How to remove the misprinted solder paste on the PCB surface?

How to remove the misprinted solder paste on the PCB surface?

Prepared by Ming

ming@smthelp.com
This article describes that paying attention to some details can often prevent common problems in assembly processes and equipment selection.

Question: Can I use a small spatula to remove misprinted solder paste from the board? Will this get the solder paste and small tin beads into the holes and small gaps?

Answer: Using a small spatula to remove the solder paste from the misprinted board may cause some problems. It is generally practicable to immerse the misprinted board in a compatible solvent, such as water with an additive, and then remove the small tin beads from the board with a soft brush. I prefer to soak and wash repeatedly instead of violent dry brush or shovel. After the solder paste is printed, the longer the operator waits to clean the misprint, the harder it is to remove the solder paste. Misprinted boards should be placed in the soaking solvent immediately after the problem is discovered, as the solder paste is easily removed before it is dried.

Avoid wiping with a strip of cloth to prevent solder paste and other contaminants from smearing on the surface of the board. After soaking, brushing with a gentle spray can often help remove unwanted tins. It is also recommended to dry with hot air. If a horizontal stencil cleaner is used, the side to be cleaned should face down to allow the solder paste to fall off the board.

As usual, note that some details can eliminate undesirable conditions, such as misprinting of the solder paste and removal of the solder paste from the board. It is our goal to deposit the right amount of solder paste at the desired location. Stained tools, dry solder paste, and misalignment of the stencils and plates can cause undesirable solder paste on the underside of the stencil or even the assembly. During the printing process, the template is wiped with a certain pattern between printing cycles. Ensure that the template is seated on the pad, not on the solder mask, to ensure a clean solder paste printing process. On-line, real-time solder paste inspection and inspection prior to reflow after component placement are process steps that reduce process defects prior to soldering.

For fine-pitch stencils, if damage is caused between pins due to thin stencil cross-section bending, it can cause solder paste to deposit between the pins, causing printing defects and/or short circuits. Low viscosity solder paste can also cause printing defects. For example, high operating temperatures or high blade speeds can reduce the stickiness of the solder paste during use, resulting in printing defects and bridging due to excessive solder paste deposition.

In general, the lack of adequate control of materials, solder paste deposition methods and equipment are the main causes of defects in the reflow soldering process.

Question: What type of assembly board depaneling equipment provides the best results?

Answer: There are several sub-board systems that offer a variety of techniques for slab assembly boards. As a rule, there are many factors that should be considered when selecting such a device. Regardless of whether there is routing, sawing or blanking to separate individual panels from the composite panel, stable support during the splitting process is the most important factor. Without support, the resulting stress can damage the substrate and solder joints. Distorting the plate, or stressing the assembly during the splitting, can result in hidden or significant defects. While sawing often provides minimal clearance, shearing or die cutting with tools can provide cleaner, more controlled results.

In order to avoid component damage, many assemblers attempt to maintain component solder joints at least 5.08 mm from the edge of the board when the splitter is required. Sensitive ceramic capacitors or diodes may require extra care and consideration.

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Related connections:

1. 3 minutes to complete a SMT stencil cleaning, improving the quality of your electronic products:S-1688 stencil-cleaning-machine

https://www.smthelp.com/product/pneumatic-stencil-cleaner-machine-s-1688

2.How to produce SMT high quality products? (for aviation, aerospace, medical products)pcba-cleaning-machine:

https://www.smthelp.com/product/pcba-cleaning-machine

PCBA CLEANING MACHINE SCM5600D

 

ESD SMT Magazine

A PCB Magazine or PCB Rack is made of volume conductive polypropylene and metal, which is used to
transport the PCB boards for automated assembly lines. The anti-static PCB magazines racks are an ideal
aid in the production, storage and transportation of PCBs. The strong and robust polypropylene sidewall and
metal frame guarantee that these PCB magazines racks are durable, which last very long time.

