big (high) components, will cause poor welding due to insufficient heating.

1.2 full hot air reflow again

Full hot air reflow oven  is a welding method by which the flow of airflow is forced through a convective nozzle or a heat-resistant fan, so that the welded parts are heated. This kind of equipment began to rise in 90s. Due to the adoption of this heating mode, the temperature of PCB and components is close to the temperature of the given heating area, which completely overcomes the temperature difference and shadowing effect of infrared reflow soldering, so it is widely applied now. In all hot air reflow oven  equipment, the convection velocity of the circulating gas is very important. In order to ensure that the circulating gas acts on any area of the printed board, the air flow must have a fast enough speed. To a certain extent, it is easy to cause the jitter of the printed board and the displacement of the components. In addition, in terms of heat exchange, the efficiency is poor and the power consumption is more.

1.3 infrared hot air reflow again

This kind of reflow oven is a more ideal heating method, which is based on the IR oven with hot air to make the temperature even more uniform insaide the oven. The characteristics of this kind of equipment to make full use of the infrared penetration, high thermal efficiency, energy saving, and effectively overcome the temperature difference of infrared reflow soldering and shadowing effect, and make up the influence of hot air reflow on gas flow caused by excessive demand, therefore  at international this kind of IR+Hot reflow is used most commonly  at present .

With the increase of assembly density and the appearance of fine spacing assembly technology, a reflow oven  furnace with nitrogen protection has appeared. Welding under nitrogen protection conditions can prevent oxidation, improve welding wetting power and speed up wetting speed. It is more suitable for uncleaning process to reduce the welding force and reduce welding beads.

2  The establishment of  temperature curve

The temperature curve is the curve of the temperature of a point on the SMA will change over time when SMA through the reflow oven. The temperature curve provides an intuitive method to analyze the temperature change of a component during the whole reflow process. This is very useful for obtaining the best weldability, avoiding damage to the components due to overheating, and ensuring the quality of the welding.

The following is a brief analysis of the preheating section.

2.1 preheating section

The purpose of this section is to put PCB at room temperature as soon as possible heating, to achieve second specific targets, but the heating rate should be controlled in the appropriate range, if excessive, will produce thermal shock, circuit boards and components may be damaged; if too slow, will not fully solvent, affecting the welding quality. Due to the rapid heating rate, the temperature difference in the rear section of the temperature zone is larger than that in the SMA. In order to prevent the damage of thermal shock to the component, the maximum speed is 4℃/s. However, the normal rise rate is set to 1-3℃/s. The typical heating rate is 2℃/s.

2.2 heat preservation section

The heat preservation section is the area where the temperature rises from 120℃-150℃ to the melting point of the solder paste. Its main purpose is to make the temperature of each element in the SMA stable and minimize the temperature difference.In this area, the temperature of the larger components can have enough time to catch up with the smaller components and ensure that the flux in the solder paste is fully volatile. The oxide of the soldering plate, the solder ball and the pin of the element is removed, and the temperature of the entire circuit board is balanced until the end of heat preservation section. It should be noted that all elements on the SMA should have the same temperature at the end of heat preservation section, otherwise, entering the reflux section will cause various bad welding phenomena due to the uneven temperature of each part.

2.3 reflow  section

In this area, the temperature of the heater is set to the highest, which makes the temperature of the component up to the peak temperature. In reflow sectionthe,the different of peak temperature is according to the solder paste to change, the general recommendation for solder melting point temperature plus 20-40℃. For 63Sn/37Pb solder paste with melting point of 183℃ and Sn62/Pb36/Ag2 solder paste with melting point of 179℃, the peak temperature is generally 210-230℃. Reflow time should not be too long to prevent adverse effects on SMA. The ideal temperature curve is the smallest area covered by the “tip zone” of the solder melting point.

UIC spare parts 25584001 Electronic manufacturing.PCB.PCB Assembly THT-Through Hole Technology:AI, Auto Insertion : Axial Inserter; Radial Inserter; JW (Jumper Wire) Inserter; Odd form Inserter; PIN inserter; Eyelet Inserter; Terminal Inserter IM, Insertion Mount,MI,Manual Insertion, DIP, Wave soldering . SMT - Souface Mount Technology:BHS: PCB board handling system, Loader, Unloader, Conveyor,Shuttle.Printer: Solder paste screen printerSPI: Solder Paste Inspection.Mounter: Chip Mounter, Pick and Place, IC Mounter, High Speed Mounter.AOI.Reflow Oven.LED:LED lighting, LED Lamp, LED Display, LED tube.Power Supply: UPS, Power Converter, Power Adepter, Mobile Charger,CAR Electronic: Car Audio, GPS.Home appliance: Induction Cooker, AC, Electric Cooker, Fan, TV, Settle Box, AI:Panasert, Panasonic, Universal, UIC, Dynapert, TDK, Sciencgo, Hanasert, Universal, UIC SMT:FUJI.Siemens,Panasonic,Universal,Assemblon,JUki, Yamaha,Samsung,

