Assembly inspection training

Inspection to IPC-610D With its comprehensive criteria for printed circuit board assemblies, IPC-A-610 is the most widely used inspection standard in the electronics industry and has earned an international reputation as
the source for end-product acceptance criteria for consumer and high reliability printed circuit
assemblies. Now updated to lead free, and available in many languages, IPC-A-610 has been
embraced by original equipment manufacturers and electronics manufacturing services companies worldwide.
  

IPC-610D Inspection Training This SMT/Through-Hole Inspection course will focus on IPC-610D and its use in inspection of tin-lead and lead-free assemblies and devices. These devices will include:
 
Through-Hole Axial-leaded devices (reisistors, transistors) Radial-leaded devices (capacitors, transistors) DIPs http://buysoma.net SMT
 
Chip devices (caps, resistors)
Gull wing devices (transistors, SOICs, QFPs) J-leaded devices (PLCCs) Area array devices (BGAs, CSPs) Inspection criteria for each family of components will be extracted from IPC-610D for detailed discussion of Target, Acceptable, and Defect conditions for each device.  Common defects dicsussed will include excess/insufficient solder, cold solder, disturbed solder, and non-wetting/dewetting.  Root cause for each defect will be identified for each, as well as correction action for each. Upon completion of the class, each student will be fully grounded in application of IPC-610D for tin-lead and lead-free assemblies.. The class will provide familiarization with and training on IPC-610D for through hole, SMT and repair operations.  The training will be conducted by a certified IPC instructor in the Binghamton AP Laboratory.
 
Hands-on training will be provided using the appropriate inspection tools for the range of components utilized

  1. Microscopes
  2. Low angle inspection tools
  3. X-ray inspection

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