Adjustment Method:Handle Adjustable
Side Plate:Five Pieces Assembled
Base Materialt:Metal
Slot of side plate
Depth:3.5mm
Width:5mm
Pitch:10mm
PCB board use standard
Adustable Width:(50-250)mm
PCB Stored:50
Surface Resistance
Conductive Type <1E6Ω/□
Dissipative Type 1E6Ω~1E11Ω/

ESD CIRCULATION RACK

Model:L1024
Contour Size(L×W×H)mm:475×175×50
Width:2mm Depth:2.5mm Pitch:15mm Slot:24
Width:3mm Depth:7mm Pitch:15mm Slot:25
Surface Resistance
Conductive Type <1E6Ω/
Dissipative Type 1E6Ω~1E11Ω/
Above trays can be made to stand for 100~160℃.C based on customer’s request.

Model:L1025
Contour Size(L×W×H)mm:26520595
Width:2mm
Depth:4.5mm
Pitch:7mm
Slot:25
Surface Resistance
Conductive Type <1E6Ω/□
Dissipative Type 1E6Ω~1E11Ω/□
Above trays can be made to stand for 100~160℃.C based on customer’s request.

Model:L1026
Contour Size(L×W×H)mm:340×130×22
Width:3mm
Depth:5mm
Pitch:9mm
Slot:34
Surface Resistance
Conductive Type <1E6Ω/□
Dissipative Type 1E6Ω~1E11Ω/□
Above trays can be made to stand for 100~160℃.C based on customer’s request.

ESD PCB Plates Trolley

Model:H5501
Material:Stainless steel & Antistatic Plastic/Carbon fiber PC
Size:11006001400mm or customised
Storage capability: 38 pcs per basket
Surface resistance:≤106Ω
Shock absorption system is opotio 

Model:H5502
Size (L×W×H)mm:900×550×1300
Size (L×W×H)mm:1200×550×1300
Slot of Side plate (W×H):100cm×46cm
Width:5mm
Depth:4mm
Pitch:10mm
Side Plate:Ten Pieces Assembled
Flapper Size:10cm×46cm

Note:

  1. Side Plate: Sideboard is formed by 10 pcs small panels.
  2. One standard trolley is with 2 pcs single-side flashabord, 2 pcs double-side
    flashboard. It can be added extra double-sideboard flashboard as per actual need .
  3. One standard trolley ‘s Each column insert 100 pcs PCB, Total store 300 pcs PCB.
  4. System Resistance: Dissipative Type 1E6Ω~1E9Ω

MInI Waver

The Mini Waver is a bench-top waves oldering system for leaded, SMD or mixed boards.It is ideally suited for pre-production up to medium range production.The 8-hour throughput is typically 500 Euroboards of the size 100 x 160 mm (4 x 6.3”).

Technology introductionSturdy design is based on steel frames and steel plates: stronger and more durableHeat shield and exhaust hood cover the whole process area: no smoke, little heat dissipation.

1.Exhaust fan and 3 meter long flexible hose                                              2.Foam type flux unit                                                                                          3.Built in compressor (no compressed air, can be used anywhere)           4.The preheating length depends on the process requirement and is not related to the welding speed                                                                          5.Solder pot capacity: 38 kg solder                                                                  6.Outside heating type, thermal insulation design: thermal start time is about 90 minutes                                                                                                    7.Tin furnace, solder nozzle, pump, flux unit are suitable for: lead or lead-free process can be adjusted                                                                     8.Sectional plate rack: 2, each plate rack has 2 spring clampsMaximum welding area of circuit board: 265 x 353 mm                                      9.Microprocessor based control unit, liquid crystal display, printer interface, memory capacity                                                                                 10.64 welding procedures.                                                                             11.Operational features: simple, easy to learn, even for unskilled new workers.                                                                                                                             12.The ISO 9000                                                                                                   13.The power consumption is only 2,200 watts, single phase, 230 volts / 50 Hertz