UIC 25584001 JW Feed Wheel

 

UIC spare parts 25584001 Electronic manufacturing.PCB.PCB Assembly THT-Through Hole Technology:AI, Auto Insertion : Axial Inserter; Radial Inserter; JW (Jumper Wire) Inserter; Odd form Inserter; PIN inserter; Eyelet Inserter; Terminal Inserter IM, Insertion Mount,MI,Manual Insertion, DIP, Wave soldering . SMT - Souface Mount Technology:BHS: PCB board handling system, Loader, Unloader, Conveyor,Shuttle.Printer: Solder paste screen printerSPI: Solder Paste Inspection.Mounter: Chip Mounter, Pick and Place, IC Mounter, High Speed Mounter.AOI.Reflow Oven.LED:LED lighting, LED Lamp, LED Display, LED tube.Power Supply: UPS, Power Converter, Power Adepter, Mobile Charger,CAR Electronic: Car Audio, GPS.Home appliance: Induction Cooker, AC, Electric Cooker, Fan, TV, Settle Box, AI:Panasert, Panasonic, Universal, UIC, Dynapert, TDK, Sciencgo, Hanasert, Universal, UIC SMT:FUJI.Siemens,Panasonic,Universal,Assemblon,JUki, Yamaha,Samsung,
UIC 25584001 JW Feed Wheel
40075420 O-RING
47104702 MOTOR:BRUSHLESS:DC:ENCDR
47405502 SWITCH BRACKET
47636701 COUPLING
49752203 LEAD SCREW, HEAD
47898701 FORMER, R INSIDE
47898801 FORMER,L INSIDE
80031922 MSDP 1.5MM X 8MM
52924402 PUSHER, PRECISION
48241402 SPRING, COMPRESSION
53069001 MSHCS M2 X 10MM
52924701 BEARING, HOLDER SPRING
52946001 BEARING, SQUARE HOLDER
52924501 HOLDER,PRECISION INS PAD
 BLKM06303 RET RING 5100-12
 47631004 CAM,30/135 CENTERING
 46442715 BELT,TIMING
23502002 PAD
40075420 O-RING
40520201  GO-RINGS
47405502   SWITCH BRACKET
47307703 CONTINUITY CABLE ASSY
30953801   PIN
30997611   PUSHER
42502304   HOLDER #44Ñ PUSHER TIP
42502403    ACTUATOR ARM
48241402    SPRING COMPRESSION
41631401     SPRING COMPRESSION
52344901     GUIDE JAW
45729304     RED
47356403      BLACK
47356404      BLUE
47356405       BEIGE
40833022      FUSE
BLKE01244    FUSE
BLKE01241     FUSE
BLKE01251    FUSE
BLKE01234    FUSE

 

17459000
17459000
DIP, PCB Assembly,Chip Mounter, Pick and Place, IC Mounter, High Speed Mounter, Wave soldering,LED lighting, LED Lamp, LED Display, LED tube,UPS, Power Converter, Power Adepter, Mobile Charger, PCB board handling system, Loader, Unloader, Conveyor,Shuttle, Chip Mounter, Pick and Place, IC Mounter, High Speed Mounter Induction Cooker, AC, Electric Cooker, Fan, TV, Settle Box

Reflow oven process principle and introduction

The reflow oven process principle and introduction

As we know,reflow oven is the most important welding technology in surface mount technology. It has been widely used in many industries including mobile phones, computers, automotive electronics, control circuits, communications, LED lighting and many other industries. More and more electronic devices are converted from through hole to surface mount, and reflow oven  replaces wave  soldering is a obvious  trend in welding industry.

So what is the role of reflow oven equipment in the increasingly mature lead-free SMT process? Let’s take a look at the whole SMT surface mount line:

The whole SMT surface mounting line consists of three parts, such as steel mesh solder paste printing machine, SMT machine and reflow oven furnace. For the machine, and compared with lead free, and no new demands on the equipment itself; for screen printing machine, and a lead-free solder paste in the physical properties there are some differences, so put forward some improvement on the device itself, but there is no qualitative change. the key of lead-free  is  in the reflow oven.