Technical Indicators

  1. Elektrischer Anschluss Electrical connection

Power demand: 230 V / 2,2 kW single-phase electricity, as per CE standard

2.Betriebstemperaturen Operating temperature range

The heating temperature:220 – 280 °C

3.Heat-up time

Heating time: up to 255 ° C in 90 minutes

4.Flux

Flux type: any foaming type of flux

5.Machine

Equipment weight: about 67 kg without filler

6.Solder filling

Solder capacity: about 38 kg, depending on solder alloy proportion

7.Max. solder area:265 x 353 mm

8.Dimensions:1000 x 520 x 300 mm

Panasonic AI spare parts X036-125 LEAD CUTTER (B) X036-124 LEAD CUTTER (A)

Panasonic AI spare parts X036-125 LEAD CUTTER (B) X036-124 LEAD CUTTER (A)

N531CF4A CAMFOLLOWER
104131803405 CUTTER
104131803505 CUTTER
1017951050 PIN
104131103501 ROLLER
N513RSR7-263 LINEAR MOTION UNIT
104691106901 COLLAR
1046925008 PIPE
N310EESX671A PHOTO HIMIC
104691106702 PISTON
X00K04123 SLIDER
X00K04115 SLIDER
X00K04056A TAPE CUTTER
Panasonic AI spare parts X036-125 LEAD CUTTER (B) X036-124 LEAD CUTTER (A)  
X00K04704 MOVING BLADE (B) 35o
N610071334AA FILTER W/OUT FRAME
N506D3 STEEL BALL
XVE2B4FP BOLT

shaoyong@smthelp.com

X004-371-2 X044-001A N610071899AA N610049596AC N610037913AA N610037911AA 1046933000 1046932000 N510038350AA N1FA964002A N990PANA-028 N990PANA-027 N990PANA-022 N990PANA-023 108351000401 108351000501 N210107827AA N210107828AA 1083818062 1041310040 1041310041 X02P96435 N210060115AA N210060116AA N210060117AA X02G51411 X02G51112 N310EESP-051 N610070939AA N610070945AB 104691108901 N610016920AA N210081330AA X01A3702003 X02P51500 1021545-0001 1021545018 102154501901 N513RSR1-255 N610152543AA N610152544AA N510048188AA 104839018901 XXE25D3FP XVE25B4FP 10483S0013 N506D3 10483S0011AA N510004606AA X01L1206001 N641F2843 X01A3700801 X01L51007A X01L51007B X01L5100802 N513RSR7-263 N210172048AB N506D3 N210189397AA N210189398AA N610082092AA N610082093AA N610082094AA N210130982AB N210130983AB N6413243GT6 N6412253GT6 N6411953GT6 N510019399AA N610052042AA N610115312AA X0011091 N610082930AB X01A4200102 N610070945AA N610052034AA N210044349AB 101795101502 N648MB035000 308712300201 1087188151 X02G51111 1087188201 X004-105-9 X01A43016 N510044707AA 1087106008 N643MBS0-024 104305971104 104305972104 N210103579AB X02G37000 N210067114AA N210067115AA N413AXT752A5 KXF02T7AA00 N510017313AA N45200469 104131100803 N5133RSR-A63 108381101201 X01A38092 X01A3803402 X01A38049 N210066470AB N210066471AB N513RHS9-695 104131803503G 108712300602 104132100907 1016318889 1016318101 1016318828G 1016318854 1016318827G 1016318855 101631812701G N414RA101 10163118110 104690909001 104691107704 N510004606AA 1083818062 10461107505 104691107604 104691107205 108381101501 108381101701 N210050981AA N210056708AA N210056710AA N210056711AA X01L1205901 X01A3700801 X01L1205801 N210056251AA N21066472AA N210133978AD N210133976AB N210133984AA 10469S0011 10413100000 10413100001 N555MYA3 1083811020 101632300408 X02G52201 104132101501 102031500101 1020315002 102460903 102071205302 104691107505 N5132RSR-A63 1010461016 1010461017 1087111059 N210130982AB N210130983AB 1016318002 101636110901 1016361110 101636111201 XUC4FP N210081569AA X01A4300901 X01A43015 N210081568AA X02G51111 X02G51112 X01A41340 N210089453AA C02G41003 N610115312AA X0011091 1087110021 102031200508 102031200108 1020719803 N51004606AA 108711105601 1041310028 1041310029 N510036372AA 1046911079 1087111028 108711101201 N210067115AA 102031203802 102031203702 X02P51506 X01A4200102 N210044348AA 104131803405 1016323037 6323037 108712101501 1011368033(新料号1368033) N210057771AA N210028286AA N210028285AA N210044355AA N210044353AA N210050982AA 1010461017 0461017 1010461016 0461016 1041321020 104131803505 N210140534AA N210140533AB 1011368033 1016323037 104691108401 N210033660AA 1046930143 104132102103 N210157799AA X01A38126 X004-105-9 104131001801 104131001901 104131002003 104131002102 1087188201 1087188101 X01A43016 1087106008 N210159205AB N210174738AB N210137682AB N210130368AA N210130369AA N210130370AA 1045418015 1045418016 N21040533AC N21040534AC N210161652AA N3109014SA1 N210133982AA X01A43006 X02G37000 N210161653AB X00K04400C N210067114AA X005329 1020731014 1020731031 1087111052 102073102602 102073102502 102073102901 102073102801 44963002 N210081575AA N210081576AA N210107823AA N5133RSR-A63 104131202603 1087110020G X02651111 104131003802 104131100803 108381101201 104691106106 1041309076 N45200469 N510017341AA X01A38092 X02G41101 1020312007 1083510012 1020312024 1083510014 N513RHS9-695 104131803503G 1041309082 1087111008

Panasonic AI spare parts 1046925008 PIPE

N531CF4A CAMFOLLOWER
104131803405 CUTTER
104131803505 CUTTER
1017951050 PIN
104131103501 ROLLER
N513RSR7-263 LINEAR MOTION UNIT
104691106901 COLLAR
1046925008 PIPE
N310EESX671A PHOTO HIMIC
104691106702 PISTON
X00K04123 SLIDER
X00K04115 SLIDER
X00K04056A TAPE CUTTER
X036-125 LEAD CUTTER (B) X036-124 LEAD CUTTER (A)
X00K04704 MOVING BLADE (B) 35o
N610071334AA FILTER W/OUT FRAME
N506D3 STEEL BALL
XVE2B4FP BOLT

shaoyong@smthelp.com

X004-371-2 X044-001A N610071899AA N610049596AC N610037913AA N610037911AA 1046933000 1046932000 N510038350AA N1FA964002A N990PANA-028 N990PANA-027 N990PANA-022 N990PANA-023 108351000401 108351000501 N210107827AA N210107828AA 1083818062 1041310040 1041310041 X02P96435 N210060115AA N210060116AA N210060117AA X02G51411 X02G51112 N310EESP-051 N610070939AA N610070945AB 104691108901 N610016920AA N210081330AA X01A3702003 X02P51500 1021545-0001 1021545018 102154501901 N513RSR1-255 N610152543AA N610152544AA N510048188AA 104839018901 XXE25D3FP XVE25B4FP 10483S0013 N506D3 10483S0011AA N510004606AA X01L1206001 N641F2843 X01A3700801 X01L51007A X01L51007B X01L5100802 N513RSR7-263 N210172048AB N506D3 N210189397AA N210189398AA N610082092AA N610082093AA N610082094AA N210130982AB N210130983AB N6413243GT6 N6412253GT6 N6411953GT6 N510019399AA N610052042AA N610115312AA X0011091 N610082930AB X01A4200102 N610070945AA N610052034AA N210044349AB 101795101502 N648MB035000 308712300201 1087188151 X02G51111 1087188201 X004-105-9 X01A43016 N510044707AA 1087106008 N643MBS0-024 104305971104 104305972104 N210103579AB X02G37000 N210067114AA N210067115AA N413AXT752A5 KXF02T7AA00 N510017313AA N45200469 104131100803 N5133RSR-A63 108381101201 X01A38092 X01A3803402 X01A38049 N210066470AB N210066471AB N513RHS9-695 104131803503G 108712300602 104132100907 1016318889 1016318101 1016318828G 1016318854 1016318827G 1016318855 101631812701G N414RA101 10163118110 104690909001 104691107704 N510004606AA 1083818062 10461107505 104691107604 104691107205 108381101501 108381101701 N210050981AA N210056708AA N210056710AA N210056711AA X01L1205901 X01A3700801 X01L1205801 N210056251AA N21066472AA N210133978AD N210133976AB N210133984AA 10469S0011 10413100000 10413100001 N555MYA3 1083811020 101632300408 X02G52201 104132101501 102031500101 1020315002 102460903 102071205302 104691107505 N5132RSR-A63 1010461016 1010461017 1087111059 N210130982AB N210130983AB 1016318002 101636110901 1016361110 101636111201 XUC4FP N210081569AA X01A4300901 X01A43015 N210081568AA X02G51111 X02G51112 X01A41340 N210089453AA C02G41003 N610115312AA X0011091 1087110021 102031200508 102031200108 1020719803 N51004606AA 108711105601 1041310028 1041310029 N510036372AA 1046911079 1087111028 108711101201 N210067115AA 102031203802 102031203702 X02P51506 X01A4200102 N210044348AA 104131803405 1016323037 