The lead paste (Sn63Pb37) melting point of 183 degrees, if you want to form a good weld must have the thickness of 0.5-3.5um intermetallic compounds in welding, intermetallic compound formation temperature is above the melting point of 10-15, the lead welding is 195-200. The maximum withstand temperature of the electronic device on the circuit board is generally 240 degrees. Therefore, for lead welding, the ideal welding process window is 195-240 degrees.

Because of the change of melting point of lead-free solder paste, lead-free welding has brought great changes for welding process. At present, the lead-free solder paste is Sn96Ag0.5Cu3.5 and the melting point is 217-221 degrees. Good lead-free solder must also be formed 0.5-3.5um thickness intermetallic compounds, intermetallic compound formation temperature is also above the melting point of 10-15 degrees, for lead-free welding, that is, 230-235 degrees. Since the highest temperature of lead-free solder electronic device will not change, therefore, for lead-free soldering, ideal welding process window is 230-245 degrees.
The substantial reduction of process window brings great challenge to ensure welding quality, and also brings higher requirements to stability and reliability of lead-free wave soldering equipment. Because the equipment itself is coupled with the electronic device transverse temperature difference, due to differences in size of heat capacity will produce temperature difference in the heating process, so in the process control of lead-free reflow oven can be adjusted in the process of welding temperature window becomes very small, this is the real lead-free reflow to the difficulty.

 

3D Viewing SMT spare parts in THT PCB Machine

       

      We  Provide different spare parts and wearing parts of different brands and models.(UIC,TDK,Panasonic,Samsung,Fuji,Juki,SIMMENS……) Only need to tell us your parts‘ machine model and P/N. Fuji TDK Juki Samsung YAMAHA  UIC Panasonic

      www.smthelp.com

      Why Choice Us?

      • We owning 10 years experience in providing SMT/EMS services.
      • Familiar design and engineering capability both on Hardware and software.
      • Successful design experience in SMT line.
      • Lean manufacturing.
      • High mixed, high value, low volume business expertise service.
      • Flexible operation, fast response and total satisfaction.
      • Good after-sales and extra value creation services including logistics support, valet procurement, supplier audit service and in factory office offering.
      The Future of Stencil Cleaning _ SMThelp.com

      Listen! Let Obama tell you how to SMT to make your Electronics product

       

      WHY SMT?  HOW TO EMS?

      Surface Mount Assembly Classifications

      HOW TO MAINTAIN AUTO INSERTION AND SMT MACHINE — ESD CLEANING AND TESTING PROCEDURES

      HOW TO IMPROVE AUTO INSERTION MACHINE SPARE PARTS LIFETIME 

       

      ODM, OEM, PCB Manufacturing and PCB Assembly Services ONE-STOP PCB Assembly Solutions for EMS

      PCB Loader/Unloader The latest introduction to 2017

      PCB  loader/unloader

      The latest introduction of PCB loader/unloader 2017

      Characteristics of the equipment.

      PCB Automatic UNloader PCB conveyor

      1.Special aluminum alloy mechanism to better understand the operation status of magazines.

      1. Stable casting platform structure design, improve the stability of equipment 0.3. Panasonic PLC control, multi-function circuit and program design, performance stability, ensure the smooth and smooth production line.
      2. Humanized programming, 4 kinds of PITCH selection, can set the step distance of receiving/transmitting PCB.

      3. Standard SMEMA communication interface, which can communicate with other automation equipment.

      4. The material box shall be transported by the engineering plate.

      5. Adjustable push plate speed control.

      6. Three-point positioning type upper and lower pneumatic clamping, ensure the location of the material box is accurate.

      7. Push plate protection system to ensure that PCB board is not crushed, reducing process loss. This equipment adopts SMT circuit board production line operation

      PCB size: (mm):   50 x50~330 x445
      Working height (mm): 900 + 20 (STD)
      groove Change time:   bout 6 seconds
      The machine size :1650(L)845(W)1250(H)
      Step selection:  10.20.30.40 mm
      Power supply:  AC 110/220v plus or minus 10V, 50/60hz knife bank
      Dimensions (L * W * H, MM) : 355 (L) * 320 (W) * 565 (H)
      Air pressure and gas flow : 4-6bar / 10 litres/min
      Weight (KG):140 kg

      自动装载机 PCB loader
      loader

       

      This equipment is used SMT circuit board production line operating upper and lower plates

      PCB SIZE:(mm):50×50~330×250
      Working height (mm):900±20(std)
      Tank replacement time: about 6 seconds
      Machine dimensions:1920(L)845(W)1250(H)