6323037 108712101501 1011368033(新料号1368033) N210057771AA N210028286AA N210028285AA N210044355AA N210044353AA N210050982AA 1010461017 0461017 1010461016 0461016 1041321020 104131803505 N210140534AA N210140533AB 1011368033 1016323037 104691108401 N210033660AA 1046930143 104132102103 N210157799AA X01A38126 X004-105-9 104131001801 104131001901 104131002003 104131002102 1087188201 1087188101 X01A43016 1087106008 N210159205AB N210174738AB N210137682AB N210130368AA N210130369AA N210130370AA 1045418015 1045418016 N21040533AC N21040534AC N210161652AA N3109014SA1 N210133982AA X01A43006 X02G37000 N210161653AB X00K04400C N210067114AA X005329 1020731014 1020731031 1087111052 102073102602 102073102502 102073102901 102073102801 44963002 N210081575AA N210081576AA N210107823AA N5133RSR-A63 104131202603 1087110020G X02651111 104131003802 104131100803 108381101201 104691106106 1041309076 N45200469 N510017341AA X01A38092 X02G41101 1020312007 1083510012 1020312024 1083510014 N513RHS9-695 104131803503G 1041309082 1087111008

Semi-Auto Screen Printer SP-300

Adopts SMC rail and Panasonic speed control motor drive steel squeegee
base to ensure printing steady
The squeegee base can be uplifted 45°, easy to disassemble the squeegee
and clean the screen
The printing base can be move front and rear and fixed to ensure perfect
printing effect
The printing table has groove and location pin, suited for single and doublesided board production
Adopts X.Y.Z axes to align the board by using arm (screen stencil) and
printing table
Microcomputer control, equipped with LCD, user friendly interference and
with counting function.

shaoyong@smthelp.com    WhatsApp+86 137 6048 1664

PCB Size 350 X 1200mm

Printing Area 320 X 1270mm

PCB Fixed System PCB Outer Or Pin Positioning

Frame Size 370X470mm,550X650mm

Adjusting for table Front

Printing Accuracy ±0.05mm

Repeating Accuracy ±0.02mm

PCB Thickness 0.2-2.0mm

Air Source 4-6kg

Power Supply Single Phase 220V, 50/60Hz 100W

Dimension 9009001650mm (LWH)

Net Weight 250KG

1.The printing scraper can rotate 45 degrees of fixed upwards, printing halftone and scraper cleaning and replacement.And the blade can be adjusted before and after, to select the suitable printing position.

2.Using steel net movement, the school edition and printing (PCB) X, Y, Z.Correction fine-tune convenient and quick

3.The combined printing platen has a fixed groove and PIN, easy installation and adjustment, suitable for single, double panel printing..

4.Adopt adjustable speed motor to drive the scraper, ensure the printing precision.

0201 assembly, from difficult to conventional placement

0201 assembly, from difficult to conventional placement

This article explains and discusses the guiding principles governing 0201 placement in both high-volume and high-mix assembly operations.

By Ming Gan,   ming@smthelp.com

Although generally considered to be a relatively recent development, printed circuit boards (PCBs) have been available since the early 1950s. Since then, the demand for smaller, lighter, and faster electronic products has driven electronic components, PCB, and assembly equipment technology toward SMT.
The earliest general acceptance of SMT occurred in the early 1980s, when machines such as the Dynapert MPS-500 and FUJI CP-2 entered the market. At that time, 1206 (3216) resistors and capacitors were the most popular placement components. However, in one or two years, 1206 gave way to 0805 (2125) as the most common component package for SMT placement.
During this time, both machines and components evolved rapidly. As the machine became faster and more flexible, the 0603 (1608) component began to evolve. At this point, many assembly machine manufacturers went back to the R&D, research and development lab to re-evaluate the technology used to accommodate these newer, smaller components. Higher resolution cameras and smaller vacuum nozzles are among the variations that these components bring to the assembly equipment.
The emergence of 0402 (1608) packaging poses further challenges in all aspects of PCB assembly. In terms of machine development, vacuum nozzles have become smaller and more fragile. A new focus is placed on the component’s feeder, which acts as a unit for improvement, giving the machine more accurate parts.
With the advent of 0402 components, process challenges have increased to those that need to be addressed for successful component placement. Solder paste printing becomes even more critical – stencil thickness and solder paste mesh are increasingly important process considerations. The technology required for such placement also involves significant new costs.
The combination of these factors creates a new form of packaging that is the slowest to adopt in the history of the electronics industry. In total, for almost five years, 0402 packaging was widely accepted in the industry – and many assembly plants today never put a 0402 sheet.
Now, I entered 0201.
Over the past year and a half, 0201 placement has been a key topic of discussion throughout the industry. Due to the size, weight and power consumption requirements, many OEM board assemblers need to incorporate even smaller components and technologies into their products. Contract manufacturers (CM, contract manufacturer) must also have new technologies to keep the assembly process up to date and provide customers with a complete range of services. For machine builders, the challenge is to develop more resistant to obsolete assembly equipment in an era of dynamic technological change.

0201 placement challenge
The placement of the 0201 component is more challenging than the component intervention in front of it. The main reason is that the 0201 package is approximately one-third of the corresponding 0402 size.
The previously acceptable machine placement accuracy immediately became a limitation of the introduction of 0201. In addition, the traditional industrial tapeding specification allows for too much movement for reliable 0201 placement, and the level of process control must be increased to make the 0201 placement a production reality.
Although these obstacles are very large, they are far from insurmountable. Of course, they need all the determination, because the technology necessary for the 0201 placement requires a lot of money and top management’s promise of research and development (R&D).

The key to reliable 0201 placement
At FUJI, the aggressive R&D program has produced the ability to make all circuit assembly machines compatible with 0201 at 100% speed, with a minimum suction reliability of 99.90%, a target suction reliability of 99.95%, and minimal placement reliability. It is 99.99%. In the beginning, every aspect of the design was evaluated for its ability to work on a complete 0201 program, and the combination of single elements of closely related machine component parameters proved critical to success. These parameters include:

Figure 1 Component feeder table. The R&D program concluded that the ability to precisely position the carriage table – and make minimal adjustments to compensate for the inaccuracy of the tape – is a key factor in achieving component pickup reliability above 99.95%.

To achieve this, the feeder table must be precision machined to ensure repeatable positioning of the individual feeders and combined with a high-resolution semi-closed-cycle servo system using a two-track linear moving guide. This design allows for minor adjustments – based on the results of the suction accuracy as judged by the vision system. This ensures that the component is as close as possible to the center.
Component feeder. The feeder must be manufactured to extremely tight tolerances to ensure repeatability of the suction position, regardless of component height and a large number of possible component positions. The mechanism used to position and lock the feeder in position must be durable and precise, yet be user friendly. In addition, the materials used to make the feeder must be high in strength and light in weight to allow for ergonomic operation while ensuring precise, repeatable delivery of the carrier tape.
The feeder drives the sprocket. The drive sprocket plays a key role in the ability of the machine to position the component tape. The shape, taper and length of the drive sprocket teeth significantly affect the ability of the feeder to position the tape. Other factors have also been investigated, such as the diameter of the drive sprocket and the number of belts in contact with the sprocket. Changes to the basic sprocket design resulted in improved positioning accuracy, with earlier designs increasing by 20% in the X direction and 50% in the Y direction.