      Step Select: 10.20.30.40 mm
      Power Supply: AC 110/220V±10V, 50/60HZ
      Magazine size (LWH,MM):355(L)320(W)565(H)
      Barometric pressure and gas flow rate: 4-6bar/up to 10 l / min
      Weight (KG):260KG

      PCB Automatic UNloader
      PCB Automatic UNloader

      PCB

      SMT loader

      SMT loader
      This equipment is used SMT circuit board production line operating upper and lower plates
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      AI smt line           

      If you want to get more product introductions, please contact us:
      www.smthelp.com
      ming@smthelp.com
      jasonwu@smthelp.com

       

      IoT Integration Across Industry | Smthelp.com

      Industry 4.0 Requires… Automation

      The IoT Movement in Electronics Manufacturing

      Industry 4.0 Requires... Automation

      In the next revolution of manufacturing IoT, or Internet of Manufacturing, many adaptions will need to be made in order to reap the benefits of a truly smart factory that optimizes time, work force, efficiency, materials, supplier and full chain data analytics monitoring. But the key benefits that stand to be achieved are a great boost for the electronics manufacturing floor and business model. What do Electronics Manufacturing factories stand to gain from Industry 4.0? Here are some major improvements that can be expected:


      1. Smarter Supply Networks
      2. Intelligent Manufacturing Systems (remote visualization and engineer integration, remote monitoring, alerts, control, and remote production scheduling)
      3. Cloud Storage – secure processing, data storage and sharing on cloud network
      4. Advanced Decisions based on Data Analytics and real time monitoring
      5. Encrypted Technologies to protect against cyber threats
      6. Intelligent Sensors – integrated into machines that communicate on a wireless network that share data and analytics
      7. Smart Maintenance – predictive maintenance, remote monitoring and maintenance
      8. Mobile workforce - Augmented Reality devices for workers to process real-time alerts and information remotely
      9. Cyber physical system of interconnected social machines that work together to improve efficiency
      10. Robotics – use of flexible automated machines that can interact with humans and other machines
      11. Product intelligence – products that carry information for data analytics and decision making


      Suppliers in IoT Manufacturing

      Some vendors will be more interested in investing in your efforts to elevate to a 4.0 Industry factory by improving systems, using AR/VR/MR technologies to connect you to your machines, providing solutions and plans for upgrading to full automation. But the bottom line is that the trajectory to Industry 4.0 will require automation on every level that can possibly connect to a smart grid system of machine analytics, communications, control, and decision-making.

      Solutions like real-time solder monitoring, data exchange formats like XML, and new standards of machine communication, like transitioning from SMEMA to more interconnected methods of SMT communication are on their way. Be prepared to work more closely with vendors based on their preparedness to serve this new model. Many major EMS factories are beginning to test the waters of integration in Industry 4.0. But the one thing that will be required of all future models of Electronics Manufacturing is automation of machine monitoring, engineering, communicating, delivering, and more. Automation is the key component moving us from sluggish manual system of unpredictable output to measurable systems with multiple streams of highly integrative data aimed at top performance decision-making.


      IoT Integration Across Industry | Smthelp.com





      soldering robot | smthelp.com

      Soldering Excellence: Achieve Your Perfect Soldering Process

      Solving the Soldering Factor

      Soldering Excellence

      soldering robot | smthelp.com

      Within the mass production sector of electronic manufacturing industry, the soldering process continues to be one of the most precarious processes that can literally make or break your PCBs. Finding the perfect soldering variables that provide reliability to mechanical and electrical joints are essential to keeping your components in place once a circuit has been assembled.



      The size of electronics and their components are shrinking while the demand is growing at exponential rates, which forces manufacturers to find better and more efficient ways to create smaller parts, miniature circuit boards and components. Miniaturization of electronics creates a huge room for errors and failures, so every process especially the soldering process should be assessed for the best results for your final product. Having a healthy predictable standard of reproducability, ie. #good boards /oz.solder materials is a must for manufacturers running on slim margins, as one defect in the assembly process can lead to the entire process being discarded and large sums of money wasted on flaws not calculated ahead of time.

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      Is your Soldering up to par? Consider these factors for Soldering Excellence:

      • solve speed concerns
      • provides endless flexibility
      • allow quick program customization
      • provides flexible programming to meet needs of wide variety of soldering applications of the automatic soldering machine
      • smaller work area
      • customization for your factory needs
      • provides endless flexibility with automation
      • adjustable heating
      • high speed soldering
      • minimize cycle time
      • excellent temperature control and auto tuning

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      S-W450 wave soldering machine


      E-Series Lead Free Reflow Oven