Figure 2 sucks the head. After properly feeding the component, the next step is to draw the component onto the vacuum nozzle and bring it to the board. Vacuum nozzles are compliant to absorb shock during pick-and-place components, compensate for small variations in solder paste height, and reduce the risk of component breakage. For these reasons, the nozzle must be able to move within its fixture.


Material selection, material hardness, machining tolerances, and thermal characteristics must all be understood to construct a reliable suction head. The nozzle must move freely within its holder without sacrificing accuracy (Figure 1).
The nozzle shaft is assembled. The nozzle shaft is also a key design element – eliminating overdrive by keeping the entire nozzle in direct alignment with the shaft assembly. Overpressure is caused by the inertia generated when the head is moved up and down. If the nozzle and the shaft are not in a straight line, there is a little whip – or overpressure. Overpressure causes a change in positioning accuracy, which is determined by the speed of movement, the weight of the nozzle, and the weight of the component. By eliminating overpressure, direct alignment reduces the number of negative factors associated with component pick-and-place placement (Figure 2).
Figure 3 nozzle design. Variations in the design of the nozzle are an important factor in allowing the 0201 component to be received. In order to draw a 0.6×0.3 mm component, the nozzle must have an outer diameter of no more than 0.40 mm. This forms a long, thin nozzle shaft that is fragile but must also maintain precision to maintain high reliability of suction. Changes from the linear axis to the tapered design increase the nozzle strength and allow the nozzle to resist bending (Figure 3).
Matrix structure. All machines generate vibrations during operation. The base frame design is a key first step in reducing the speed and motion effects of vibration and harmonic resonance. By using a cast iron base frame and state-of-the-art structural technology, vibration and harmonic resonance can be reduced to a controllable level within the machine, so that negative effects can be dealt with.
Up to standard
Through all six key factors, the obstacles to reliable 0201 placement have been eliminated. As a result, R&D’s focus has shifted to newer, smaller components, and 0201 is no longer considered a leading edge component packaging technology.
For 0201 component placement, the accepted process window is approximately 75 μm X and 75 μm Y at 3 。. To achieve 6 贴 placement reliability, the X and Y tolerances must be reduced to 50 μm. The latest high-speed placement equipment has a rating of 66μm with an actual standard deviation of approximately 35~45μm. As the 0201 component becomes more widely used and the manufacturing process becomes tighter, improved accuracy can be achieved.
The difference in component size between suppliers poses a challenge to 0201 feeding and placement. Bulk feeding is being opened and should be available in 2001.
Although the machine now has this capability, only a small percentage of users will be ready to take the 0201 placement in the next 12 to 24 months. This is similar to the introduction of a ball grid array (BGA) and 0402 components, in which the machine’s capabilities are ahead of the process state.

Challenge ahead
While the placement of 0201 components is now a standard feature of new placement equipment, additional work is needed to improve the overall process for the end user. The relationship between machine builders, component suppliers, board manufacturers, formwork factories, and solder paste manufacturers needs to be strengthened to create a more seamless development process. The end result will be a unified understanding of the process and a better working relationship that will benefit end users, especially by making new production technologies faster and more efficient.

By Ming Gan, ming@smthelp.com

DEK GRAPHITE CAMERA 191010 191610 198040 198810 8008629 8012979 DEK GREEN CAMERA 191011 191641 198041 198811 8008630 8012980 DEK GOLD CAMERA 191012 191642 198042 198812 8008632 8012982 DEK HAWKEYE CAMERA 191013 191643 198043 198813 8008633 8008634

DEK GRAPHITE CAMERA 191010 191610 198040 198810 8008629 8012979
DEK GREEN CAMERA 191011 191641 198041 198811 8008630 8012980
DEK GOLD CAMERA 191012 191642 198042 198812 8008632 8012982
DEK HAWKEYE CAMERA 191013 191643 198043 198813 8008633 8008634

shaoyong@smthelp.com

Professional DEK Board Clamp 137516 D-5157438 DEK Spare Parts

Professional DEK Board Clamp 137516 D-5157438 DEK Spare Parts 

shaoyong@smthelp.com

Specifications

BrandPart NameModellead timeDescription
DEKBoard Clamp1375163daysnew
UsageFor SMT Printer Machine

140375 X F ACTUATOR ( TXT ) 1
140376 X F ACTUATOR ( TXT ) 1
140377 Y F ACTUATOR ( TXT ) 1
133127 X’ CAMERA MOTOR 2
133128 CAMERA ‘Y’ MOTOR (WITH CONNECTORS) 1
145520 CAMERA ‘Y’ MOTOR 1
140737 MOTOR RISING TABLE 1
145515 CAMERA ‘Y’ BELT 2
137037 SCB 46 BRIDGE DRIVER 3
145116 PCADADIO CARD (DIFFERENTIAL I/P) 1
190642 BELT^TIMING^^15T5/390 1
112246 PHOTO SNESOR PM-53B 5
129926 SQUEEGEE BLADE METAL 350MM 8
107682 STEP DRIVE PCB (GRADE FR4 LAMINATE 1
112389 SCB 40 PCB 2
107686 SCB9 OPTO ISOLATOR I/P PCB 2
107689 40 CHANNEL DIGITAL I/O PCB 2
145014 EUROSYSTEM CONTROLLER RS485 16MHZ 4
117933 117933 I.C. , STEPPER DRIVE CARD 1
114025 EUROAMP 10 CARD UL 2
107758 TOOLING 30
145520 dek camera y motor 1
160706 dek camera y motor 4
160708 RISING TABLE SERVO MOTOR
185003 MOTOR^CAMERA Y^(BG65X50-CI)^WITH 7.66:1 GEARBOX 1
185002 MOTOR^CAMERA X^(BG65X50-CI)^WITH 7.66:1 GEARBOX 2
145817 CAMERA ‘X’ MOTOR AT/20′ /
160704 CAMERA X SERVO MOTOR 3
191492 BOM^ASSY.^MOTOR^RISING TABLE 1
188962 BOM^MOTOR^DRIVE^PRINT CARRIAGE
160457 cluch
183388 in or out pcb sensor 7
188317 BOM^LOOM^CAMERA CARRIAGE SIGNALS 1
185253 NEXTMOVE ES USB 6 STEP CONTROLLER(TXT) 1
165675 CYLINDER 4 STROKE 20 BORE ( TXT ) 7
157731 FRONT RAIL MOTOR & LOOM ASSEMBLY
185463 DESC:ACTUATOR^STEPPER^CHASE^ALIGNMENT 0
183452 pressure sensor
181452 BOM^PAPER CLEAN MOTOR 3
193377 boRAD STOPper 3
193408 1394 CABle 1
5157438 CLAMP BORAD 4
145014 X3 X4EUROSTEP CONTROLLER RS485 16MHZ 2
145015 X1 X2EUROSYSTEM CONTROLLER RS485 16MHZ EA 2
160903 VISION CARD(lt gsx) 1
160555 SMPSU,650W WIDE RANGE I/P 3
191088 183390 BOM^SOLVENT PUMP^USC 15
137516 CLAMP BORAD
185512 DUAL STEPPER CARD 1
185020 NEXT MOVE ES INTERFACE CARD 1
142253 CAN CONTROL CARD (MULTIMOVE) IO ( TXT ) 1
191650 CAMERA SENSOR 3
156039 1
191103 RISING TABLE MOTOR CONTROLLER 1
191650 PHOTO SENSOR EE-SX675 4
181322 DEK ela camera 1
198043 DEK I camera
198041 DEK I camera